JPH0249649B2 - - Google Patents

Info

Publication number
JPH0249649B2
JPH0249649B2 JP58076108A JP7610883A JPH0249649B2 JP H0249649 B2 JPH0249649 B2 JP H0249649B2 JP 58076108 A JP58076108 A JP 58076108A JP 7610883 A JP7610883 A JP 7610883A JP H0249649 B2 JPH0249649 B2 JP H0249649B2
Authority
JP
Japan
Prior art keywords
lead
energy beam
circuit board
printed circuit
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58076108A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59202048A (ja
Inventor
Akio Kojima
Mitsugi Shirai
Hideaki Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58076108A priority Critical patent/JPS59202048A/ja
Publication of JPS59202048A publication Critical patent/JPS59202048A/ja
Publication of JPH0249649B2 publication Critical patent/JPH0249649B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58076108A 1983-05-02 1983-05-02 電子部品の接続状態検査方法 Granted JPS59202048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58076108A JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58076108A JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Publications (2)

Publication Number Publication Date
JPS59202048A JPS59202048A (ja) 1984-11-15
JPH0249649B2 true JPH0249649B2 (https=) 1990-10-30

Family

ID=13595696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58076108A Granted JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Country Status (1)

Country Link
JP (1) JPS59202048A (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391541A (ja) * 1986-10-06 1988-04-22 Fujitsu Ltd プリント板装置の半田付け個所検査方法
JPS6391542A (ja) * 1986-10-07 1988-04-22 Matsushita Electric Ind Co Ltd ハンダ付け検査装置
JPH0430464U (https=) * 1990-07-09 1992-03-11
JP2960301B2 (ja) * 1994-06-27 1999-10-06 仲田 周次 回路素子接合部の検査方法
CN120703115A (zh) * 2025-06-16 2025-09-26 四川易创芯电子科技有限公司 一种pcb锡膏印刷结果监测方法、系统、设备及介质

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5578945U (https=) * 1978-11-24 1980-05-30

Also Published As

Publication number Publication date
JPS59202048A (ja) 1984-11-15

Similar Documents

Publication Publication Date Title
US5208528A (en) Method for inspecting a populated printed circuit board, particularly for inspecting solder joints on the board and a system for working this method
JPH09166422A (ja) バンプ接合検査装置及び検査方法
US7637413B2 (en) X-ray inspection device and X-ray inspection method
JPH0499950A (ja) 半田付検査装置
JP3011401B2 (ja) 上側治具位置決め機構付きプリント基板検査装置および上側治具位置決め方法
JPH0249649B2 (https=)
JPS63305238A (ja) 電子部品の接合部検査方法
JPH0290645A (ja) 撮像素子の検査方法及びそれに使用する検査装置
JP3124535B2 (ja) 表面実装部品検査装置
JP3500364B2 (ja) 電子部品検査方法，電子部品検査装置及び電子部品検査プログラム
JP4796232B2 (ja) 半田高さ計測方法およびその装置
JP3080158B2 (ja) プリント基板の検査方法及び検査装置
JP2560462B2 (ja) 膜厚測定装置
JPH0557521B2 (https=)
JP2945177B2 (ja) 入出力用ピンの形状検査方法および装置ならびに電子回路基板の製造方法
JP2004138442A (ja) 回路基板の精度測定装置および回路基板検査装置の精度測定方法
JP3012038B2 (ja) リード検査装置
JPH0763822A (ja) 基板検査装置
JP2770551B2 (ja) 半田の外観検査装置
CN120702377A (zh) 一种mems微振镜初始镜面偏转角度测试结构及方法
JP2639116B2 (ja) グリースの塗布量検出装置
JPS6391542A (ja) ハンダ付け検査装置
JPH01244351A (ja) 半田付け品質検査方法
JPS62297750A (ja) ハンダ付け検査装置
JPH1114574A (ja) はんだ付け検査方法及びはんだ付け検査装置