JPH0249731Y2 - - Google Patents
Info
- Publication number
- JPH0249731Y2 JPH0249731Y2 JP1984187596U JP18759684U JPH0249731Y2 JP H0249731 Y2 JPH0249731 Y2 JP H0249731Y2 JP 1984187596 U JP1984187596 U JP 1984187596U JP 18759684 U JP18759684 U JP 18759684U JP H0249731 Y2 JPH0249731 Y2 JP H0249731Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- hole
- semiconductor
- wiring board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000007789 sealing Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000002184 metal Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187596U JPH0249731Y2 (US07943777-20110517-C00090.png) | 1984-12-11 | 1984-12-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984187596U JPH0249731Y2 (US07943777-20110517-C00090.png) | 1984-12-11 | 1984-12-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102074U JPS61102074U (US07943777-20110517-C00090.png) | 1986-06-28 |
| JPH0249731Y2 true JPH0249731Y2 (US07943777-20110517-C00090.png) | 1990-12-27 |
Family
ID=30745058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984187596U Expired JPH0249731Y2 (US07943777-20110517-C00090.png) | 1984-12-11 | 1984-12-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249731Y2 (US07943777-20110517-C00090.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057278A (ja) * | 2000-08-14 | 2002-02-22 | Niigata Seimitsu Kk | チューナ装置 |
-
1984
- 1984-12-11 JP JP1984187596U patent/JPH0249731Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61102074U (US07943777-20110517-C00090.png) | 1986-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5869889A (en) | Thin power tape ball grid array package | |
| US5473190A (en) | Tab tape | |
| JPH0462866A (ja) | 表面実装部品の実装方法 | |
| JPH0249731Y2 (US07943777-20110517-C00090.png) | ||
| US6057594A (en) | High power dissipating tape ball grid array package | |
| JPH0451064B2 (US07943777-20110517-C00090.png) | ||
| JPH02146792A (ja) | 半導体装置の実装構造 | |
| JP2828753B2 (ja) | 混成集積回路装置 | |
| JP2572421Y2 (ja) | チップｌｅｄ | |
| US6380613B1 (en) | Semiconductor device | |
| JPH10150065A (ja) | チップサイズパッケージ | |
| JPH07263869A (ja) | 電子部品搭載用基板及びその製造方法 | |
| JPH0442930Y2 (US07943777-20110517-C00090.png) | ||
| JP2865400B2 (ja) | 混成集積回路装置 | |
| JPH0631723Y2 (ja) | 半導体装置 | |
| JPH0648876Y2 (ja) | 半導体装置 | |
| JPS5977243U (ja) | 半導体装置 | |
| JPH0648875Y2 (ja) | 半導体装置 | |
| JPH0451488Y2 (US07943777-20110517-C00090.png) | ||
| JPS6146769U (ja) | 電子回路形成チツプ搭載装置 | |
| JPH03120749A (ja) | 半導体素子パッケージ | |
| JPH0430459A (ja) | 高出力用混成集積回路装置 | |
| JPS602863U (ja) | 電力素子実装用基板 | |
| JPS5846473U (ja) | 印刷配線パタ−ン | |
| JPS58173239U (ja) | 半導体装置 |
