JPH0254295U - - Google Patents
Info
- Publication number
- JPH0254295U JPH0254295U JP6748689U JP6748689U JPH0254295U JP H0254295 U JPH0254295 U JP H0254295U JP 6748689 U JP6748689 U JP 6748689U JP 6748689 U JP6748689 U JP 6748689U JP H0254295 U JPH0254295 U JP H0254295U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- hybrid integrated
- integrated circuit
- switching circuit
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000696 magnetic material Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Electronic Switches (AREA)
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案の混成集積回路装置を説明する
断面図、第２図は本考案の混成集積回路装置の電
子機器への取付け構造を説明する側面図、第３図
Ａ、第３図Ｂ、第４図Ａ、第４図Ｂ、第５図Ａ、
第６図Ａおよび第６図Ｂは本考案の混成集積回路
装置のコアを説明する側面図および断面図である
。
主な図番の説明、１は金属基板、６は外部リー
ド、７はコアである。
Fig. 1 is a cross-sectional view illustrating the hybrid integrated circuit device of the present invention, Fig. 2 is a side view illustrating the mounting structure of the hybrid integrated circuit device of the present invention to electronic equipment, Fig. 3A, Fig. 3B , Figure 4A, Figure 4B, Figure 5A,
FIGS. 6A and 6B are a side view and a cross-sectional view illustrating the core of the hybrid integrated circuit device of the present invention. Explanation of main figure numbers: 1 is a metal substrate, 6 is an external lead, and 7 is a core.
Claims (1)
ての外部リードに取付けられた複数の孔を有した
磁性体より成るコアとを備えた混成集積回路にお
いて、 前記混成集積回路はアルミシールドボツクス内
に配置された絶縁フイルムを介して取付けられて
いることを特徴とするスイツチング回路を組込ん
だ混成集積回路装置。[Scope of claim for utility model registration] A metal substrate with good thermal conductivity whose surface is insulated, a desired switching circuit formed on the substrate, an external lead for connecting the circuit to an external circuit, and one end of which is attached to a molded resin. In a hybrid integrated circuit comprising a core made of a magnetic material embedded and fixed and having a plurality of holes attached to all external leads, the hybrid integrated circuit is connected to the core through an insulating film placed in an aluminum shield box. 1. A hybrid integrated circuit device incorporating a switching circuit, characterized in that the switching circuit is installed in the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6748689U JPH0543513Y2 (en) | 1989-06-09 | 1989-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6748689U JPH0543513Y2 (en) | 1989-06-09 | 1989-06-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0254295U true JPH0254295U (en) | 1990-04-19 |
| JPH0543513Y2 JPH0543513Y2 (en) | 1993-11-02 |
Family
ID=31292856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6748689U Expired - Lifetime JPH0543513Y2 (en) | 1989-06-09 | 1989-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543513Y2 (en) |
-
1989
- 1989-06-09 JP JP6748689U patent/JPH0543513Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543513Y2 (en) | 1993-11-02 |
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