JPH07147471A - Connection fitting for hic module to be mounted - Google Patents

Abstract

PURPOSE:To prevent the generation of cracks by the difference in electric characteristics caused by the difference in workmanship, and thermal stress in the connection structure of a HIS module to be mounted and a substrate. CONSTITUTION:A part of the metal of a cylinder is notched, the inside diameter of the cylinder is smaller than the inside diameter of a HIC module, and as a result, the lead 2 of the HIC and a connection fitting 1 are supported by the springiness of the connection fitting. The HIC module and a substrate are electrically connected by soldering the circumference of the connection fitting 1 and the substrate 3. When the lead of the HIC module is expanded or contracted by heat, the lead is not subjected to stress by slipping in the connection fitting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The connection metal fitting of the present invention relates to the structure of the connection between the HIC module of a communication device for mounting an artificial satellite and a board, and more particularly to the connection metal fitting for the mounting HIC module.

[0002]

2. Description of the Related Art Conventionally, a connection between a HIC module and a substrate or the like is made by connecting a ribbon as shown in FIG.
Those that directly solder the lead of the C module and the board,
After passing the circular metal fitting through the lead of the HIC module, three methods of soldering the board and the metal fitting have been adopted.

[0003]

According to the conventional method of connecting the HIC module and the substrate with the ribbon, the ribbon is a very small and thin metal piece and is deformed and soldered to prevent the ribbon from being cut due to thermal stress. There is a problem that mounting is difficult because it must be done, a difference in workmanship is likely to occur, and characteristics are electrically deteriorated.

Further, the method of directly soldering the leads of the HIC module and the substrate has electric characteristics, but has a problem that cracks may occur in the soldered portions due to thermal stress.

Further, in the method of connecting through a circular metal fitting, since it is a thin metal fitting piece, it is not easy to handle, it is difficult to align when passing through the leads of the HIC module, and above all, it has a complicated shape, so the manufacturing cost is high. There was a problem that it took.

[0006]

The connection fitting of the present invention has a spring property and has a structure in which a part of a cylindrical metal is cut out. The inner diameter of the cylinder is smaller than the lead diameter of the HIC module, and when the connection fitting is passed through the lead, the lead and the connection fitting are electrically connected by the spring property of the connection fitting. In addition, the connection fitting is a metal tube and is easy to handle.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the drawings. FIG. 1 shows a connecting portion between a HIC module and a board using the connecting fitting of the present invention. FIG. 2 is an enlarged view of the connection part, in which the connection fitting of the present invention is passed through the leads of the HIC module protruding through the housing and the board, and the periphery of the connection fitting and the board-shaped conductor are soldered. is there.

The HIC module and the connecting fitting have an inner diameter smaller than that of the lead of the HIC module.
Further, since it has a spring property, it is electrically connected.

[0009]

EFFECTS OF THE INVENTION The connection fitting of the present invention has a shape in which a part of a cylindrical metal is cut out, so that it is easy to manufacture, so that not only the cost is reduced, but also it is not necessary to deform it at the time of mounting. Since it is only passed through the leads of the HIC module and the periphery is soldered, there is an effect that there is no difference in workmanship. In terms of performance, since the HIC module lead is held by the inner diameter of the connection fitting that has a spring property, when the lead of the HIC module expands and contracts due to heat, the lead slides in the connection fitting. It has the effect of not giving stress.

[Brief description of drawings]

FIG. 1 is a view showing a connecting portion between a HIC module and a substrate using a connecting fitting of the present invention.

FIG. 2 is an enlarged view of a connecting portion using the connecting fitting of the present invention.

FIG. 3 is an enlarged view of a conventional connecting portion.

[Explanation of symbols]

 1 Connection Metal Fitting of the Present Invention 2 Lead of HIC Module 3 Board 4 Housing 5 Solder 6 Ribbon 7 Conventional Connection Metal Fitting 8 HIC Module Main Body

Claims (1)

[Claims] 1. A mounting device, characterized in that a cylindrical metal is cut out at a connecting portion between a HIC module and a substrate so as to have a spring property, and an inner diameter of the cylinder is smaller than a lead of the HIC module. Connection fitting for HIC module.