JPH0260268U - - Google Patents
Info
- Publication number
- JPH0260268U JPH0260268U JP14058488U JP14058488U JPH0260268U JP H0260268 U JPH0260268 U JP H0260268U JP 14058488 U JP14058488 U JP 14058488U JP 14058488 U JP14058488 U JP 14058488U JP H0260268 U JPH0260268 U JP H0260268U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- insulating stone
- semiconductor device
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004575 stone Substances 0.000 claims 3
- 239000011521 glass Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案の第１の実施例の縦断面図、第
２図は本考案の第２の実施例の縦断面図、第３図
は従来の光半導体装置の一例の縦断面図である。
１０１，２０１，３０１……金属ステムベース
、１０２，２０２，３０２，１０３，２０３，３
０３……外部導出リード、１０４，２０４，３０
４……ガラス、１０５，２０５，３０５……発光
素子、１０６，２０６，３０６……ヒーシング、
１０７，２０７，３０７……金属細線、１０８，
２０８，３０８……外部導出リード、１０９，２
０９，３０９……絶縁基板、１１０……金属板、
１１１，２１１，３１１……受光素子、１１２，
２１２，３１２，３１３……金属細線。
FIG. 1 is a vertical cross-sectional view of a first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a second embodiment of the present invention, and FIG. 3 is a vertical cross-sectional view of an example of a conventional optical semiconductor device. be. 101,201,301...metal stem base, 102,202,302,103,203,3
03... External lead, 104, 204, 30
4...Glass, 105,205,305...Light emitting element, 106,206,306...Heathing,
107,207,307...Thin metal wire, 108,
208,308...external lead, 109,2
09,309...Insulating substrate, 110...Metal plate,
111, 211, 311...light receiving element, 112,
212, 312, 313...Thin metal wire.
Claims (1)
が金属ステムベースに対して角度をもつて取付け
られている小型光半導体装置に於いて、前記受光
素子が該受光素子を前記金属ステムベースから絶
縁するための絶縁石と該絶縁石と前記受光素子と
の間に設けられた金属板と前記絶縁石表面に形成
された金属化層とのうちいずれか一方を介して外
部導出リードに取付けられていることを特徴とす
る小型光半導体装置。 In a small optical semiconductor device that houses a light-emitting element and a light-receiving element, and in which the light-receiving element is attached at an angle to a metal stem base, the light-receiving element insulates the light-receiving element from the metal stem base. an insulating stone, a metal plate provided between the insulating stone and the light-receiving element, and a metallized layer formed on the surface of the insulating stone; A compact optical semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058488U JPH0260268U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14058488U JPH0260268U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260268U true JPH0260268U (en) | 1990-05-02 |
Family
ID=31404891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14058488U Pending JPH0260268U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260268U (en) |
-
1988
- 1988-10-27 JP JP14058488U patent/JPH0260268U/ja active Pending
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