JPH0274048A - 微小部品位置決め装置および方法 - Google Patents

微小部品位置決め装置および方法

Info

Publication number
JPH0274048A
JPH0274048A JP22593688A JP22593688A JPH0274048A JP H0274048 A JPH0274048 A JP H0274048A JP 22593688 A JP22593688 A JP 22593688A JP 22593688 A JP22593688 A JP 22593688A JP H0274048 A JPH0274048 A JP H0274048A
Authority
JP
Japan
Prior art keywords
workpiece
processing tool
microscope
scale plate
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22593688A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573340B2 (enExample
Inventor
Mitsukiyo Tani
光清 谷
Mamoru Kobayashi
守 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP22593688A priority Critical patent/JPH0274048A/ja
Publication of JPH0274048A publication Critical patent/JPH0274048A/ja
Publication of JPH0573340B2 publication Critical patent/JPH0573340B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP22593688A 1988-09-09 1988-09-09 微小部品位置決め装置および方法 Granted JPH0274048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22593688A JPH0274048A (ja) 1988-09-09 1988-09-09 微小部品位置決め装置および方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22593688A JPH0274048A (ja) 1988-09-09 1988-09-09 微小部品位置決め装置および方法

Publications (2)

Publication Number Publication Date
JPH0274048A true JPH0274048A (ja) 1990-03-14
JPH0573340B2 JPH0573340B2 (enExample) 1993-10-14

Family

ID=16837218

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22593688A Granted JPH0274048A (ja) 1988-09-09 1988-09-09 微小部品位置決め装置および方法

Country Status (1)

Country Link
JP (1) JPH0274048A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008004899U1 (de) * 2008-04-09 2009-08-20 Sick Ag Frontscheibenelement und Sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008004899U1 (de) * 2008-04-09 2009-08-20 Sick Ag Frontscheibenelement und Sensor

Also Published As

Publication number Publication date
JPH0573340B2 (enExample) 1993-10-14

Similar Documents

Publication Publication Date Title
US6449516B1 (en) Bonding method and apparatus
US4557599A (en) Calibration and alignment target plate
KR100619471B1 (ko) 본딩 장치
CN100435303C (zh) 用于对准芯片焊接机的焊接头的方法
JP7112341B2 (ja) 実装装置および実装方法
JP7293477B2 (ja) 実装装置
JP5663847B2 (ja) 較正治具及び較正方法
WO2019013274A1 (ja) 第１物体を第２物体に対して位置決めする装置及び方法
WO2020153203A1 (ja) 実装装置および実装方法
CN1258809C (zh) 对准方法及装置
US5764366A (en) Method and apparatus for alignment and bonding
CN119008454A (zh) 一种键合装置
EP0989601B1 (en) Method of and apparatus for bonding component
KR20030005372A (ko) 칩 실장 장치 및 그 장치에 있어서의 얼라인먼트 방법
US5561386A (en) Chip tester with improvements in handling efficiency and measurement precision
KR20150113130A (ko) 실장 방법 및 실장 장치
JPH0274048A (ja) 微小部品位置決め装置および方法
JP2004128384A (ja) 部品実装装置および部品実装方法
JPH0536768A (ja) プローブ装置
JP4264403B2 (ja) ボンディング装置
CN100401014C (zh) 线宽测量装置
KR20000032388A (ko) 평면브라운관 제조용 마스크/패널 접합장치
JPH06334022A (ja) 半導体位置決め方法
JPH07283272A (ja) 電子部品搭載装置
JP4487700B2 (ja) 近接露光装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees