JPH0390371U - - Google Patents

Info

Publication number
JPH0390371U
JPH0390371U JP1989151855U JP15185589U JPH0390371U JP H0390371 U JPH0390371 U JP H0390371U JP 1989151855 U JP1989151855 U JP 1989151855U JP 15185589 U JP15185589 U JP 15185589U JP H0390371 U JPH0390371 U JP H0390371U
Authority
JP
Japan
Prior art keywords
coil
magnetic layer
coupling coil
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989151855U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989151855U priority Critical patent/JPH0390371U/ja
Publication of JPH0390371U publication Critical patent/JPH0390371U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案によるカツプリングコイル付厚
膜印刷基板の一実施例を示す断面図、第２図はそ
の一部拡大断面図、第３図は該実施例の保護層を
除いた状態を示す平面図、第４図は該実施例の構
造のものを用いて信号の授受を行なう場合の基板
の組合わせを示す断面図、第５図は本考案による
カツプリングコイル付厚膜印刷基板の他の実施例
を示す断面図である。 １，３Ａ……基板、２，５……リード、３ａ，
３ｂ……磁性体層、４……カツプリングコイル、
６……保護層。 Fig. 1 is a sectional view showing an embodiment of a thick film printed circuit board with a coupling coil according to the present invention, Fig. 2 is a partially enlarged sectional view thereof, and Fig. 3 shows the state of the embodiment with the protective layer removed. FIG. 4 is a cross-sectional view showing a combination of substrates when transmitting and receiving signals using the structure of this embodiment, and FIG. 5 is a diagram showing a thick film printed circuit board with coupling coil according to the present invention. FIG. 7 is a sectional view showing another embodiment. 1, 3A... Board, 2, 5... Lead, 3a,
3b...Magnetic layer, 4...Coupling coil,
6...Protective layer.

Claims (1)

【実用新案登録請求の範囲】 １ セラミツク基板上に磁性体層を形成し、該磁
性体層上に渦巻状カツプリングコイルを形成し、
該コイルの導体間およびコイルの周囲に、前記磁
性体層に重ねて磁性体層を形成したことを特徴と
するカツプリングコイル付厚膜印刷基板。 ２ フエライト基板上に渦巻状カツプリングコイ
ルを形成し、該コイルの導体間およびコイルの周
囲に、前記基板に重ねて磁性体層を形成したこと
を特徴とするカツプリングコイル付厚膜印刷基板
。 ３ 前記カツプリングコイルの導体間およびコイ
ルの周囲に形成される磁性体層の高さを、前記導
体の高さよりやや高くしたことを特徴とする請求
項１または２記載のカツプリングコイル付厚膜印
刷基板。[Claims for Utility Model Registration] 1. Forming a magnetic layer on a ceramic substrate, forming a spiral coupling coil on the magnetic layer,
A thick film printed circuit board with a coupling coil, characterized in that a magnetic layer is formed between the conductors of the coil and around the coil, overlapping the magnetic layer. 2. A thick film printed circuit board with a coupling coil, characterized in that a spiral coupling coil is formed on a ferrite substrate, and a magnetic layer is formed between the conductors of the coil and around the coil, overlapping the substrate. 3. The thick film with coupling coil according to claim 1 or 2, wherein the height of the magnetic layer formed between the conductors of the coupling coil and around the coil is slightly higher than the height of the conductor. Printed circuit board.
JP1989151855U 1989-12-28 1989-12-28 Pending JPH0390371U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989151855U JPH0390371U (en) 1989-12-28 1989-12-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989151855U JPH0390371U (en) 1989-12-28 1989-12-28

Publications (1)

Publication Number Publication Date
JPH0390371U true JPH0390371U (en) 1991-09-13

Family

ID=31698142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989151855U Pending JPH0390371U (en) 1989-12-28 1989-12-28

Country Status (1)

Country Link
JP (1) JPH0390371U (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069316A (en) * 2001-08-27 2003-03-07 Murata Mfg Co Ltd Layered directional coupler
JP2006041986A (en) * 2004-07-28 2006-02-09 Matsushita Electric Ind Co Ltd Antenna
JP2006107341A (en) * 2004-10-08 2006-04-20 Fujitsu Ltd Access device of information holding body and electronic equipment incorporating the access device
JP2006339329A (en) * 2005-06-01 2006-12-14 Seiko Epson Corp Planar coil device and substrate as well as fixing method of planar coil
JP2007116347A (en) * 2005-10-19 2007-05-10 Mitsubishi Materials Corp Tag antenna and mobile radio equipment
JP2007317914A (en) * 2006-05-26 2007-12-06 Asuka Electron Kk Air core coil and electric circuit unit using the same
JP2008172873A (en) * 2007-01-09 2008-07-24 Sony Ericsson Mobilecommunications Japan Inc Contactless power transmission coil, portable terminal, terminal charger, magnetic layer forming apparatus for planar coil and magnetic layer forming method thereof
JP2008235862A (en) * 2007-02-20 2008-10-02 Seiko Epson Corp Coil unit and electronic instrument
JP2009005474A (en) * 2007-06-20 2009-01-08 Panasonic Electric Works Co Ltd Non-contact power transmission apparatus
JP2009027025A (en) * 2007-07-20 2009-02-05 Seiko Epson Corp Coil unit, and electronic instrument
JP2009105434A (en) * 2007-02-20 2009-05-14 Seiko Epson Corp Method of manufacturing coil unit, and jig using for manufacture
JP2009277820A (en) * 2008-05-14 2009-11-26 Seiko Epson Corp Coil unit and electronic apparatus using the same
JP2009277690A (en) * 2008-05-12 2009-11-26 Seiko Epson Corp Coil unit and electronic apparatus using the same
WO2011111585A1 (en) * 2010-03-09 2011-09-15 日東電工株式会社 Magnetic element for wireless power transmission and power supply device
JP2014175450A (en) * 2013-03-08 2014-09-22 Auto Network Gijutsu Kenkyusho:Kk Electrical connection device
JP2015076606A (en) * 2013-10-04 2015-04-20 サムソン エレクトロ−メカニックス カンパニーリミテッド． Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having bonding structure
JP2020047614A (en) * 2018-09-14 2020-03-26 国立大学法人信州大学 Wireless power transmission coil unit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514709B2 (en) * 1978-08-14 1980-04-18
JPS62275790A (en) * 1986-05-26 1987-11-30 株式会社東芝 Thin-film electromagnetic converter

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5514709B2 (en) * 1978-08-14 1980-04-18
JPS62275790A (en) * 1986-05-26 1987-11-30 株式会社東芝 Thin-film electromagnetic converter

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069316A (en) * 2001-08-27 2003-03-07 Murata Mfg Co Ltd Layered directional coupler
JP4604431B2 (en) * 2001-08-27 2011-01-05 株式会社村田製作所 Multilayer directional coupler
JP2006041986A (en) * 2004-07-28 2006-02-09 Matsushita Electric Ind Co Ltd Antenna
JP2006107341A (en) * 2004-10-08 2006-04-20 Fujitsu Ltd Access device of information holding body and electronic equipment incorporating the access device
JP4597629B2 (en) * 2004-10-08 2010-12-15 富士通株式会社 Information holding device access device and electronic device incorporating the access device
JP2006339329A (en) * 2005-06-01 2006-12-14 Seiko Epson Corp Planar coil device and substrate as well as fixing method of planar coil
JP2007116347A (en) * 2005-10-19 2007-05-10 Mitsubishi Materials Corp Tag antenna and mobile radio equipment
JP2007317914A (en) * 2006-05-26 2007-12-06 Asuka Electron Kk Air core coil and electric circuit unit using the same
JP2008172873A (en) * 2007-01-09 2008-07-24 Sony Ericsson Mobilecommunications Japan Inc Contactless power transmission coil, portable terminal, terminal charger, magnetic layer forming apparatus for planar coil and magnetic layer forming method thereof
JP2008235862A (en) * 2007-02-20 2008-10-02 Seiko Epson Corp Coil unit and electronic instrument
US8169286B2 (en) 2007-02-20 2012-05-01 Seiko Epson Corporation Coil unit, method of manufacturing the same, and electronic instrument
JP2009105434A (en) * 2007-02-20 2009-05-14 Seiko Epson Corp Method of manufacturing coil unit, and jig using for manufacture
JP2009005474A (en) * 2007-06-20 2009-01-08 Panasonic Electric Works Co Ltd Non-contact power transmission apparatus
US8541977B2 (en) 2007-07-20 2013-09-24 Seiko Epson Corporation Coil unit and electronic instrument
JP4605192B2 (en) * 2007-07-20 2011-01-05 セイコーエプソン株式会社 Coil unit and electronic equipment
JP2009027025A (en) * 2007-07-20 2009-02-05 Seiko Epson Corp Coil unit, and electronic instrument
JP4508266B2 (en) * 2008-05-12 2010-07-21 セイコーエプソン株式会社 Coil unit and electronic device using the same
JP2009277690A (en) * 2008-05-12 2009-11-26 Seiko Epson Corp Coil unit and electronic apparatus using the same
JP4572953B2 (en) * 2008-05-14 2010-11-04 セイコーエプソン株式会社 Coil unit and electronic device using the same
US8188826B2 (en) 2008-05-14 2012-05-29 Seiko Epson Corporation Coil unit and electronic apparatus using the same
JP2009277820A (en) * 2008-05-14 2009-11-26 Seiko Epson Corp Coil unit and electronic apparatus using the same
JP2011211176A (en) * 2010-03-09 2011-10-20 Nitto Denko Corp Magnetic element for wireless power transmission and device for power supply
WO2011111585A1 (en) * 2010-03-09 2011-09-15 日東電工株式会社 Magnetic element for wireless power transmission and power supply device
CN102792401A (en) * 2010-03-09 2012-11-21 日东电工株式会社 Magnetic element for wireless power transmission and power supply device
US9390849B2 (en) 2010-03-09 2016-07-12 Nitto Denko Corporation Magnetic element for wireless power transmission and power supply device
JP2014175450A (en) * 2013-03-08 2014-09-22 Auto Network Gijutsu Kenkyusho:Kk Electrical connection device
JP2015076606A (en) * 2013-10-04 2015-04-20 サムソン エレクトロ−メカニックス カンパニーリミテッド． Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having bonding structure
JP2020047614A (en) * 2018-09-14 2020-03-26 国立大学法人信州大学 Wireless power transmission coil unit

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