JPH0254676B2 - - Google Patents

Info

Publication number
JPH0254676B2
JPH0254676B2 JP58222964A JP22296483A JPH0254676B2 JP H0254676 B2 JPH0254676 B2 JP H0254676B2 JP 58222964 A JP58222964 A JP 58222964A JP 22296483 A JP22296483 A JP 22296483A JP H0254676 B2 JPH0254676 B2 JP H0254676B2
Authority
JP
Japan
Prior art keywords
circuit device
integrated circuit
substrate
hybrid integrated
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58222964A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60115293A (ja
Inventor
Osamu Furukawa
Kazuaki Masaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP58222964A priority Critical patent/JPS60115293A/ja
Publication of JPS60115293A publication Critical patent/JPS60115293A/ja
Publication of JPH0254676B2 publication Critical patent/JPH0254676B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP58222964A 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法 Granted JPS60115293A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58222964A JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58222964A JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60115293A JPS60115293A (ja) 1985-06-21
JPH0254676B2 true JPH0254676B2 (enrdf_load_html_response) 1990-11-22

Family

ID=16790639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58222964A Granted JPS60115293A (ja) 1983-11-27 1983-11-27 ハイブリッド集積回路装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60115293A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7384817B2 (en) 2005-05-13 2008-06-10 Sandisk Corporation Method of assembling semiconductor devices with LEDs

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58103195A (ja) * 1981-12-16 1983-06-20 アルプス電気株式会社 回路板
JPS5961093A (ja) * 1982-09-29 1984-04-07 東京コスモス電機株式会社 複合電子部品の製造方法

Also Published As

Publication number Publication date
JPS60115293A (ja) 1985-06-21

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