JPH0249701Y2 - - Google Patents
Info
- Publication number
- JPH0249701Y2 JPH0249701Y2 JP3723185U JP3723185U JPH0249701Y2 JP H0249701 Y2 JPH0249701 Y2 JP H0249701Y2 JP 3723185 U JP3723185 U JP 3723185U JP 3723185 U JP3723185 U JP 3723185U JP H0249701 Y2 JPH0249701 Y2 JP H0249701Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electrode plate
- terminal
- insulating plate
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 14
- 239000004020 conductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3723185U JPH0249701Y2 (de) | 1985-03-15 | 1985-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3723185U JPH0249701Y2 (de) | 1985-03-15 | 1985-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61153334U JPS61153334U (de) | 1986-09-22 |
| JPH0249701Y2 true JPH0249701Y2 (de) | 1990-12-27 |
Family
ID=30543126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3723185U Expired JPH0249701Y2 (de) | 1985-03-15 | 1985-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249701Y2 (de) |
-
1985
- 1985-03-15 JP JP3723185U patent/JPH0249701Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61153334U (de) | 1986-09-22 |
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