JPH0252402B2 - - Google Patents
Info
- Publication number
- JPH0252402B2 JPH0252402B2 JP10216286A JP10216286A JPH0252402B2 JP H0252402 B2 JPH0252402 B2 JP H0252402B2 JP 10216286 A JP10216286 A JP 10216286A JP 10216286 A JP10216286 A JP 10216286A JP H0252402 B2 JPH0252402 B2 JP H0252402B2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- resin
- metal foil
- external connection
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、絶縁性基板に金属箔抵抗体を貼着
し、外部接続端子の一部を除いて全体を樹脂で外
装した金属箔抵抗器に関するものである。Detailed Description of the Invention (Industrial Application Field) The present invention provides a metal foil resistor in which a metal foil resistor is adhered to an insulating substrate and the entire body is covered with resin except for a part of external connection terminals. It is related to.
（発明の背景）
アルミナやガラス等の絶縁性基板に、ニツケ
ル、クロームなどを含む金属箔抵抗体を貼着し、
この金属箔抵抗体にフオトエツチングなどにより
抵抗パターンを形成し、リード線をこの抵抗体に
接続した後、全体を樹脂で外装した金属箔抵抗器
が従来よりある。(Background of the invention) A metal foil resistor containing nickel, chrome, etc. is attached to an insulating substrate such as alumina or glass.
Conventionally, there is a metal foil resistor in which a resistance pattern is formed on the metal foil resistor by photoetching or the like, a lead wire is connected to the resistor, and then the whole is covered with resin.
この種の抵抗器では、基板の線膨張係数と抵抗
体の抵抗温度係数とを適合させることにより、抵
抗値の温度に対する変動を抑制し、高精度な抵抗
器を得ることができる。すなわち温度上昇に伴な
う抵抗体の抵抗値の変化を、基板の線膨張を利用
して抵抗体に応力を加えることにより相殺し、抵
抗温度係数を小さくするものである。 In this type of resistor, by matching the linear expansion coefficient of the substrate and the temperature coefficient of resistance of the resistor, it is possible to suppress fluctuations in resistance value with respect to temperature and obtain a highly accurate resistor. That is, changes in the resistance value of the resistor due to temperature rise are offset by applying stress to the resistor using linear expansion of the substrate, thereby reducing the temperature coefficient of resistance.
しかし抵抗体および基板は放熱性の悪い樹脂に
で外装されているため、抵抗体自身の発熱により
抵抗体および基板の温度が上昇し易い。このため
抵抗器の使用条件によつては抵抗値変化が大きく
なり、抵抗値の所定の精度を得ることができなく
なることがあり得るという問題があつた。 However, since the resistor and the substrate are covered with a resin with poor heat dissipation, the temperature of the resistor and the substrate tends to rise due to the heat generated by the resistor itself. Therefore, depending on the conditions of use of the resistor, the change in resistance value becomes large, and there is a problem in that it may become impossible to obtain a predetermined accuracy in resistance value.
（発明の目的）
本発明はこのような事情に鑑みなされたもので
あり、抵抗体および基板を樹脂で外装したにもか
かわらず、抵抗体および基板の放熱性が良好で、
抵抗体自身の発熱による抵抗値変化を抑制し、広
い使用条件に対して高い精度を得ることができる
金属箔抵抗器を提供することを目的とする。(Objective of the Invention) The present invention has been made in view of the above circumstances, and it is possible to improve the heat dissipation of the resistor and the board even though the resistor and the board are coated with resin.
It is an object of the present invention to provide a metal foil resistor that can suppress changes in resistance value due to heat generation of the resistor itself and can obtain high accuracy under a wide range of usage conditions.
（発明の構成）
本発明によればこの目的は、一側面に金属箔抵
抗体が貼着された絶縁性基板を樹脂で外装した金
属箔抵抗器において、一端部が前記外装樹脂内で
前記絶縁性基板の他側面に密着し他端部が前記外
装樹脂外へ延出した複数の板状外部接続端子と、
前記金属箔抵抗体をこれら外部接続端子に前記外
装樹脂内で接続するリード線とを備えることを特
徴とする金属箔抵抗器により達成される。(Structure of the Invention) According to the present invention, the object is to provide a metal foil resistor in which an insulating substrate having a metal foil resistor attached to one side thereof is sheathed with resin, in which one end portion is insulated within the sheathing resin. a plurality of plate-shaped external connection terminals that are in close contact with the other side of the flexible substrate and whose other ends extend outside the exterior resin;
This is achieved by a metal foil resistor characterized in that it includes lead wires that connect the metal foil resistor to these external connection terminals within the exterior resin.
（実施例）
第１図は本発明の一実施例の断面図、第２図は
その組立工程を示す分解斜視図である。(Embodiment) FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the assembly process.
これらの図において符号１０は絶縁性基板であ
り、アルミナ、グレーズドアルミナ、ホウケイ酸
ガラス、ソーダガラスあるいはダイヤモンド、サ
フアイヤ、ステアタイト等が用いられる。１２は
金属箔抵抗体であり、ニツケル、クローム、銅、
アルミニウム等を含む合金を圧延して箔に仕上
げ、さらに真空中（約10-6 Torr）で熱処理して
圧延に伴なう加工ひずみを除去し所望の抵抗温度
特性を得ている。この抵抗体１２は基板１０の一
方の面に接着剤１４により粘着される。ここに接
着剤１４としては耐熱性のよい接着剤などが適す
る。 In these figures, reference numeral 10 denotes an insulating substrate, for which alumina, glazed alumina, borosilicate glass, soda glass, diamond, sapphire, steatite, or the like is used. 12 is a metal foil resistor made of nickel, chrome, copper,
The foil is made by rolling an alloy containing aluminum, etc., and then heat-treated in a vacuum (approximately 10 -6 Torr) to remove the processing strain caused by rolling and obtain the desired resistance-temperature characteristics. This resistor 12 is adhered to one surface of the substrate 10 with an adhesive 14. Here, as the adhesive 14, an adhesive with good heat resistance is suitable.
このように基板１０に抵抗体１２を接着した
後、抵抗体１２にはフオトエツチング等の手法に
よつて抵抗パターンが形成され抵抗チツプ１６が
できる。この抵抗体１２には金線などのリード線
１８，１８の一端が超音波溶接などで接続され
る。 After the resistor 12 is bonded to the substrate 10 in this manner, a resistor pattern is formed on the resistor 12 by a method such as photo-etching to form a resistor chip 16. One ends of lead wires 18, 18, such as gold wires, are connected to this resistor 12 by ultrasonic welding or the like.
２０，２０は一対の外部接続端子であり、スズ
メツキ軟銅板などの金属板で作られている。この
外部接続端子２０は拡幅した端部を第２図Ａに示
すように対向配置し、その一方の面には前記基板
１０の抵抗体１２と反対の面がチツプ固定樹脂２
２（第１図）により接着される。このチツプ固定
樹脂２２としては熱硬化性エポキシ樹脂やゴム系
接着剤などが使用でき、特にゴム系接着剤を用い
れば外部接続端子２０により基板１０に応力が直
接加わらず好ましい。そして前記リード線１８の
他端はこの外部接続端子２０に超音波溶接などで
接続される（第２図Ｂ参照）。 Reference numerals 20 and 20 denote a pair of external connection terminals, which are made of metal plates such as tin plated annealed copper plates. The widened end portions of the external connection terminals 20 are arranged facing each other as shown in FIG.
2 (FIG. 1). A thermosetting epoxy resin, a rubber adhesive, or the like can be used as the chip fixing resin 22, and it is particularly preferable to use a rubber adhesive because stress is not directly applied to the substrate 10 by the external connection terminals 20. The other end of the lead wire 18 is connected to the external connection terminal 20 by ultrasonic welding or the like (see FIG. 2B).
このように組立てられた後、基板１０の周囲は
適当な弾性を有するゴム系樹脂２４と、硬質樹脂
２６とで二重に外装される。その結果板状の外部
接続端子２０の一部が外装樹脂２６から外部へ突
出する。この端子２０の外部突出部分は外装樹脂
２６の下面に沿うようにコ字状に折曲される。ま
た外装樹脂２６の下面中央付近には凸部２８が形
成され、各端子２０，２０はこの凸部２８を挾ん
で対向する。 After being assembled in this manner, the periphery of the substrate 10 is double coated with a rubber resin 24 having appropriate elasticity and a hard resin 26. As a result, a portion of the plate-shaped external connection terminal 20 protrudes from the exterior resin 26 to the outside. The externally protruding portion of the terminal 20 is bent into a U-shape along the lower surface of the exterior resin 26. Further, a convex portion 28 is formed near the center of the lower surface of the exterior resin 26, and the terminals 20, 20 face each other with this convex portion 28 in between.
この抵抗器は、例えばデイツプフロー方式によ
りプリント基板３０に実装される。プリント基板
３０の所定位置に接着剤によつて凸部２８を接着
して紫外線硬化し、その後噴流半田槽などにより
半田デイツプし、プリント基板３０上のプリント
配線部とこの抵抗器の外部接続端子２０とを半田
３２により接続する。 This resistor is mounted on the printed circuit board 30 by, for example, a dip flow method. The convex portion 28 is bonded to a predetermined position on the printed circuit board 30 with an adhesive and cured with ultraviolet rays, and then soldered in a jet soldering bath or the like to connect the printed wiring section on the printed circuit board 30 and the external connection terminal 20 of this resistor. and are connected by solder 32.
外部接続端子２０は板状であつて、しかも抵抗
体１２が貼着された基板１０に接着されているの
で、抵抗体１２が発生する熱は基板１０を介して
この外部接続端子２０に伝えられる。この外部接
続端子２０の一端は外部に露出しているので放熱
性が良く、抵抗チツプ１６が過度に高温になるこ
とがない。このため抵抗値変化を抑制でき、広い
使用条件に対して高い精度を保証できる。 Since the external connection terminal 20 is plate-shaped and is bonded to the substrate 10 to which the resistor 12 is attached, the heat generated by the resistor 12 is transferred to the external connection terminal 20 via the substrate 10. . Since one end of this external connection terminal 20 is exposed to the outside, heat dissipation is good, and the resistor chip 16 does not become excessively hot. Therefore, resistance value changes can be suppressed and high accuracy can be guaranteed over a wide range of usage conditions.
（発明の効果）
本発明は以上のように、外部接続端子を板状と
し、抵抗チツプの基板をこの外部接続端子に貼着
し、抵抗チツプ周囲を樹脂で外装したものである
から、抵抗チツプの熱を外部接続端子を介して外
部へ速やかに逃がすことができ、抵抗チツプが過
度に高温になるのを防止することができる。この
ため抵抗値の精度を高めることが可能になる。(Effects of the Invention) As described above, the present invention has an external connection terminal in the form of a plate, a substrate for a resistance chip attached to the external connection terminal, and a resin surrounding the resistance chip. The heat can be quickly released to the outside via the external connection terminal, and the resistor chip can be prevented from becoming excessively hot. Therefore, it becomes possible to improve the accuracy of the resistance value.
第１図は本発明の一実施例の断面図、第２図は
その組立行程を示す分解斜視図である。
１０……基板、１２……抵抗体、１８……リー
ド線、２０……外部接続端子、２６……外装樹
脂。
FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is an exploded perspective view showing the assembly process. 10... Board, 12... Resistor, 18... Lead wire, 20... External connection terminal, 26... Exterior resin.
Claims (1)
板を樹脂で外装した金属箔抵抗器において、 一端部が前記外装樹脂内で前記絶縁性基板の他
側面に密着し他端部が前記外装樹脂外へ延出した
複数の板状外部接続端子と、前記金属箔抵抗体を
これら外部接続端子に前記外装樹脂内で接続する
リード線とを備えることを特徴とする金属箔抵抗
器。[Claims] 1. A metal foil resistor in which an insulating substrate having a metal foil resistor attached to one side is sheathed with resin, wherein one end portion is tightly attached to the other side of the insulating substrate within the sheathing resin. and a plurality of plate-shaped external connection terminals whose other ends extend outside the exterior resin, and lead wires that connect the metal foil resistor to these external connection terminals within the exterior resin. metal foil resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10216286A JPS62260301A (en) | 1986-05-06 | 1986-05-06 | Metal foil resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10216286A JPS62260301A (en) | 1986-05-06 | 1986-05-06 | Metal foil resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62260301A JPS62260301A (en) | 1987-11-12 |
| JPH0252402B2 true JPH0252402B2 (en) | 1990-11-13 |
Family
ID=14320021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10216286A Granted JPS62260301A (en) | 1986-05-06 | 1986-05-06 | Metal foil resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62260301A (en) |
-
1986
- 1986-05-06 JP JP10216286A patent/JPS62260301A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62260301A (en) | 1987-11-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| RVTR | Cancellation of determination of trial for invalidation |