JPH0256434B2 - - Google Patents

Info

Publication number
JPH0256434B2
JPH0256434B2 JP62270265A JP27026587A JPH0256434B2 JP H0256434 B2 JPH0256434 B2 JP H0256434B2 JP 62270265 A JP62270265 A JP 62270265A JP 27026587 A JP27026587 A JP 27026587A JP H0256434 B2 JPH0256434 B2 JP H0256434B2
Authority
JP
Japan
Prior art keywords
diaphragm
tank
plating
plating solution
diaphragm tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62270265A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01116094A (ja
Inventor
Hiroaki Takayama
Takeo Negishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eagle Industry Co Ltd
Original Assignee
Eagle Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eagle Industry Co Ltd filed Critical Eagle Industry Co Ltd
Priority to JP27026587A priority Critical patent/JPH01116094A/ja
Publication of JPH01116094A publication Critical patent/JPH01116094A/ja
Publication of JPH0256434B2 publication Critical patent/JPH0256434B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
JP27026587A 1987-10-28 1987-10-28 隔膜鍍金法 Granted JPH01116094A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27026587A JPH01116094A (ja) 1987-10-28 1987-10-28 隔膜鍍金法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27026587A JPH01116094A (ja) 1987-10-28 1987-10-28 隔膜鍍金法

Publications (2)

Publication Number Publication Date
JPH01116094A JPH01116094A (ja) 1989-05-09
JPH0256434B2 true JPH0256434B2 (enrdf_load_stackoverflow) 1990-11-30

Family

ID=17483842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27026587A Granted JPH01116094A (ja) 1987-10-28 1987-10-28 隔膜鍍金法

Country Status (1)

Country Link
JP (1) JPH01116094A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7022211B2 (en) 2000-01-31 2006-04-04 Ebara Corporation Semiconductor wafer holder and electroplating system for plating a semiconductor wafer
WO2001068952A1 (fr) * 2000-03-17 2001-09-20 Ebara Corporation Procede et appareil de plaquage electrolytique
ES2324169T3 (es) * 2005-04-26 2009-07-31 Atotech Deutschland Gmbh Baño galvanico alcalino con una membrana de filtracion.
JP5257919B2 (ja) * 2007-05-08 2013-08-07 株式会社 大昌電子 めっき装置
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
JP5651737B2 (ja) * 2013-06-03 2015-01-14 株式会社ムラタ ニッケルめっきのためのめっき装置
CN106435695A (zh) * 2016-08-24 2017-02-22 谢彪 电镀设备及电镀方法

Also Published As

Publication number Publication date
JPH01116094A (ja) 1989-05-09

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