JPH0249983B2 - - Google Patents
Info
- Publication number
- JPH0249983B2 JPH0249983B2 JP60062287A JP6228785A JPH0249983B2 JP H0249983 B2 JPH0249983 B2 JP H0249983B2 JP 60062287 A JP60062287 A JP 60062287A JP 6228785 A JP6228785 A JP 6228785A JP H0249983 B2 JPH0249983 B2 JP H0249983B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- storage
- electronic component
- cover tape
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062287A JPS61232171A (ja) | 1985-03-27 | 1985-03-27 | 電子部品連 |
| US06/828,021 US4736841A (en) | 1985-02-20 | 1986-02-10 | Electronic component series |
| DE19863605491 DE3605491A1 (de) | 1985-02-20 | 1986-02-20 | Reihenanordnung elektronischer bauelemente |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062287A JPS61232171A (ja) | 1985-03-27 | 1985-03-27 | 電子部品連 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61232171A JPS61232171A (ja) | 1986-10-16 |
| JPH0249983B2 true JPH0249983B2 (h) | 1990-10-31 |
Family
ID=13195751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60062287A Granted JPS61232171A (ja) | 1985-02-20 | 1985-03-27 | 電子部品連 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61232171A (h) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0259170U (h) * | 1988-10-26 | 1990-04-27 | ||
| JP2795680B2 (ja) * | 1989-06-06 | 1998-09-10 | 大日本印刷株式会社 | 電子部品搬送体の底材製造方法 |
| JPH0664659A (ja) * | 1992-08-17 | 1994-03-08 | Nec Corp | 半導体装置用エンボステープ |
| JP7118502B2 (ja) * | 2018-03-29 | 2022-08-16 | 太陽誘電株式会社 | 電子部品包装体及び電子部品包装体の剥離方法 |
-
1985
- 1985-03-27 JP JP60062287A patent/JPS61232171A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61232171A (ja) | 1986-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |