JPH0252402B2 - - Google Patents

Info

Publication number

JPH0252402B2

JPH0252402B2 JP10216286A JP10216286A JPH0252402B2 JP H0252402 B2 JPH0252402 B2 JP H0252402B2 JP 10216286 A JP10216286 A JP 10216286A JP 10216286 A JP10216286 A JP 10216286A JP H0252402 B2 JPH0252402 B2 JP H0252402B2

Authority

JP

Japan

Prior art keywords

resistor

resin

metal foil

external connection

substrate

Prior art date

1986-05-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 229920005989 resin Polymers 0.000 claims description 20
• 239000011347 resin Substances 0.000 claims description 20
• 239000000758 substrate Substances 0.000 claims description 18
• 239000011888 foil Substances 0.000 claims description 16
• 229910052751 metal Inorganic materials 0.000 claims description 16
• 239000002184 metal Substances 0.000 claims description 16
• 239000000853 adhesive Substances 0.000 description 6
• 230000001070 adhesive effect Effects 0.000 description 6
• PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
• 238000000034 method Methods 0.000 description 4
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
• 230000017525 heat dissipation Effects 0.000 description 3
• WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
• VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
• 229910052802 copper Inorganic materials 0.000 description 2
• 239000010949 copper Substances 0.000 description 2
• 239000011521 glass Substances 0.000 description 2
• 229910052759 nickel Inorganic materials 0.000 description 2
• 238000001259 photo etching Methods 0.000 description 2
• 238000005096 rolling process Methods 0.000 description 2
• 238000003466 welding Methods 0.000 description 2
• CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
• ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
• 239000000956 alloy Substances 0.000 description 1
• 229910045601 alloy Inorganic materials 0.000 description 1
• 229910052782 aluminium Inorganic materials 0.000 description 1
• XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
• 239000005388 borosilicate glass Substances 0.000 description 1
• 239000010432 diamond Substances 0.000 description 1
• 229910003460 diamond Inorganic materials 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000003822 epoxy resin Substances 0.000 description 1
• PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
• 239000010931 gold Substances 0.000 description 1
• 229910052737 gold Inorganic materials 0.000 description 1
• 230000020169 heat generation Effects 0.000 description 1
• 229920000647 polyepoxide Polymers 0.000 description 1
• 229910052594 sapphire Inorganic materials 0.000 description 1
• 239000010980 sapphire Substances 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1
• 238000005476 soldering Methods 0.000 description 1
• 229920001187 thermosetting polymer Polymers 0.000 description 1