JPH0249732Y2 - - Google Patents
Info
- Publication number
- JPH0249732Y2 JPH0249732Y2 JP1982069197U JP6919782U JPH0249732Y2 JP H0249732 Y2 JPH0249732 Y2 JP H0249732Y2 JP 1982069197 U JP1982069197 U JP 1982069197U JP 6919782 U JP6919782 U JP 6919782U JP H0249732 Y2 JPH0249732 Y2 JP H0249732Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- semiconductor
- diode
- pellets
- conductivity type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982069197U JPS58173249U (ja) | 1982-05-12 | 1982-05-12 | 高圧ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982069197U JPS58173249U (ja) | 1982-05-12 | 1982-05-12 | 高圧ダイオ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58173249U JPS58173249U (ja) | 1983-11-19 |
JPH0249732Y2 true JPH0249732Y2 (enrdf_load_html_response) | 1990-12-27 |
Family
ID=30078934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982069197U Granted JPS58173249U (ja) | 1982-05-12 | 1982-05-12 | 高圧ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58173249U (enrdf_load_html_response) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5557571B2 (ja) * | 2010-03-29 | 2014-07-23 | 新電元工業株式会社 | ダイオードモジュール |
US8530902B2 (en) * | 2011-10-26 | 2013-09-10 | General Electric Company | System for transient voltage suppressors |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4995585A (enrdf_load_html_response) * | 1973-01-12 | 1974-09-10 | ||
JPS5832507B2 (ja) * | 1975-05-16 | 1983-07-13 | 三菱電機株式会社 | 半導体装置の製造方法 |
JPS5827347B2 (ja) * | 1975-08-26 | 1983-06-08 | カブシキガイシヤ カタヤマカガクコウギヨウケンキユウシヨ | ジユンカンケイコウノウシユクスイヨウボウシヨクザイ |
US4047196A (en) * | 1976-08-24 | 1977-09-06 | Rca Corporation | High voltage semiconductor device having a novel edge contour |
-
1982
- 1982-05-12 JP JP1982069197U patent/JPS58173249U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58173249U (ja) | 1983-11-19 |
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