JPH0226298U - - Google Patents
Info
- Publication number
- JPH0226298U JPH0226298U JP10443988U JP10443988U JPH0226298U JP H0226298 U JPH0226298 U JP H0226298U JP 10443988 U JP10443988 U JP 10443988U JP 10443988 U JP10443988 U JP 10443988U JP H0226298 U JPH0226298 U JP H0226298U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- outer peripheral
- peripheral surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例の製造手順説明図、
第２図は第１図の実施例の断面図、第３図及び第
４図は本考案の他の実施例の断面図、第５図は更
に他の実施例を示す説明図、第６図及び第７図は
従来例の断面図及び斜視図、第８図は更に他の従
来を示す説明図である。
１…シールドケース、２…回路基板、３…電子
部品、４…リード線、５…接着樹脂、６…金属製
網体、７…絶縁性樹脂、８…絶縁被覆導線。
FIG. 1 is an explanatory diagram of the manufacturing procedure of an embodiment of the present invention;
FIG. 2 is a sectional view of the embodiment shown in FIG. 1, FIGS. 3 and 4 are sectional views of other embodiments of the present invention, FIG. 5 is an explanatory diagram showing still another embodiment, and FIG. 6 7 are a sectional view and a perspective view of a conventional example, and FIG. 8 is an explanatory diagram showing still another conventional example. DESCRIPTION OF SYMBOLS 1...Shield case, 2...Circuit board, 3...Electronic component, 4...Lead wire, 5...Adhesive resin, 6...Metal net, 7...Insulating resin, 8...Insulated conducting wire.
Claims (1)
てなるシールド混成集積回路装置において、前記
混成集積回路基板の外周面に絶縁被覆導線の巻回
層が設けられ、更にその巻回層を被覆する絶縁性
樹脂被膜が形成されていることを特徴とするシー
ルド混成集積回路装置。 In a shielded hybrid integrated circuit device in which the outer peripheral surface of a hybrid integrated circuit board is coated with a conductive layer, a wound layer of an insulated conductive wire is provided on the outer peripheral surface of the hybrid integrated circuit board, and the wound layer is further coated. A shielded hybrid integrated circuit device characterized by having an insulating resin film formed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10443988U JPH0249758Y2 (en) | 1988-08-06 | 1988-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10443988U JPH0249758Y2 (en) | 1988-08-06 | 1988-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226298U true JPH0226298U (en) | 1990-02-21 |
| JPH0249758Y2 JPH0249758Y2 (en) | 1990-12-27 |
Family
ID=31336154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10443988U Expired JPH0249758Y2 (en) | 1988-08-06 | 1988-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249758Y2 (en) |
-
1988
- 1988-08-06 JP JP10443988U patent/JPH0249758Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0249758Y2 (en) | 1990-12-27 |
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