JPH0253955B2 - - Google Patents
Info
- Publication number
- JPH0253955B2 JPH0253955B2 JP62104056A JP10405687A JPH0253955B2 JP H0253955 B2 JPH0253955 B2 JP H0253955B2 JP 62104056 A JP62104056 A JP 62104056A JP 10405687 A JP10405687 A JP 10405687A JP H0253955 B2 JPH0253955 B2 JP H0253955B2
- Authority
- JP
- Japan
- Prior art keywords
- supply
- electronic components
- component
- supply table
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 description 31
- 230000015654 memory Effects 0.000 description 25
- 230000008859 change Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000013039 cover film Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62104056A JPS63269600A (ja) | 1987-04-27 | 1987-04-27 | 二つの部品供給テ−ブルを備えた電子部品実装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62104056A JPS63269600A (ja) | 1987-04-27 | 1987-04-27 | 二つの部品供給テ−ブルを備えた電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63269600A JPS63269600A (ja) | 1988-11-07 |
JPH0253955B2 true JPH0253955B2 (enrdf_load_stackoverflow) | 1990-11-20 |
Family
ID=14370534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62104056A Granted JPS63269600A (ja) | 1987-04-27 | 1987-04-27 | 二つの部品供給テ−ブルを備えた電子部品実装装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63269600A (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02172633A (ja) * | 1988-12-22 | 1990-07-04 | Sanyo Electric Co Ltd | 部品供給装置 |
US5249662A (en) * | 1989-04-05 | 1993-10-05 | Sanyo Electric Co., Ltd. | Parts feeding apparatus |
JPH033398A (ja) * | 1989-05-31 | 1991-01-09 | Matsushita Electric Ind Co Ltd | 電子部品実装方法 |
JPH0821798B2 (ja) * | 1989-09-05 | 1996-03-04 | 富士機械製造株式会社 | 電子部品供給装置 |
JPH0878882A (ja) * | 1994-09-02 | 1996-03-22 | Fuji Mach Mfg Co Ltd | 対回路基板トランスファ作業装置 |
-
1987
- 1987-04-27 JP JP62104056A patent/JPS63269600A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63269600A (ja) | 1988-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4425855B2 (ja) | 対回路基板作業機およびそれに対する構成要素の供給方法 | |
US7356919B2 (en) | Component mounting method | |
JP5656446B2 (ja) | バックアップピン装置並びにバックアップピン配置方法及び配置装置 | |
US20060200979A1 (en) | Component mounting method | |
JPH0253954B2 (enrdf_load_stackoverflow) | ||
JP3554615B2 (ja) | 電子部品装着装置 | |
JPH0253955B2 (enrdf_load_stackoverflow) | ||
JP4750664B2 (ja) | 部品実装方法 | |
EP3051935B1 (en) | Component mounting apparatus | |
KR101759633B1 (ko) | 부품 실장 장치, 부품 실장 방법 | |
JP2014099513A (ja) | フィルムフィーダおよび組立作業機 | |
JP6401708B2 (ja) | 対基板作業装置 | |
JP7649791B2 (ja) | 実装方法及び実装装置 | |
JP2585918Y2 (ja) | 電子部品自動装着装置 | |
JP7324972B2 (ja) | 部品実装用装置 | |
JP2003101296A (ja) | 部品搭載装置 | |
JP3821526B2 (ja) | 部品実装装置 | |
WO2021224974A1 (ja) | 部品実装機 | |
WO2017068645A1 (ja) | 部品装着方法および部品装着機 | |
JP5885801B2 (ja) | バックアップピン装置並びにバックアップピン配置方法及び配置装置 | |
JPH05275887A (ja) | 電子部品供給装置 | |
JPS61244417A (ja) | 部品取付装置における基板移動位置決め機構 | |
JPH11298198A (ja) | 電子部品装着方法 | |
JPH05275885A (ja) | 電子部品供給装置 | |
JPH0527215A (ja) | 基板搬送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |