JPH0250830A - Manufacture of electric laminated board - Google Patents
Manufacture of electric laminated boardInfo
- Publication number
- JPH0250830A JPH0250830A JP63202314A JP20231488A JPH0250830A JP H0250830 A JPH0250830 A JP H0250830A JP 63202314 A JP63202314 A JP 63202314A JP 20231488 A JP20231488 A JP 20231488A JP H0250830 A JPH0250830 A JP H0250830A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- metal plate
- laminate
- hole
- outer layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 48
- 239000002184 metal Substances 0.000 claims description 48
- 238000000465 moulding Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 239000011888 foil Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005553 drilling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本発明は、金属板を基板として用いた多層の電気積層板
に関するものである。The present invention relates to a multilayer electrical laminate using a metal plate as a substrate.
金属板2を基板とする電気積層板においては、スルーホ
ール5を形成するために孔明きの金属板2が用いられる
。すなわち、金属板2にスルーホール5を形成すべき箇
所においてスルーホール5の径よりも大きな通孔1,1
・・・を設けておぎ、この複数枚の金属板2,2・・・
をプリプレグ3を介して重ねて加熱加圧成形をおこなう
ことによって、プリプレグ3に含浸した樹脂を硬化させ
て各金属板2,2・・・を積層接着すると共にプリプレ
グ3に含浸した樹脂を金属板2の各通孔1,1・・・に
流入充填させて硬化させる。このとき第3図(a)のよ
うに各金属板2開には片面プリント配線板や両面プリン
ト配線板、多層プリント配線板などの回路板12.12
・・・を挟み込むと共に最外層に金属箔などの外層回路
体6を重ねて成形をおこなうものであり、第3図(b)
のように回路板12.12・・・を各金属板2.2・・
・間に積層すると共に最外層に外層回路体6を積層する
。そして通孔1に充填させた樹脂4の部分において第3
図(c)のようにスルーホール5を穿孔加工することに
よって、樹脂4テ金属板2との間の絶縁性が確保された
スルーホール5を形成することができるのである。この
のちに、外層回路体6をエツチング加工して回路形成を
すると共にスルーホール5内にスルーホールメツキを施
すことによって、多層の金属板2を基板とし、外層回路
体6の外層回路と回路板12゜12・・・の内層回路と
で多層の回路を形成した多層配線板に仕上げることがで
きる。In an electrical laminate using a metal plate 2 as a substrate, a perforated metal plate 2 is used to form through holes 5. That is, at the location where the through hole 5 is to be formed in the metal plate 2, the through hole 1, 1 is larger in diameter than the through hole 5.
... is provided, and these plural metal plates 2, 2...
By stacking them with the prepreg 3 interposed therebetween and performing heat and pressure molding, the resin impregnated in the prepreg 3 is cured, and each metal plate 2, 2... is laminated and bonded, and the resin impregnated in the prepreg 3 is bonded to the metal plate. 2 is injected into each of the through holes 1, 1, . . . and cured. At this time, as shown in FIG. 3(a), each metal plate 2 has a circuit board 12.12 such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board.
. . , and overlay an outer layer circuit body 6 such as metal foil on the outermost layer, as shown in Fig. 3(b).
Connect the circuit board 12.12... to each metal plate 2.2...
・The outer layer circuit body 6 is laminated on the outermost layer. Then, in the part of the resin 4 filled in the through hole 1, a third
By drilling the through hole 5 as shown in FIG. 3(c), it is possible to form the through hole 5 in which insulation between the resin 4 and the metal plate 2 is ensured. Thereafter, by etching the outer layer circuit body 6 to form a circuit and plating the insides of the through holes 5, the multilayer metal plate 2 is used as a substrate, and the outer layer circuit of the outer layer circuit body 6 and the circuit board are formed. It is possible to finish a multilayer wiring board in which a multilayer circuit is formed with 12°12... inner layer circuits.
しかし、第3図(b)のように成形をおこなうにあたっ
て、最外層の金属板2の外側に積層したプリプレグ3に
含まれる樹脂のうち多くのものが金属板2の通孔1内に
流入するために、第4図に示すように通孔1の部分にお
いて表面にくぼみ13が発生し、外層回路体6にもくぼ
み13が及ぶことになる。外層回路体6として銅箔など
の金属箔を用いる場合にはこのくぼみ13は特に大きく
影響する。そしてこのように外層回路体6にくばみ13
によって凹凸が生じると、エツチングレジストの塗布な
どが正確におこなうことができなくなり、外層用の回路
を精密に形成することが困難になる等の問題が生じる。
本発明は上記の点に鑑みて為されたものであり、凹凸が
生じるようなことなく外層回路体の積層をおこなうこと
かできる電気積層板の製造方法を提供することを目的と
するものである。However, when forming as shown in FIG. 3(b), much of the resin contained in the prepreg 3 laminated on the outside of the outermost metal plate 2 flows into the through hole 1 of the metal plate 2. Therefore, as shown in FIG. 4, a depression 13 is generated on the surface in the area of the through hole 1, and the depression 13 extends to the outer layer circuit body 6 as well. When a metal foil such as copper foil is used as the outer layer circuit body 6, the recess 13 has a particularly large effect. Then, in this way, the outer layer circuit body 6 is provided with an opening 13.
If unevenness occurs due to this, it becomes impossible to apply etching resist accurately, causing problems such as making it difficult to precisely form circuits for the outer layer. The present invention has been made in view of the above points, and it is an object of the present invention to provide a method for manufacturing an electrical laminate that allows lamination of outer layer circuit bodies without causing unevenness. .
上記課題を解決するために本発明に係る電気積層板の製
造方法は、通孔1を設けた複数枚の金属板2をプリプレ
グ3aを介して重ねると共に最外層の金属板2の外面に
プリプレグ3aを重ね、加熱加圧成形してプリプレグ3
aに含浸した樹脂を硬化させて各金属板2を積層接着す
ると共にプリプレグ3aに含浸した樹脂を金属板2の各
通孔1に流入光qtさせて一次積層品7を作成し、次に
この一次積層品7の表面を研摩した後にプリプレグ3b
を介して外層回路体6を重ね、加熱加圧成形してこのプ
リプレグ3bに含浸した樹脂を硬化させて一次積層品7
の表面に外層回路体6を積層することによって二次積層
品8を作成し、しかる後にこの二次積層品8において通
孔1内の樹脂4の部分でスルーホール5を穿孔加工する
ことを特徴とするものである。In order to solve the above problems, the method for manufacturing an electrical laminate according to the present invention includes stacking a plurality of metal plates 2 provided with through holes 1 with prepregs 3a interposed therebetween, and forming a prepreg 3a on the outer surface of the outermost metal plate 2. are stacked and heated and press-molded to form prepreg 3.
The resin impregnated in the prepreg 3a is cured and each metal plate 2 is laminated and bonded, and the resin impregnated in the prepreg 3a is allowed to flow into each through hole 1 of the metal plate 2 to create a primary laminate 7. After polishing the surface of the primary laminate 7, the prepreg 3b
The outer layer circuit body 6 is layered via the prepreg 3b, and the resin impregnated into the prepreg 3b is hardened by heating and pressure molding to form the primary laminate 7.
A secondary laminate product 8 is created by laminating an outer layer circuit body 6 on the surface of the secondary laminate product 8, and then a through hole 5 is punched in the resin 4 portion within the through hole 1 in the secondary laminate product 8. That is.
金属板2の通孔1への樹脂の流入で一次積層品7の表面
にくぼみが生じても、このくぼみは−次積層品7の表面
を研摩することによって消失され、二次の成形で積層す
る外層回路体6にくぼみが影響を及ぼすことがなくなる
。Even if a dent is formed on the surface of the primary laminate 7 due to the resin flowing into the through hole 1 of the metal plate 2, this dent will be removed by polishing the surface of the second laminate 7, and the laminate will be removed in the secondary molding. The depression will no longer affect the outer layer circuit body 6.
以下本発明を実施例によって詳述する。
金属板2は銅板やアルミニウム板などで形成されもので
あり、スルーホール5を形成する箇所において通孔1が
穿設加工しである。通孔1はスルーホール5の直径より
も大きな直径で形成されるものである。またプリプレグ
3 a、 3 bはガラス布や紙などを基材とし、これ
にエポキシ樹脂やボリイミ+ζなどの熱硬化性樹脂を含
浸して乾燥することによって調製されるものである。こ
こでプリプレグ3 a、 3 bとしては、−次積層で
用いるプリプレグ3aと二次積層で用いるプリプレグ3
1)とがあるが、−次積層で用いるプリプレグ3aには
ガラス粉末やアルミナなどの無機充填材を含有させるよ
うにするのが好ましい。二次積層で用いるプリプレグ3
+3には充填材を含有させる必要はないが、含有させ
ることを否定するものではない。
しかして金属板2を基板とする電気積層板を製造するに
あたっては、$1図(a)乃至(e)の手順でおこなう
ことができる。まず、tJIJ1図(a)のようにプリ
プレグ3 a、3 a・・・を介して金属板2,2・・
・を数枚重ねると共に最外層の金属板2の外面にプリプ
レグ3aを重ねる。このとき各金属板2間にはプリプレ
グ3aを介して片面プリント配線板や両面プリント配線
板、多層プリント配線板など内層用回路を形成した回路
板12.12・・・がセットしである。そしてこれを加
熱加圧成形することにょって、プリプレグ3aに含浸し
た樹脂を硬化させて各金属板2と回路板12とを交互に
積層接着させると共に、プリプレグ3aに含浸した樹脂
の一部を金属板2の各通孔1内に流入させて第1図(b
)のようにこの樹脂4を通孔1内に充填させる。このよ
うにして作成される一次積層品7にあって、最外層の金
属板2の外側に積層したプリプレグ3aに含まれる樹脂
のうち、金属板2の通孔1に対応する箇所の樹脂は通孔
1内に流入するために、第2図(、)に示すように通孔
1の部分において一次積層品7の表面にはくぼみ13が
発生する。
次にこの一次積層品7の表面のプリプレグ3aの硬化樹
脂層を研摩する。このように研摩することによって第2
図(b)のようにくぽみ13以外の箇所が除去されて、
くばみ13は消失することになる。研摩してくばみ13
を消失させたのちに、この−次積層品7の表面に第1図
(c)のようにプリプレグ31〕を介して外層回路体6
を重ね、これを加熱加圧成形することによってプリプレ
グ3bに含浸した樹脂を硬化させて一次積層品7の表面
に外層回路体6を積層接着させ、第1図(d)に示すよ
うな二次積層品8を作成する。外層回路体6としては、
銅箔などの金属箔が主として用いられるが、その他片面
金属箔張り積層板、片面プリント配線板、両面プリント
配線板、多層プリント配線板などを用いることができる
。この二次積層品8にあって、−次積層品7のくばみ1
3を消失させた状態で外層回路体6の積層をおこなって
いるために、第2図(c)のように外層回路体6は平ら
な状態で積層されている。
このように作成した二次積層品8において、ドリル加工
やパンチ加工などでスルーホール5を穿孔加工すること
によって本発明に係る電気積層板を得ることができる。
スルーホール5は第1図(e)に示すように、通孔1に
充填した樹脂4の部分において通孔1の直径よりも小さ
い直径で形成されるものであり、従ってスルーホール5
の内周と金属板2との間の電気絶縁性は樹脂4によって
確保されることになる。尚、スルーホール5のうち一部
のものはアースなどのために金属板2を貫通して形成さ
れている。上記のようにスルーホール5を加工したのち
に、スルーホール5の内周に銅メツキなどでスルーホー
ルメツキを形成したり、外層回路体6が金属箔や金属箔
張り積層板で形成されているときには金属箔をエツチン
グ処理して外層回路を形成したりすることによって、多
層の金属板2をコアとし回路板12による内層回路と外
層回路体6による外層回路とを多層に設けた電気回路板
に仕上げるのである。ここで、プリプレグ3aには充填
材が含有されているために金属板2の通孔1に充填され
る樹脂4中にはこの充填材が混入されているものであり
、スルーホール5を加工する際にスルーホール5の内周
面に充填材が露出してスルーホール5の内周面が凹凸面
となるようにしてあり、スルーホール5の内周面に施す
スルーホールメツキの密着性が高まるようにしである。The present invention will be explained in detail below with reference to Examples. The metal plate 2 is made of a copper plate, an aluminum plate, or the like, and has through holes 1 formed therein at locations where through holes 5 are to be formed. The through hole 1 is formed with a diameter larger than that of the through hole 5. Further, the prepregs 3a and 3b are prepared by using glass cloth, paper, or the like as a base material, impregnating it with a thermosetting resin such as epoxy resin or Boliimi+ζ, and drying the impregnated resin. Here, the prepregs 3a and 3b include prepreg 3a used in -order lamination and prepreg 3 used in secondary lamination.
1), it is preferable that the prepreg 3a used in the second lamination contains an inorganic filler such as glass powder or alumina. Prepreg 3 used in secondary lamination
+3 does not need to contain a filler, but this does not negate its inclusion. Thus, in manufacturing an electrical laminate using the metal plate 2 as a substrate, the steps shown in FIGS. 1(a) to 1(e) can be followed. First, as shown in Figure tJIJ1 (a), the metal plates 2, 2...
・Layer several sheets of prepreg 3a on the outer surface of the outermost metal plate 2. At this time, circuit boards 12, 12, etc., each having an inner layer circuit formed thereon, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, are set between each metal plate 2 via a prepreg 3a. By heating and press-molding this, the resin impregnated into the prepreg 3a is cured and the metal plates 2 and the circuit board 12 are alternately laminated and bonded, and a part of the resin impregnated into the prepreg 3a is cured. FIG. 1(b)
) The resin 4 is filled into the through hole 1 as shown in FIG. In the primary laminate 7 created in this way, of the resin contained in the prepreg 3a laminated on the outside of the outermost metal plate 2, the resin in the portions corresponding to the through holes 1 of the metal plate 2 is transparent. In order to flow into the hole 1, a depression 13 is generated on the surface of the primary laminate 7 in the area of the through hole 1, as shown in FIG. 2(,). Next, the cured resin layer of the prepreg 3a on the surface of this primary laminate 7 is polished. By polishing in this way, the second
As shown in figure (b), parts other than the hollow 13 are removed,
Kubami 13 will disappear. Polish and brush 13
After disappearing, an outer layer circuit body 6 is applied to the surface of this -order laminate 7 via a prepreg 31 as shown in FIG. 1(c).
The resin impregnated into the prepreg 3b is cured by heating and pressure molding, and the outer layer circuit body 6 is laminated and bonded to the surface of the primary laminate 7, thereby forming a secondary laminate as shown in FIG. 1(d). A laminate 8 is created. As the outer layer circuit body 6,
Metal foil such as copper foil is mainly used, but other materials such as a single-sided metal foil clad laminate, a single-sided printed wiring board, a double-sided printed wiring board, and a multilayer printed wiring board can also be used. In this secondary laminate product 8, the width 1 of the -th order laminate product 7 is
Since the outer layer circuit body 6 is laminated with the outer layer 3 removed, the outer layer circuit body 6 is laminated in a flat state as shown in FIG. 2(c). The electrical laminate according to the present invention can be obtained by drilling the through holes 5 in the secondary laminate 8 produced in this manner by drilling, punching, or the like. As shown in FIG. 1(e), the through hole 5 is formed with a smaller diameter than the diameter of the through hole 1 in the portion of the resin 4 filled in the through hole 1. Therefore, the through hole 5
Electrical insulation between the inner periphery of the metal plate 2 and the metal plate 2 is ensured by the resin 4. Note that some of the through holes 5 are formed to penetrate the metal plate 2 for grounding purposes. After processing the through hole 5 as described above, through hole plating is formed on the inner periphery of the through hole 5 with copper plating or the like, and the outer layer circuit body 6 is formed of metal foil or a metal foil covered laminate. Sometimes, by etching the metal foil to form an outer layer circuit, an electric circuit board is formed in which the multilayer metal plate 2 is the core and the inner layer circuit of the circuit board 12 and the outer layer circuit of the outer layer circuit body 6 are provided in multiple layers. Finish it. Here, since the prepreg 3a contains a filler, this filler is mixed in the resin 4 filled into the through hole 1 of the metal plate 2, and the through hole 5 is processed. At this time, the filler material is exposed on the inner circumferential surface of the through hole 5, and the inner circumferential surface of the through hole 5 becomes an uneven surface, which increases the adhesion of the through hole plating applied to the inner circumferential surface of the through hole 5. That's how it is.
上述のように本発明にあっては、通孔を設けた複数枚の
金属板をプリプレグを介して重ねると共に最外層の金属
板の外面にプリプレグを重ね、加熱加圧成形してプリプ
レグに含浸した樹脂を硬化させて各金属板を積層接着す
ると共にプリプレグに含浸した樹脂を金属板の各通孔に
流入充填させて一次積層品を作成し、次にこの一次積層
品の表面を研摩した後にプリプレグを介して外層回路体
を重ね、加熱加圧成形してこのプリプレグに含浸した樹
脂を硬化させて一次積層品の表面に外層回路体を積層す
ることによって二次積層品を作成するようにしたので、
金属板の通孔への樹脂の流入で一次積層品の表面にくぼ
みが生じても、このくぼみは−次積層品の表面の研摩で
消失させることかでト、二次積層品において外層回路体
に凹凸が生じることを防止することができるもの□であ
り、外層回路体の回路形成に問題が生じたりするおそれ
がなくなるものである。As described above, in the present invention, a plurality of metal plates provided with through holes are stacked with prepreg interposed therebetween, and prepreg is stacked on the outer surface of the outermost metal plate, and the prepreg is impregnated by heating and pressure forming. The resin is cured and each metal plate is laminated and bonded, and the resin impregnated into the prepreg is flowed and filled into each through hole of the metal plate to create a primary laminate.Then, the surface of this primary laminate is polished, and then the prepreg is bonded. A secondary laminate product is created by overlapping the outer layer circuit body through the prepreg and curing the resin impregnated into this prepreg by heating and pressure molding and laminating the outer layer circuit body on the surface of the primary laminate product. ,
Even if depressions are formed on the surface of the primary laminate due to the resin flowing into the holes in the metal plate, these dents can be removed by polishing the surface of the secondary laminate. It is possible to prevent unevenness from occurring on the outer layer circuit body, and there is no possibility of problems occurring in circuit formation of the outer layer circuit body.
第1、図(a)乃至(e)は本発明における電気積層板
の製造の各工程を示す断面図、第2図(t)(b)(c
)は同上の一部の拡大断面図で同図(a)は第1図(b
)のイ部分の拡大図、同図(c)は第1図(d)の口部
分の拡大図、第3図(a)(bHc)は従来例の断面図
、第4図は第3図(b)のハ部分の拡大図である。
1は通孔、2は金属板、3a、3bはプリプレグ、4は
通孔内の樹脂、5はスルーホール、6は外層回路体、7
は一次積層品、8は二次積層品である。1. Figures (a) to (e) are cross-sectional views showing each step of manufacturing the electrical laminate according to the present invention, and Figures 2 (t), (b), and (c).
) is an enlarged cross-sectional view of a part of the same as above, and figure (a) is the same as figure 1 (b).
), FIG. 4(c) is an enlarged view of the mouth portion of FIG. 1(d), FIGS. 3(a) and (bHc) are cross-sectional views of the conventional example, and FIG. 4 is FIG. It is an enlarged view of part C of (b). 1 is a through hole, 2 is a metal plate, 3a and 3b are prepregs, 4 is resin in the through hole, 5 is a through hole, 6 is an outer layer circuit body, 7
8 is a primary laminate product, and 8 is a secondary laminate product.
Claims (1)
て重ねると共に最外層の金属板の外面にプリプレグを重
ね、加熱加圧成形してプリプレグに含浸した樹脂を硬化
させて各金属板を積層接着すると共にプリプレグに含浸
した樹脂を金属板の各通孔に流入充填させて一次積層品
を作成し、次にこの一次積層品の表面を研摩した後にプ
リプレグを介して外層回路体を重ね、加熱加圧成形して
このプリプレグに含浸した樹脂を硬化させて一次積層品
の表面に外層回路体を積層することによって二次積層品
を作成し、しかる後にこの二次積層品において通孔内の
樹脂の部分でスルーホールを穿孔加工することを特徴と
する電気積層板の製造方法。(1) Layer multiple metal plates with through holes through prepreg, layer the prepreg on the outer surface of the outermost metal plate, and heat and pressure mold to harden the resin impregnated into the prepreg to harden each metal plate. A primary laminate is created by laminating and adhering the prepreg and filling each hole in the metal plate with resin impregnated with the prepreg.Then, after polishing the surface of this primary laminate, an outer circuit body is layered via the prepreg. A secondary laminate is created by heat-pressing molding to harden the resin impregnated into this prepreg and laminating an outer layer circuit body on the surface of the primary laminate. 1. A method for manufacturing an electrical laminate, comprising punching through holes in a resin part of the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63202314A JPH0250830A (en) | 1988-08-12 | 1988-08-12 | Manufacture of electric laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63202314A JPH0250830A (en) | 1988-08-12 | 1988-08-12 | Manufacture of electric laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0250830A true JPH0250830A (en) | 1990-02-20 |
Family
ID=16455494
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63202314A Pending JPH0250830A (en) | 1988-08-12 | 1988-08-12 | Manufacture of electric laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0250830A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020070386A (en) * | 2018-11-01 | 2020-05-07 | 株式会社ディスコ | Production method of core material and production method of copper-clad laminate plate |
-
1988
- 1988-08-12 JP JP63202314A patent/JPH0250830A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020070386A (en) * | 2018-11-01 | 2020-05-07 | 株式会社ディスコ | Production method of core material and production method of copper-clad laminate plate |
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