JPH025021B2 - - Google Patents
Info
- Publication number
- JPH025021B2 JPH025021B2 JP12496985A JP12496985A JPH025021B2 JP H025021 B2 JPH025021 B2 JP H025021B2 JP 12496985 A JP12496985 A JP 12496985A JP 12496985 A JP12496985 A JP 12496985A JP H025021 B2 JPH025021 B2 JP H025021B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wiring board
- printed wiring
- carrier
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 63
- 239000007788 liquid Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12496985A JPS61283194A (ja) | 1985-06-08 | 1985-06-08 | はんだ塗布装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12496985A JPS61283194A (ja) | 1985-06-08 | 1985-06-08 | はんだ塗布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61283194A JPS61283194A (ja) | 1986-12-13 |
| JPH025021B2 true JPH025021B2 (cg-RX-API-DMAC7.html) | 1990-01-31 |
Family
ID=14898699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12496985A Granted JPS61283194A (ja) | 1985-06-08 | 1985-06-08 | はんだ塗布装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61283194A (cg-RX-API-DMAC7.html) |
-
1985
- 1985-06-08 JP JP12496985A patent/JPS61283194A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61283194A (ja) | 1986-12-13 |
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