JPH0249758Y2 - - Google Patents
Info
- Publication number
- JPH0249758Y2 JPH0249758Y2 JP10443988U JP10443988U JPH0249758Y2 JP H0249758 Y2 JPH0249758 Y2 JP H0249758Y2 JP 10443988 U JP10443988 U JP 10443988U JP 10443988 U JP10443988 U JP 10443988U JP H0249758 Y2 JPH0249758 Y2 JP H0249758Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- insulating resin
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000004840 adhesive resin Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10443988U JPH0249758Y2 (US07534539-20090519-C00280.png) | 1988-08-06 | 1988-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10443988U JPH0249758Y2 (US07534539-20090519-C00280.png) | 1988-08-06 | 1988-08-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0226298U JPH0226298U (US07534539-20090519-C00280.png) | 1990-02-21 |
| JPH0249758Y2 true JPH0249758Y2 (US07534539-20090519-C00280.png) | 1990-12-27 |
Family
ID=31336154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10443988U Expired JPH0249758Y2 (US07534539-20090519-C00280.png) | 1988-08-06 | 1988-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249758Y2 (US07534539-20090519-C00280.png) |
-
1988
- 1988-08-06 JP JP10443988U patent/JPH0249758Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226298U (US07534539-20090519-C00280.png) | 1990-02-21 |
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