JPH0275771U - - Google Patents
Info
- Publication number
- JPH0275771U JPH0275771U JP15570988U JP15570988U JPH0275771U JP H0275771 U JPH0275771 U JP H0275771U JP 15570988 U JP15570988 U JP 15570988U JP 15570988 U JP15570988 U JP 15570988U JP H0275771 U JPH0275771 U JP H0275771U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- hole
- center
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は第１図の実施例の要部である金属板の斜視図、
第３図は従来の印刷配線板の縦断面図である。
１……金属板、２……スルーホール、３……印
刷配線基板、４……実装部品のリード、５……半
田、６……ばね部。
FIG. 1 is a vertical sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of a metal plate which is the main part of the embodiment of FIG. 1,
FIG. 3 is a longitudinal sectional view of a conventional printed wiring board. 1...Metal plate, 2...Through hole, 3...Printed wiring board, 4...Lead of mounted component, 5...Solder, 6...Spring part.
Claims (1)
に向つて求心状に配置された複数のばねを設けた
金属板と、印刷配線基板のパターン上に設けられ
たスルーホールとを備え、前記スルーホールに前
記金属板の中央の穴を合致するように取り付けた
前記金属板により部品リードを固定することを特
徴とする印刷配線板。 A metal plate provided with a plurality of springs arranged centripetally toward the center around a hole provided in the center of a highly conductive plate, and a through hole provided on a pattern of a printed wiring board, A printed wiring board characterized in that a component lead is fixed by the metal plate attached so that the through hole matches the center hole of the metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570988U JPH0275771U (en) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15570988U JPH0275771U (en) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275771U true JPH0275771U (en) | 1990-06-11 |
Family
ID=31433582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15570988U Pending JPH0275771U (en) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275771U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (en) * | 1993-11-26 | 1995-06-06 | Nec Corp | Connection fitting for hic module to be mounted |
-
1988
- 1988-11-29 JP JP15570988U patent/JPH0275771U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147471A (en) * | 1993-11-26 | 1995-06-06 | Nec Corp | Connection fitting for hic module to be mounted |