JPH0274057A - Structure of semiconductor device - Google Patents

Abstract

PURPOSE:To enable the packaging of a comparatively large number of components, to protect the packaged components against damage when resin molding is executed, and also to enable the execution of the resin molding at a high speed by a method wherein the whole of a substrate, a lead frame, and a conductor is resin-molded through an injection molding or the like. CONSTITUTION:As an electronic component packaging part is provided also onto an upper end face 13a of a lead frame 13, a comparatively large number of electronic components 12 and 14 are packaged on the base area of a semiconductor device 10. And, as the heat of the electronic component 14 packaged on the upper end face 13a of the lead frame 13 is dissipated from the lead frame 13, the electronic component 14 is protected against damage even if it is soldered at a comparatively high temperature. Moreover, as a second substrate 15 of a conductor covers the electronic component 12 when a resin molding is performed, these electrode components 12, 14, and others are free from the effect of the temperature and the pressure of the resin poured from a gate 15. Therefore, a resin molding can be rapidly performed.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the structure of a semiconductor device comprising various electronic components mounted on a substrate.

[Prior Art] Generally, in a so-called hybrid IC in which various electronic components such as semiconductor chips such as LED chips and circuit elements are mounted on a substrate, first, as shown in Fig. 3, an aluminum printed circuit board is mounted. After various electronic components 2 are mounted by soldering or the like, the whole is molded in resin 3 by so-called transfer molding, thereby producing a semiconductor device 4 such as a high-print IC.

[Problem that the invention seeks to solve]

However, in the semiconductor device 4 configured as described above, the mounting area for the electronic components 2 is limited, and the number of electronic components 2 that can be mounted is relatively small. In the area corresponding to the vicinity of the gate 5 for injecting resin, the resin temperature and resin pressure during resin injection, that is, the flow velocity, directly affects the mounted components 2, so relatively weak components, such as gold wire soldering, are not used. LEDs and the like that have a part or a low-temperature solder part cannot be placed in the vicinity of the gate 5, and furthermore, transfer molding must be performed to match the mounting components, so if the semiconductor device is of different types, Since the transfer molding conditions change, it is not possible to perform transfer molding of a plurality of types of semiconductor devices under the same conditions, which poses a problem in terms of productivity.

In view of the above points, the present invention provides a semiconductor device in which a relatively large number of components can be mounted, the mounted components are not destroyed during resin molding, and resin molding can be performed quickly. It is intended to.

[Means and actions for solving the problem] The above purpose is to
According to the present invention, after mounting various electronic components on the board,
In a semiconductor device constructed entirely by resin molding, III! i, a plurality of lead frames each formed to rise upward from the periphery of the board in a crank shape, electronic components such as paired chips mounted on the upper end surface of the lead frames, and electronic components such as paired chips mounted on the board. and a conductor attached to the upper surface of the electronic component at the upper end of the lead frame so as to be parallel to the upper end of the lead frame. This is achieved by the structure of the semiconductor device.

According to this invention, since the portion where electronic components and the like are to be mounted is also provided on the upper end surface of the lead frame, a relatively large number of components can be mounted relative to the bottom area of the semiconductor device, and the lead Since electronic components to be mounted on the upper end surface of the frame are heat-dissipated by the lead frame, even if they are mounted on the self-defense lead frame by relatively high temperature soldering, the child components will not destroy the tti.Moreover, the resin molded In this case, since the conductor covers the electronic components mounted on the board, these electronic components are not affected by the temperature and pressure of the resin flowing from the gate, and therefore It is now possible to perform resin molding not only by transfer molding, but also by relatively rough molding methods such as injection molding, and even when manufacturing different types of semiconductor devices, molding can be performed at high speed under the same conditions. This will significantly improve productivity.

〔Example〕

Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.

FIG. 1 shows an embodiment of a semiconductor device according to the present invention. The semiconductor device, for example, a hybrid rC1O, has various electronic components 12 mounted on an aluminum printed circuit board 11 at predetermined positions, and After placing a plurality of crank-shaped lead frames 13 on the periphery so as to rise substantially vertically upward, the electronic components 12 and lead frames 13 are soldered to the base Fi11.

As described above, the electronic components 12 and the lead frame 13 are soldered to the board ll.
After electrical connection is made between the lead frame 13 and each lead frame 13 by wire bonding or the like, each lead frame 13
As shown in the figure, an electronic component 14 such as a pair of chips is placed on the upper end surface 13a rising upward and soldered at a relatively high temperature. At this time, since heat is radiated from the electronic component 14 via the lead frame 13, the electronic component 14 will not be destroyed by the heat of soldering.

After the electronic component 14 is mounted on the upper end surface 13a of the lead frame 13 in this manner, the second substrate 15, which is a conductor, is attached to the upper surface of the electronic component 14 so as to be substantially parallel to the substrate 11.

Here, as in the case of the conventional semiconductor device shown in FIG. 15, the electronic component 12 is covered by the second substrate 15 and is protected from the resin flowing in from the gate 16, thereby preventing the electronic component 12 from coughing...
It is not affected by the temperature and pressure of the fat.

Further, electronic components 14 such as paired chips mounted on the upper end surface of the lead frame 13 radiate heat through the lead frame 13 and the second substrate 15, and the second substrate 15
Therefore, in the above example, there is no need to strictly set the resin temperature and pressure during resin molding, and manufacturing Semiconductor device 1f
Even if the type of IO is different, it is possible to perform resin molding under the same molding conditions. Therefore, even if molding methods such as injection molding, which have had a relatively large effect on conventional mounted parts, semiconductor devices 10 can be molded. It is possible to manufacture Thus, the semiconductor device, i.e. the hybrid ICl
0 is completed.

The embodiment of the present invention is constructed as described above, and the portion where electronic components etc. are to be mounted is located on the upper end surface 13 of the lead frame 13.
Since the electronic components 12 and 14 are also provided in the bottom area of the semiconductor device 10, a relatively large number of electronic components 12 and 14 can be mounted on the bottom area of the semiconductor device 10. Furthermore, since the electronic component 14 to be mounted on the upper end surface 13a of the lead frame 13 is radiated by the lead frame 13, even if it is mounted on the lead frame 3 by relatively high temperature soldering, the electronic component I4 will be destroyed. There's nothing to do. When using a resin mold,
Since the second group Fi+5, which is a conductor, covers the electronic component 12 mounted on the first substrate 11,
These electronic components 12, 14, etc. are not affected by the temperature or pressure of the resin flowing in from the gate 16, and therefore can be processed not only by conventional transfer molding but also by relatively rough molding methods such as injection molding. It is now possible to perform resin molding for different types of semiconductor devices.
Even when manufacturing O, molding can be performed at high speed under the same conditions.

[Effects of the Invention] As described above, according to the present invention, in a semiconductor device configured by mounting various electronic components on a substrate and then molding the entire body with resin, In addition, a plurality of lead frames are each formed to rise upward from the periphery of the board in a crank shape, and electronic components such as paired chips mounted on the upper end surface of the lead frames are mounted parallel to the board. A second board, which is a conductor, is attached to the upper surface of the electronic component at the upper end of the lead frame, and the entire board, lead frame, and second board are molded into a resin mold by injection molding or the like. Since the semiconductor device is configured by the above-mentioned structure, the portion where electronic components and the like are to be mounted is also provided on the upper end surface of the lead frame, so a relatively large number of components can be mounted relative to the bottom area of the semiconductor device. Furthermore, since the electronic components to be mounted on the upper end surface of the lead frame radiate heat through the lead frame, even if the electronic components are mounted on the lead frame by relatively high temperature soldering, the electronic components will not be destroyed. do not have.

Moreover, during resin molding, the second board covers the electronic components mounted on the first board, so these electronic components are subject to the temperature and pressure of the resin flowing in from the gate. Therefore, resin molding can be performed not only by conventional transfer molding but also by relatively rough molding methods such as injection molding, even when manufacturing different types of semiconductor devices. Molding can be performed at high speed under the same conditions, significantly improving productivity.

Thus, according to the present invention, an extremely excellent structure of a semiconductor device is provided in which a relatively large number of components can be mounted, the mounted components are not destroyed during resin molding, and resin molding can be performed quickly. can be provided.

[Brief explanation of the drawing]

FIG. 1 is a schematic sectional view showing an embodiment of the semiconductor device according to the present invention in a state before resin molding, and FIG. 2 is a schematic sectional view showing the semiconductor device of FIG. 1 in a completed state. FIG. 3 shows an example of a conventional semiconductor device, in which (A) is a schematic sectional view showing the state before resin molding, and (B) is a schematic sectional view showing the completed state. 10... Semiconductor device: 11... Substrate; 12...
Various electronic components: 13... Lead frame; 13a.
...Top end surface; 14...Electronic component; 15...Second substrate: 16...Gate. Patent applicant: Stanley Electric Co., Ltd. Representative: Patent attorney Hirayama - Muroma: Patent attorney Yasuzo Kaizu

Claims (1)

[Claims] (1) In a semiconductor device constructed by mounting various electronic components on a substrate and molding the entire body with resin, each of the semiconductor devices is arranged on the periphery of the substrate and rises upward from the periphery of the substrate in a crank shape. a plurality of lead frames formed on the lead frame; electronic components such as bare chips mounted on the upper end surface of the lead frame;
and a conductor attached to the upper surface of the electronic component at the upper end of the lead frame so as to be parallel to the substrate, and the entire substrate, lead frame, and conductor are resin-molded by injection molding or the like. A structure of a semiconductor device, characterized in that it is configured by: