JPH0257147B2 - - Google Patents
Info
- Publication number
- JPH0257147B2 JPH0257147B2 JP60140789A JP14078985A JPH0257147B2 JP H0257147 B2 JPH0257147 B2 JP H0257147B2 JP 60140789 A JP60140789 A JP 60140789A JP 14078985 A JP14078985 A JP 14078985A JP H0257147 B2 JPH0257147 B2 JP H0257147B2
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- molded body
- pet
- plating
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14078985A JPS621876A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14078985A JPS621876A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS621876A JPS621876A (ja) | 1987-01-07 |
JPH0257147B2 true JPH0257147B2 (cs) | 1990-12-04 |
Family
ID=15276776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14078985A Granted JPS621876A (ja) | 1985-06-27 | 1985-06-27 | ポリエチレンテレフタレ−ト成形体の金属めつき方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS621876A (cs) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648835U (ja) * | 1992-12-09 | 1994-07-05 | 株式会社川崎製作所 | 硝子瓶破砕装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4021314A (en) * | 1976-03-25 | 1977-05-03 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
JPS60140790A (ja) * | 1983-12-27 | 1985-07-25 | ソニ−ケミカル株式会社 | 連結シ−ト |
-
1985
- 1985-06-27 JP JP14078985A patent/JPS621876A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0648835U (ja) * | 1992-12-09 | 1994-07-05 | 株式会社川崎製作所 | 硝子瓶破砕装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS621876A (ja) | 1987-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |