JPH0268448U - - Google Patents
Info
- Publication number
- JPH0268448U JPH0268448U JP14741188U JP14741188U JPH0268448U JP H0268448 U JPH0268448 U JP H0268448U JP 14741188 U JP14741188 U JP 14741188U JP 14741188 U JP14741188 U JP 14741188U JP H0268448 U JPH0268448 U JP H0268448U
- Authority
- JP
- Japan
- Prior art keywords
- plate material
- alloy
- thin plate
- circuit
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 2
- 229910000927 Ge alloy Inorganic materials 0.000 claims 1
- 229910000676 Si alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988147411U JPH0723964Y2 (ja) | 1988-11-11 | 1988-11-11 | 半導体装置用軽量基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988147411U JPH0723964Y2 (ja) | 1988-11-11 | 1988-11-11 | 半導体装置用軽量基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0268448U true JPH0268448U (zh) | 1990-05-24 |
JPH0723964Y2 JPH0723964Y2 (ja) | 1995-05-31 |
Family
ID=31417786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988147411U Expired - Lifetime JPH0723964Y2 (ja) | 1988-11-11 | 1988-11-11 | 半導体装置用軽量基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0723964Y2 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002059272A (ja) * | 2000-08-11 | 2002-02-26 | Mitsubishi Materials Corp | セラミック粉末層を介在させたAl複合材及びその製造方法 |
EP1187198A2 (en) | 2000-09-04 | 2002-03-13 | Dowa Mining Co., Ltd. | Metal-ceramic circuit board and manufacturing method thereof |
JP2005503039A (ja) * | 2001-08-31 | 2005-01-27 | シーメンス アクチエンゲゼルシヤフト | パワー電子ユニット |
JP4649027B2 (ja) * | 1999-09-28 | 2011-03-09 | 株式会社東芝 | セラミックス回路基板 |
JP2013179374A (ja) * | 2008-03-17 | 2013-09-09 | Mitsubishi Materials Corp | パワーモジュール用基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121890A (ja) * | 1982-12-28 | 1984-07-14 | 株式会社東芝 | セラミツクスと金属との接合体 |
JPS6071579A (ja) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | アルミナと金属との接合方法 |
-
1988
- 1988-11-11 JP JP1988147411U patent/JPH0723964Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59121890A (ja) * | 1982-12-28 | 1984-07-14 | 株式会社東芝 | セラミツクスと金属との接合体 |
JPS6071579A (ja) * | 1983-09-28 | 1985-04-23 | 株式会社日立製作所 | アルミナと金属との接合方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4649027B2 (ja) * | 1999-09-28 | 2011-03-09 | 株式会社東芝 | セラミックス回路基板 |
JP2002059272A (ja) * | 2000-08-11 | 2002-02-26 | Mitsubishi Materials Corp | セラミック粉末層を介在させたAl複合材及びその製造方法 |
JP4556307B2 (ja) * | 2000-08-11 | 2010-10-06 | 三菱マテリアル株式会社 | パワーモジュール及びパワーモジュール用緩衝材の製造方法 |
EP1187198A2 (en) | 2000-09-04 | 2002-03-13 | Dowa Mining Co., Ltd. | Metal-ceramic circuit board and manufacturing method thereof |
EP2214202A2 (en) | 2000-09-04 | 2010-08-04 | Dowa Metaltech Co., Ltd. | Metal-ceramic circuit board |
JP2005503039A (ja) * | 2001-08-31 | 2005-01-27 | シーメンス アクチエンゲゼルシヤフト | パワー電子ユニット |
JP2013179374A (ja) * | 2008-03-17 | 2013-09-09 | Mitsubishi Materials Corp | パワーモジュール用基板 |
Also Published As
Publication number | Publication date |
---|---|
JPH0723964Y2 (ja) | 1995-05-31 |
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