JPH0249649B2 - - Google Patents
Info
- Publication number
- JPH0249649B2 JPH0249649B2 JP58076108A JP7610883A JPH0249649B2 JP H0249649 B2 JPH0249649 B2 JP H0249649B2 JP 58076108 A JP58076108 A JP 58076108A JP 7610883 A JP7610883 A JP 7610883A JP H0249649 B2 JPH0249649 B2 JP H0249649B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- energy beam
- circuit board
- printed circuit
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、電子部品のプリント基板への実装に
係り、特に電子部品のプリント基板への接続状態
の良否を検査する検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to the mounting of electronic components onto a printed circuit board, and more particularly to an inspection method for inspecting the quality of the connection of an electronic component to a printed circuit board.
第１図および第２図は、従来の電子部品のプリ
ント基板への接続状態検査方法を示すものであ
り、第１図は側面図、第２図は平面図である。プ
リント基板１上に導体のパターン２を形成し、こ
のパターン２上にはんだ３等の溶融金属層を盛
り、電子部品６をこのプリント基板１上に搭載
し、リード４をはんだ３を介してパターン２に接
続する。このようにしてプリント基板１へ接続さ
れた電子部品６の接続状態を検査する従来の検査
方法の一つは、リード４の一部、たとえば９で示
すような平らな部分にレーザビーム等のエネルギ
ービーム７を照射し、リード４から放射される赤
外線８を観察して、電子部品６の接続の良否を検
査するものであつた。リード４上に照射されたエ
ネルギービーム７のもつ熱量は、瞬間的にリード
４の照射部分９の温度を上げるとともに、はんだ
３を介してパターン２に熱伝導する。このとき第
１図に示すようにリード４がパターン２に正常に
接続されている場合と第４図に示すようにリード
４が充分パターン２に接続されていない場合とで
は、リード４の温度変化が異なる。すなわちリー
ド４が正常に接続されている場合には、リード４
の温度低下が速いが、リード４の接続が不充分で
ある場合にはリード４の温度低下が比較的遅い傾
向となる。そこでリード４から放射される赤外線
８の時間変化を観察すれば、リード４接続の良否
を判定できる。しかしこの方法は、リード４に投
下する熱量のはんだ３方向への熱伝導が遅けれ
ば、リード４の温度低下が遅い傾向を示すため、
正常な場合と不良の場合とで放射される赤外線８
の差が少ないという問題があつた。またリード４
の形状は、成形状態のばらつき等により、必ずし
も平面形状をしていないため、リード４から放射
される赤外線がランダムな方向に放射され、赤外
線熱感知器がとらえる赤外線の強さがばらつくと
いう欠点があり、リード４の接続状態を精度高く
測定することが困難であつた。
1 and 2 show a conventional method for inspecting the connection state of an electronic component to a printed circuit board, with FIG. 1 being a side view and FIG. 2 being a plan view. A conductor pattern 2 is formed on a printed circuit board 1, a molten metal layer such as solder 3 is placed on this pattern 2, an electronic component 6 is mounted on this printed circuit board 1, and leads 4 are connected to the pattern through the solder 3. Connect to 2. One of the conventional inspection methods for inspecting the connection state of the electronic component 6 connected to the printed circuit board 1 in this way is to apply energy such as a laser beam to a part of the lead 4, for example, a flat part as shown by 9. The beam 7 was irradiated and the infrared rays 8 emitted from the leads 4 were observed to check whether the connection between the electronic components 6 was good or not. The amount of heat possessed by the energy beam 7 irradiated onto the lead 4 instantaneously raises the temperature of the irradiated portion 9 of the lead 4 and is thermally conducted to the pattern 2 via the solder 3 . At this time, the temperature of the lead 4 changes depending on whether the lead 4 is properly connected to the pattern 2 as shown in FIG. 1 or when the lead 4 is not sufficiently connected to the pattern 2 as shown in FIG. are different. In other words, if lead 4 is connected normally, lead 4
However, if the lead 4 is poorly connected, the temperature of the lead 4 tends to drop relatively slowly. Therefore, by observing the time change of the infrared rays 8 emitted from the leads 4, it is possible to determine whether the leads 4 are connected well or not. However, with this method, if the heat conduction of the amount of heat applied to the leads 4 in the solder 3 direction is slow, the temperature of the leads 4 tends to decrease slowly.
Infrared rays emitted in normal and defective cases8
There was a problem that there was little difference between the two. Also lead 4
Because the shape of the lead 4 is not necessarily planar due to variations in the molding state, the infrared rays emitted from the lead 4 are emitted in random directions, and the strength of the infrared rays detected by the infrared heat sensor varies. Therefore, it was difficult to measure the connection state of the lead 4 with high accuracy.
本発明の目的は、電子部品のプリント基板への
接続状態を精度よく検査する方法を提供すること
にある。
An object of the present invention is to provide a method for accurately inspecting the connection state of electronic components to a printed circuit board.
本発明は、電子部品のリードにエネルギービー
ムを照射し、該リードが接続されている導体パタ
ーンから放射される赤外線を検出する電子部品の
接続状態検査方法を特徴とする。
The present invention is characterized by a method for inspecting the connection state of an electronic component, which irradiates the lead of the electronic component with an energy beam and detects infrared rays emitted from a conductor pattern to which the lead is connected.
以下本発明の一実施例を第３図および第４図に
より説明する。第３図および第４図は、従来方法
の第１図に相当するプリント基板１上に搭載され
た電子部品６の側面図である。第３図は電子部品
６が正常に接続されている場合、第４図は接続不
良の場合を示す。エネルギービーム７は、リード
４上に照射されるレーザビーム等のエネルギービ
ームであり、赤外線８はパターン２から放射され
る赤外線である。エネルギービーム７の照射方法
および赤外線８の感知方法については、基本的に
は従来方法と同じである。
An embodiment of the present invention will be described below with reference to FIGS. 3 and 4. 3 and 4 are side views of the electronic component 6 mounted on the printed circuit board 1, which corresponds to FIG. 1 of the conventional method. FIG. 3 shows a case where the electronic component 6 is connected normally, and FIG. 4 shows a case where there is a poor connection. The energy beam 7 is an energy beam such as a laser beam irradiated onto the lead 4, and the infrared ray 8 is infrared ray radiated from the pattern 2. The method of irradiating the energy beam 7 and the method of sensing the infrared rays 8 are basically the same as the conventional method.
本実施例の方法を説明すると、リード４の一
部、たとえば５で示すような部分にエネルギービ
ーム７を照射し、パターン２から放射される赤外
線８の時間変化を観察する。あるいはリード４上
の９で示す部分にエネルギービーム７を照射して
もよい。第３図に示すように正常な場合には、投
下熱量は比較的はんだ３の温度を上げる方に行く
ので、赤外線８の強度の時間変化は立上がりが遅
い。また第４図に示すように不良の場合には、パ
ターン２への熱伝導が速いので、赤外線８の立上
がりが速い。 To explain the method of this embodiment, a part of the lead 4, for example, the part shown by 5, is irradiated with the energy beam 7, and the time change of the infrared rays 8 emitted from the pattern 2 is observed. Alternatively, the portion indicated by 9 on the lead 4 may be irradiated with the energy beam 7. As shown in FIG. 3, in a normal case, the amount of heat applied relatively increases the temperature of the solder 3, so that the intensity of the infrared rays 8 changes slowly over time. Furthermore, as shown in FIG. 4, in the case of a defect, the heat conduction to the pattern 2 is fast, so the rise of the infrared rays 8 is fast.
本発明の実施に当つては、エネルギービーム７
を正確にリード４上に照射する必要がある。たと
えばエネルギービーム７のビームの絞り限界を
80μｍ、プリント基板１に対するエネルギービー
ム７発生源の位置決め誤差あるいはエネルギービ
ーム７発生源に対するプリント基板１の位置決め
誤差を±50μｍとすると、リード４上にエネルギ
ービーム７が位置付けられるためには、（80／２
＋50）μｍ×２＝180μｍ、すなわちリード４の
幅として0.2mm以上が必要である。 In carrying out the present invention, the energy beam 7
It is necessary to irradiate the lead 4 accurately. For example, the beam aperture limit of energy beam 7 is
80 μm, and assuming that the positioning error of the energy beam 7 generation source with respect to the printed circuit board 1 or the positioning error of the printed circuit board 1 with respect to the energy beam 7 generation source is ±50 μm, in order for the energy beam 7 to be positioned on the lead 4, (80/ 2
+50) μm×2=180 μm, that is, the width of the lead 4 must be 0.2 mm or more.
１つのリード４から次のリード４へエネルギー
ビーム７の発生源を移す場合には、あらかじめ移
動量をデータで指定してこのデータによりサーボ
モータを駆動してボールスクリユーを動かすNC
制御方式が望ましい。 When moving the source of the energy beam 7 from one lead 4 to the next lead 4, the amount of movement is specified in advance using data, and this data is used to drive the servo motor to move the ball screw.
A control method is preferable.
またパターン２の温度変化、すなわち赤外線８
の変化を感知する方法としては、赤外線熱感知器
による非接触タイプの測定方式を用いることによ
り、対象物に熱影響を与えることなく正確に測定
ができる。この感知器をエネルギービーム７発生
源と一体に構成することにより、エネルギービー
ム７発生源との相対的な位置は一定となり、上記
のエネルギービーム７発生源の位置決め精度と同
程度の位置決め精度を確保することができる。 Also, the temperature change of pattern 2, that is, the infrared 8
By using a non-contact type measurement method using an infrared heat sensor as a method for detecting changes in the temperature, accurate measurement can be performed without affecting the target object due to heat. By configuring this sensor integrally with the energy beam 7 source, the relative position with the energy beam 7 source becomes constant, ensuring positioning accuracy comparable to the positioning accuracy of the energy beam 7 source described above. can do.
本実施例の説明からわかるように、本発明は導
体のパターン２から放射される赤外線を検出する
方法であり、パターン２の上面は比較的一定した
平面形状であるため、赤外線熱感知器がとらえる
赤外線の強さのばらつきは少ない。 As can be seen from the description of this embodiment, the present invention is a method for detecting infrared rays emitted from a conductor pattern 2, and since the upper surface of the pattern 2 has a relatively constant planar shape, an infrared heat sensor can detect it. There is little variation in the strength of infrared rays.
本発明によれば、電子部品のプリント基板への
接続状態を精度よく検査することができる。
According to the present invention, the connection state of an electronic component to a printed circuit board can be accurately inspected.
第１図は従来の接続状態検査方法を示す電子部
品６を実装したプリント基板１の側面図、第２図
は第２図は第１図と同じものの平面図、第３図は
本発明の一実施例の検査方法を示しかつ正常な接
続状態を示す側面図、第４図は第３図と同じ検査
方法を示しかつ不良な接続状態を示す側面図であ
る。
１……プリント基板、２……パターン、３……
はんだ、４……リード、７……エネルギービー
ム、８……赤外線。
FIG. 1 is a side view of a printed circuit board 1 on which electronic components 6 are mounted, showing a conventional connection state inspection method, FIG. 2 is a plan view of the same board as FIG. 1, and FIG. FIG. 4 is a side view showing the testing method of the embodiment and showing a normal connection state. FIG. 4 is a side view showing the same testing method as FIG. 3 and showing a defective connection state. 1...Printed circuit board, 2...pattern, 3...
Solder, 4...Lead, 7...Energy beam, 8...Infrared rays.
Claims (1)
のリードの接続状態の良否を検査する方法におい
て、前記リードにエネルギービームを照射し、前
記導体パターンから放射される赤外線の時間変化
を測定することを特徴とする電子部品の接続状態
検査方法。1. A method for inspecting the connection status of leads of electronic components connected to conductor patterns on a board, including irradiating the leads with an energy beam and measuring time changes in infrared radiation emitted from the conductor patterns. A method for inspecting the connection status of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076108A JPS59202048A (en) | 1983-05-02 | 1983-05-02 | Inspection of connection state for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076108A JPS59202048A (en) | 1983-05-02 | 1983-05-02 | Inspection of connection state for electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59202048A JPS59202048A (en) | 1984-11-15 |
| JPH0249649B2 true JPH0249649B2 (en) | 1990-10-30 |
Family
ID=13595696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58076108A Granted JPS59202048A (en) | 1983-05-02 | 1983-05-02 | Inspection of connection state for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59202048A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6391541A (en) * | 1986-10-06 | 1988-04-22 | Fujitsu Ltd | Method for inspecting soldered spot of printed circuit board device |
| JPS6391542A (en) * | 1986-10-07 | 1988-04-22 | Matsushita Electric Ind Co Ltd | Apparatus for inspecting soldering |
| JPH0430464U (en) * | 1990-07-09 | 1992-03-11 | ||
| JP2960301B2 (en) * | 1994-06-27 | 1999-10-06 | 仲田 周次 | Inspection method of circuit element joint |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5578945U (en) * | 1978-11-24 | 1980-05-30 |
-
1983
- 1983-05-02 JP JP58076108A patent/JPS59202048A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59202048A (en) | 1984-11-15 |
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