JPH0252213B2 - - Google Patents

Info

Publication number
JPH0252213B2
JPH0252213B2 JP18768384A JP18768384A JPH0252213B2 JP H0252213 B2 JPH0252213 B2 JP H0252213B2 JP 18768384 A JP18768384 A JP 18768384A JP 18768384 A JP18768384 A JP 18768384A JP H0252213 B2 JPH0252213 B2 JP H0252213B2
Authority
JP
Japan
Prior art keywords
lead wire
lead wires
main surface
force
detection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP18768384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6166144A (ja
Inventor
Shigeyoshi Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP18768384A priority Critical patent/JPS6166144A/ja
Publication of JPS6166144A publication Critical patent/JPS6166144A/ja
Publication of JPH0252213B2 publication Critical patent/JPH0252213B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0296—Welds

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP18768384A 1984-09-07 1984-09-07 はんだ付強度検査方法 Granted JPS6166144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18768384A JPS6166144A (ja) 1984-09-07 1984-09-07 はんだ付強度検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18768384A JPS6166144A (ja) 1984-09-07 1984-09-07 はんだ付強度検査方法

Publications (2)

Publication Number Publication Date
JPS6166144A JPS6166144A (ja) 1986-04-04
JPH0252213B2 true JPH0252213B2 (cg-RX-API-DMAC7.html) 1990-11-09

Family

ID=16210310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18768384A Granted JPS6166144A (ja) 1984-09-07 1984-09-07 はんだ付強度検査方法

Country Status (1)

Country Link
JP (1) JPS6166144A (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103149097B (zh) * 2013-03-07 2015-05-13 中国空间技术研究院 一种电子元器件管脚引线拉力测试装置

Also Published As

Publication number Publication date
JPS6166144A (ja) 1986-04-04

Similar Documents

Publication Publication Date Title
JP4414017B2 (ja) Ｉｃソケット
JPH0252213B2 (cg-RX-API-DMAC7.html)
GB2100643B (en) Wire bonder with means for detecting wire disconnection.
US5819410A (en) Method for manufacturing a pin and pipe assembly for a bare chip testing socket
JP2003086323A (ja) 絶縁切断接続の作製方法
JP3653956B2 (ja) チップ型コンデンサ用エージング治具
JP3324741B2 (ja) 端子の弾性接触片の変位量測定装置及び測定方法
US4497994A (en) Contact device for resistance spot welder
JPH01176955A (ja) 圧着不良端子検出方法
JP2901781B2 (ja) 半導体装置の検査方法
JP2001250749A (ja) コンデンサのエージング治具
JPH0760915B2 (ja) 基板装置
JPH05206233A (ja) 半導体のエージング装置
JPH06260799A (ja) 回路基板検査方法および回路基板
JPH0421105Y2 (cg-RX-API-DMAC7.html)
JP2001196721A (ja) 基板歪み計測方法および装置
JP2000180273A (ja) 荷重センサとそれを使用したワイヤハーネス加工機
JPS59206776A (ja) プリント配線板の検査装置
JPS60235074A (ja) Ｉｃ検査装置の接触子
JPH02108974A (ja) 基板用プローブ
JPS62217165A (ja) 検査用接触体
JP2002093486A (ja) 圧着端子および圧着端子の圧着検査方法
JPH01254872A (ja) 電子部品実装基板の検査方法及び検査プローブ
JPH0212070A (ja) 検査装置の製造方法
JP2002340975A (ja) 半導体部品検査装置

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term