JPH025027B2 - - Google Patents

Info

Publication number
JPH025027B2
JPH025027B2 JP58065584A JP6558483A JPH025027B2 JP H025027 B2 JPH025027 B2 JP H025027B2 JP 58065584 A JP58065584 A JP 58065584A JP 6558483 A JP6558483 A JP 6558483A JP H025027 B2 JPH025027 B2 JP H025027B2
Authority
JP
Japan
Prior art keywords
hole
holes
wiring
chip
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58065584A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59193094A (ja
Inventor
Akizo Toda
Takashi Kuroki
Takeshi Fujita
Shosaku Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58065584A priority Critical patent/JPS59193094A/ja
Publication of JPS59193094A publication Critical patent/JPS59193094A/ja
Publication of JPH025027B2 publication Critical patent/JPH025027B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP58065584A 1983-04-15 1983-04-15 多層セラミツク基板 Granted JPS59193094A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58065584A JPS59193094A (ja) 1983-04-15 1983-04-15 多層セラミツク基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065584A JPS59193094A (ja) 1983-04-15 1983-04-15 多層セラミツク基板

Publications (2)

Publication Number Publication Date
JPS59193094A JPS59193094A (ja) 1984-11-01
JPH025027B2 true JPH025027B2 (enrdf_load_html_response) 1990-01-31

Family

ID=13291198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58065584A Granted JPS59193094A (ja) 1983-04-15 1983-04-15 多層セラミツク基板

Country Status (1)

Country Link
JP (1) JPS59193094A (enrdf_load_html_response)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6196548U (enrdf_load_html_response) * 1984-11-30 1986-06-21
JP4573185B2 (ja) * 2007-10-18 2010-11-04 日立金属株式会社 セラミック積層基板ならびにセラミック積層電子部品の製造方法
JP5397744B2 (ja) * 2009-01-23 2014-01-22 日立金属株式会社 多層セラミック基板およびこれを用いた電子部品並びに多層セラミック基板の製造方法
WO2015170539A1 (ja) * 2014-05-08 2015-11-12 株式会社村田製作所 樹脂多層基板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5231031B2 (enrdf_load_html_response) * 1973-06-30 1977-08-12
JPS564424Y2 (enrdf_load_html_response) * 1976-06-22 1981-01-30
JPS5613798A (en) * 1979-07-13 1981-02-10 Hitachi Ltd Multilayer hybrid ic
JPS6127541U (ja) * 1984-07-20 1986-02-19 三菱重工業株式会社 砂型中子

Also Published As

Publication number Publication date
JPS59193094A (ja) 1984-11-01

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