JPH024998B2 - - Google Patents
Info
- Publication number
- JPH024998B2 JPH024998B2 JP4028581A JP4028581A JPH024998B2 JP H024998 B2 JPH024998 B2 JP H024998B2 JP 4028581 A JP4028581 A JP 4028581A JP 4028581 A JP4028581 A JP 4028581A JP H024998 B2 JPH024998 B2 JP H024998B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive
- cable
- semiconductive
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012212 insulator Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007751 thermal spraying Methods 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 description 12
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 229920002545 silicone oil Polymers 0.000 description 3
- 238000013021 overheating Methods 0.000 description 2
- 238000009718 spray deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000007500 overflow downdraw method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4028581A JPS57157477A (en) | 1981-03-23 | 1981-03-23 | Method of forming cable connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4028581A JPS57157477A (en) | 1981-03-23 | 1981-03-23 | Method of forming cable connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57157477A JPS57157477A (en) | 1982-09-29 |
JPH024998B2 true JPH024998B2 (xx) | 1990-01-31 |
Family
ID=12576333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4028581A Granted JPS57157477A (en) | 1981-03-23 | 1981-03-23 | Method of forming cable connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57157477A (xx) |
-
1981
- 1981-03-23 JP JP4028581A patent/JPS57157477A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57157477A (en) | 1982-09-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4598165A (en) | Conformable electromagnetic shield | |
JP2005527962A (ja) | シールドストリップを備えたケーブル | |
JPH0388286A (ja) | 熱収縮性物品とその形成方法 | |
JPH024998B2 (xx) | ||
GB2036460A (en) | Enclosure for cable termination or joint | |
GB2111769A (en) | Enclosure for cable termination or joint | |
JPH021776Y2 (xx) | ||
JP3171657B2 (ja) | ケーブル接続端部 | |
JPS58130711A (ja) | プラスチツク絶縁電力ケ−ブルの絶縁補強部の構成法 | |
JPS59198817A (ja) | 架橋ゴム・プラスチック絶縁ケーブル接続部の形成方法 | |
JP2639649B2 (ja) | 電力ケーブルの接続部の形成方法 | |
JPS6116589Y2 (xx) | ||
JPH06215642A (ja) | 耐熱性ケーブル | |
JPH04347519A (ja) | ストレスコーン | |
JP3273701B2 (ja) | 電力ケーブル | |
JPS6322615Y2 (xx) | ||
JP2706323B2 (ja) | 架橋ポリエチレン電力ケーブルの接続方法 | |
JPH0124856Y2 (xx) | ||
JPH0130839Y2 (xx) | ||
JP2840837B2 (ja) | ケーブルのモールドジョイント工法 | |
JP2000059976A (ja) | 架橋ポリエチレン絶縁電力ケーブル接続部 | |
JP2550908Y2 (ja) | ガスライター用パイプ | |
JPS58192424A (ja) | プラスチツク絶縁ケ−ブル接続部 | |
JPS5854837Y2 (ja) | ケ−ブル終端部 | |
JPH0419766B2 (xx) |