JPS648760U - - Google Patents
Info
- Publication number
- JPS648760U JPS648760U JP1987101484U JP10148487U JPS648760U JP S648760 U JPS648760 U JP S648760U JP 1987101484 U JP1987101484 U JP 1987101484U JP 10148487 U JP10148487 U JP 10148487U JP S648760 U JPS648760 U JP S648760U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- substrate
- wiring pattern
- thermally conductive
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
Description
第１図及び第２図は本考案の一実施例の夫々異
なつた断面図、第３図は斜視図、第４図は他の実
施例を示す要部斜視図である。
１……基板、２……金属板、３……絶縁層、４
……配線パターン、７……発光ダイオードアレイ
チツプ、９……駆動ＩＣ，１１……透明ケース。
1 and 2 are different sectional views of one embodiment of the present invention, FIG. 3 is a perspective view, and FIG. 4 is a perspective view of main parts of another embodiment. 1...Substrate, 2...Metal plate, 3...Insulating layer, 4
...Wiring pattern, 7...Light emitting diode array chip, 9...Drive IC, 11...Transparent case.
Claims (1)
熱伝導性絶縁層を設けて基板を構成し、発光ダイ
オードチツプ及び該チツプを駆動制御する駆動Ｉ
Ｃを基板に装着して前記配線パターンに電気的に
接続し、前記チツプ及びＩＣを透明ケースにて覆
つてなる光学装置。 A substrate is constructed by providing a thermally conductive insulating layer with a wiring pattern on a thermally conductive metal plate, and includes a light emitting diode chip and a drive I for driving and controlling the chip.
1. An optical device comprising: C mounted on a substrate, electrically connected to the wiring pattern, and the chip and IC covered with a transparent case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101484U JPS648760U (en) | 1987-07-01 | 1987-07-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101484U JPS648760U (en) | 1987-07-01 | 1987-07-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648760U true JPS648760U (en) | 1989-01-18 |
Family
ID=31330523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987101484U Pending JPS648760U (en) | 1987-07-01 | 1987-07-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119515A (en) * | 2002-09-24 | 2004-04-15 | Neo Led Technology Co Ltd | Light emitting diode display module having high heat dissipation and substrate thereof |
-
1987
- 1987-07-01 JP JP1987101484U patent/JPS648760U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119515A (en) * | 2002-09-24 | 2004-04-15 | Neo Led Technology Co Ltd | Light emitting diode display module having high heat dissipation and substrate thereof |