JPH0263306B2 - - Google Patents

Info

Publication number
JPH0263306B2
JPH0263306B2 JP577884A JP577884A JPH0263306B2 JP H0263306 B2 JPH0263306 B2 JP H0263306B2 JP 577884 A JP577884 A JP 577884A JP 577884 A JP577884 A JP 577884A JP H0263306 B2 JPH0263306 B2 JP H0263306B2
Authority
JP
Japan
Prior art keywords
gas
dielectric film
processed
workpiece
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP577884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60150632A (ja
Inventor
Tsunemasa Tokura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP577884A priority Critical patent/JPS60150632A/ja
Publication of JPS60150632A publication Critical patent/JPS60150632A/ja
Publication of JPH0263306B2 publication Critical patent/JPH0263306B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
JP577884A 1984-01-18 1984-01-18 被処理物の離脱装置 Granted JPS60150632A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP577884A JPS60150632A (ja) 1984-01-18 1984-01-18 被処理物の離脱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP577884A JPS60150632A (ja) 1984-01-18 1984-01-18 被処理物の離脱装置

Publications (2)

Publication Number Publication Date
JPS60150632A JPS60150632A (ja) 1985-08-08
JPH0263306B2 true JPH0263306B2 (enrdf_load_stackoverflow) 1990-12-27

Family

ID=11620562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP577884A Granted JPS60150632A (ja) 1984-01-18 1984-01-18 被処理物の離脱装置

Country Status (1)

Country Link
JP (1) JPS60150632A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997962A (en) * 1995-06-30 1999-12-07 Tokyo Electron Limited Plasma process utilizing an electrostatic chuck
KR100267418B1 (ko) 1995-12-28 2000-10-16 엔도 마코토 플라스마처리방법및플라스마처리장치
JP4786693B2 (ja) 2008-09-30 2011-10-05 三菱重工業株式会社 ウェハ接合装置およびウェハ接合方法

Also Published As

Publication number Publication date
JPS60150632A (ja) 1985-08-08

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