JPS633176U - - Google Patents
Info
- Publication number
- JPS633176U JPS633176U JP9738986U JP9738986U JPS633176U JP S633176 U JPS633176 U JP S633176U JP 9738986 U JP9738986 U JP 9738986U JP 9738986 U JP9738986 U JP 9738986U JP S633176 U JPS633176 U JP S633176U
- Authority
- JP
- Japan
- Prior art keywords
- magnetic powder
- wiring board
- printed wiring
- binder
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006247 magnetic powder Substances 0.000 claims 2
- 239000011230 binding agent Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011324 bead Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は回路部品を実装した状態の印刷配線板
の断面図、第２図および第３図は第１図に示す印
刷配線板のスルーホールのそれぞれを拡大して示
す断面図である。また、第４図はリード端子にビ
ーズが挿入された従来例の説明図、第５図はビー
ズインダクタの斜視図である。
１０……コイル（回路部品）、１１……トラン
ジスタ（回路部品）、１２……印刷配線板、１３
，１４……スルーホール、１５，１６……インダ
クタ部。
FIG. 1 is a sectional view of the printed wiring board with circuit components mounted thereon, and FIGS. 2 and 3 are sectional views showing enlarged through holes of the printed wiring board shown in FIG. 1. Further, FIG. 4 is an explanatory diagram of a conventional example in which beads are inserted into lead terminals, and FIG. 5 is a perspective view of a bead inductor. 10... Coil (circuit component), 11... Transistor (circuit component), 12... Printed wiring board, 13
, 14... Through hole, 15, 16... Inductor section.
Claims (1)
ホールの内部に、磁性粉およびバインダ、もしく
は、磁性粉のみからなるインダクタ部を形成した
ことを特徴とする高周波回路装置。 A high frequency circuit device characterized in that an inductor portion made of magnetic powder and a binder, or only magnetic powder, is formed inside a through hole provided in a printed wiring board that is a device substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9738986U JPS633176U (en) | 1986-06-25 | 1986-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9738986U JPS633176U (en) | 1986-06-25 | 1986-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633176U true JPS633176U (en) | 1988-01-11 |
Family
ID=30964262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9738986U Pending JPS633176U (en) | 1986-06-25 | 1986-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633176U (en) |
-
1986
- 1986-06-25 JP JP9738986U patent/JPS633176U/ja active Pending
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