JPH0258793B2 - - Google Patents

Info

Publication number
JPH0258793B2
JPH0258793B2 JP56135172A JP13517281A JPH0258793B2 JP H0258793 B2 JPH0258793 B2 JP H0258793B2 JP 56135172 A JP56135172 A JP 56135172A JP 13517281 A JP13517281 A JP 13517281A JP H0258793 B2 JPH0258793 B2 JP H0258793B2
Authority
JP
Japan
Prior art keywords
solder
container
pads
interconnection
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56135172A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5835935A (ja
Inventor
Nobuhiko Mizuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56135172A priority Critical patent/JPS5835935A/ja
Publication of JPS5835935A publication Critical patent/JPS5835935A/ja
Publication of JPH0258793B2 publication Critical patent/JPH0258793B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H10W70/657—
    • H10W70/68—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP56135172A 1981-08-28 1981-08-28 半導体装置及びその製造方法 Granted JPS5835935A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135172A JPS5835935A (ja) 1981-08-28 1981-08-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135172A JPS5835935A (ja) 1981-08-28 1981-08-28 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPS5835935A JPS5835935A (ja) 1983-03-02
JPH0258793B2 true JPH0258793B2 (enExample) 1990-12-10

Family

ID=15145513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135172A Granted JPS5835935A (ja) 1981-08-28 1981-08-28 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPS5835935A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132692A (ja) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd 液晶表示装置の駆動方法及びその駆動回路
JPH0450998A (ja) * 1990-06-15 1992-02-19 Matsushita Electric Ind Co Ltd 液晶表示装置及びその駆動方法と駆動装置
US6734041B2 (en) 1999-04-16 2004-05-11 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60123093A (ja) * 1983-12-07 1985-07-01 富士通株式会社 半導体装置の装着方法
JP2548691B2 (ja) * 1984-02-29 1996-10-30 キヤノン株式会社 はんだ付け方法及び電気回路装置
JPS63304636A (ja) * 1987-06-05 1988-12-12 Hitachi Ltd はんだキヤリア及びその製法並びにこれを用いた半導体装置の実装方法
DE59502664D1 (de) * 1994-03-15 1998-08-06 Mayer Heinrich Gurtband zum Bereitstellen von Lotdepots zum Auflöten von Bauelementen auf eine Leiterplatte
JP3145331B2 (ja) * 1996-04-26 2001-03-12 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
TW432650B (en) 1999-04-16 2001-05-01 Cts Comp Technology System Cor Semiconductor chip device and the manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03132692A (ja) * 1989-10-18 1991-06-06 Matsushita Electric Ind Co Ltd 液晶表示装置の駆動方法及びその駆動回路
JPH0450998A (ja) * 1990-06-15 1992-02-19 Matsushita Electric Ind Co Ltd 液晶表示装置及びその駆動方法と駆動装置
US6734041B2 (en) 1999-04-16 2004-05-11 Ming-Tung Shen Semiconductor chip module and method for manufacturing the same

Also Published As

Publication number Publication date
JPS5835935A (ja) 1983-03-02

Similar Documents

Publication Publication Date Title
JP2595909B2 (ja) 半導体装置
JP3262497B2 (ja) チップ実装回路カード構造
US5942795A (en) Leaded substrate carrier for integrated circuit device and leaded substrate carrier device assembly
JP2768650B2 (ja) ソルダーボールの装着溝を有する印刷回路基板とこれを使用したボールグリッドアレイパッケージ
EP0653789A2 (en) Electronic package structure and method of making same
JPH05211202A (ja) 複合フリップ・チップ半導体装置とその製造およびバーンインの方法
US6222738B1 (en) Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof
US6034437A (en) Semiconductor device having a matrix of bonding pads
JPH0258793B2 (enExample)
JP2001196534A (ja) 半導体装置および半導体モジュール
JPH09162230A (ja) 電子回路装置及びその製造方法
JP3519924B2 (ja) 半導体装置の構造及びその製造方法
JP3585806B2 (ja) ピン付き配線基板
JPH11163489A (ja) 電子部品の実装構造
JP3055496B2 (ja) 半導体装置の実装構造
JP3623641B2 (ja) 半導体装置
JPH08340164A (ja) Ｂｇａ型パッケージの面実装構造
JP2000100875A (ja) 半導体集積回路装置およびその製造方法並びに製造装置
JPS60138948A (ja) 半導体装置用パツケ−ジ
JP2904274B2 (ja) Ｌｓｉパッケージの実装方法
JPH0758244A (ja) 半導体パッケージ及び半導体パッケージの製造方法
JP2741611B2 (ja) フリップチップボンディング用基板
JPH11345831A (ja) 半導体装置、実装基板および実装方法
JPH04329659A (ja) 混成集積回路装置およびその製造方法
JP2885285B1 (ja) 集積回路パッケージ