JP3012038B2 - Lead inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead inspection device for inspecting the bending of leads of a surface mount electronic component.

[0002]

2. Description of the Related Art As electronic devices become smaller, conventional ICs
In recent years, electronic components such as electronic components have been inserted into the mounting holes formed on the board and mounted by soldering. Recently, the type of mounting has been changed to a surface mount type where the leads are soldered on pads formed on the board. ing. Also, with the miniaturization of electronic components, their leads have become narrow and short to about 0.2 mm in width. At the same time, the width of the pad formed on the substrate is also 0.
It is as small as around 3mm. For this reason, bending of the leads of the mounted electronic component in the left-right and up-down directions poses a problem.

Conventionally, a metal microscope, a projector, a television camera, or the like has been used for measuring an object in units of several tens of μm or several hundreds of μm as described above. When measuring the bending of the lead of an electronic component such as a square IC by such a measuring means, conventionally, as shown in FIG.
Leads 2 provided to protrude from the outer periphery in four directions of C1
Was measured from the direction of arrow A.

[0004]

However, according to the above-mentioned measuring method, when there is a burr 3 or a bend at the tip of the lead 2 as shown in FIG. 3, the lead 2 actually floats when measured from the direction of arrow A. However, there is a possibility that the burrs and bends are measured and a pass is determined. Further, it is necessary to measure the four directions of the IC 1 from each direction, and there is a problem that it takes time.

The present invention has been made in view of the above circumstances, and provides a lead inspection apparatus which is not affected by burrs and the like, and which can accurately and easily measure the floating of a lead of an electronic component. The purpose is to do.

[0006]

According to the present invention, there is provided a lead inspection apparatus for inspecting leads of a surface mount electronic component, comprising: a table moving in two orthogonal directions; a motor mounted on the table; An arm fixed to the output shaft of the motor;
A light emitting means having an optical axis coincident with the center of the axis and irradiating a lead of an electronic component mounted on a plate through which light passes from the lower surface, and an arm provided to receive light reflected from the lead Light receiving means, and the motor rotates the arm.
Reflected light from multiple different directions of the lead
It is characterized by receiving light .

[0007]

In the lead inspection apparatus having the above-mentioned structure, light is transmitted through the lead inspection apparatus.
By arbitrarily setting the irradiation position from the light emitting means to the lead of the electronic component on the board to be moved by moving the table in two orthogonal directions, the floating of the portion requiring soldering regardless of burrs or bending The amount can be reliably measured. In addition, the arm is rotated by the motor, and the light receiving means is rotated exactly 90 degrees around the optical axis coincident with the center of the output shaft of the motor of the light emitting means, so that the slanted lead is perpendicular to two directions. , And the amount of reflected light along the slope of the lead can be read.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the lead inspection apparatus of the present invention will be described below with reference to the drawings.

FIG. 1 shows the configuration of an embodiment of the present invention. In the figure, portions corresponding to those of the conventional example shown in FIG. 3 are denoted by the same reference numerals. On an XY table 11 that moves in a right angle direction, a pulse motor 13 is mounted via a support table 12 so that the axial direction of the pulse motor 13 is vertical. Pulse motor 13
The sensor mounting arm 15 is fixed to the upper and lower ends of the output shaft 14 via levers 16 and 17. The arm 15 is provided in the vertical direction, and one end extending upward is bent at a right angle. On the upper lever 16, a semiconductor laser light emitting element 18 as a light emitting means is provided on the center line of the output shaft 14 of the pulse motor 13, and the optical axis of the light emitting element 18 coincides with the center line of the output shaft 14. ing.

The upper bent portion 15a of the sensor mounting arm 15
A glass plate 19 is horizontally fixed to a support member (not shown) between the light emitting element 18 and the light emitting element 18. The IC 1 is mounted on the glass plate 19 via the leads 2. Then, when the XY table is moved to make the optical axis of the laser light emitting element 18 coincide with a predetermined position of the lead 2, the light receiving means as the light receiving means is placed on the lever 16 at a position capable of receiving the reflected light from the lead 2. One light receiving element 20 is provided. On the optical axis of the light emitting element 18 on the upper bent portion 15a of the arm 15, a second light receiving element 21 is provided.

Next, the operation of this embodiment will be described. IC1
The tip of the lead 2 is placed on an alignment jig (not shown), the origin is adjusted, and the lead is placed on the glass plate 19. Next, the XY table is moved to make the optical axis of the light emitting element 18 coincide with a predetermined position of the lead 2 projecting from the four sides of the IC 1. As shown in FIG. 2, this position is located at a position inside the distance A from the tip of the lead 2. Even if the tip of the lead 2 has a burr or the like and the thickness of the lead 2 changes, the position is not affected by this. The floating amount of the part that needs soldering can be measured reliably. The XY table is moved so that light emitted from the light emitting element 18 passes through this position of each lead 2.

The wavelength of the diode light emitting element 18 is 78
The lead 2 of the IC 1 on the glass plate 19 is irradiated using a beam set at 0 Å and a beam diameter of 70 μm. When the light receiving element 20 does not receive light, there is no lead 2 and when receiving light, the pulse motor 13 is rotated exactly 90 degrees. As a result, the light receiving element 20 also rotates by 90 degrees. However, when light is irradiated on an object having an angle with respect to the glass plate 19, such as the lead 2, the amount of reflected light received changes in two orthogonal directions. This is because a certain measurement cannot be performed. That is, by taking the average value of the amount of received light when rotated by 90 degrees, the amount of reflected light received from the same direction along the slope of the lead 2 can be obtained. The height of the lead 2 from the glass plate 19 is determined based on the amount of received light.
Note that the amount of shake of the light emitting element 18 with respect to the output shaft 14 of the pulse motor 13 is corrected by a microcomputer (not shown).

Further, the second light receiving element 21 provided on the upper bent portion 15a of the arm 15 may not be provided.
It is installed to increase measurement accuracy. That is, when the second light receiving element 21 is not provided, the light emitted from the light emitting element 18 is reflected from the side surface of the lead 2 and an error occurs when measuring the lead width, the lead pitch, the lead bending, and the like. However, by detecting the light passing through the side surface of the lead 2 by the second light receiving element 21, the lead width, the lead pitch, the lead bending, and the like can be detected with high accuracy. According to the experiment, when the second light receiving element 21 was not provided, the measured values were detected to be larger by about 5 μm to 7 μm, but when the second light receiving element 21 was provided, the accuracy was about 1 μm to 2 μm. Measurement has become possible.

As described above, the floating amount, width, pitch, bending, etc. of the leads are detected for each lead 2 by moving the XY table 11, and the inspection of all the leads 2 projecting in four directions of the IC 1 is performed. Do.

According to the present embodiment, by irradiating the light emitted from the light emitting element 18 to the soldering portion of the lead 2, the floating amount of the lead 2 can be reliably measured without being affected by burrs at the tip of the lead 2. can do. Further, by measuring the amount of reflected light by rotating the light receiving element 20 by 90 degrees by the step motor 13, the floating amount of the inclined lead 2 can be accurately measured. XY table 11
, The floating amount, width, pitch, lateral bending, etc. of all the leads 2 projecting in four directions of the IC 1
At the same time, accurate measurement can be performed in a short time. Also the second
By providing the light receiving element 21, the measurement accuracy can be further improved.

In the above embodiment, a flat package type IC is used.
Although the first lead inspection has been described, the present invention can be applied to other surface mount electronic components, and similar effects can be obtained.

[0017]

As described above, according to the lead inspection apparatus of the present invention, the lead of the electronic component mounted on the plate through which light passes can be lowered by the light emitting means and the light receiving means moved by the XY table. Arm rotated by motor from
The reflected light from multiple different directions of the lead.
Since the light is received by the steps, the float, width, pitch, bending, and the like of the lead can be accurately and easily measured in a short time.

[Brief description of the drawings]

FIG. 1 is an explanatory side view showing a configuration of an embodiment of a lead inspection apparatus of the present invention.

FIG. 2 is an explanatory view showing a lead irradiation position of the light emitting element of FIG. 1;

FIG. 3 is an explanatory view showing a conventional lead inspection method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC (electronic component) 2 Lead 11 XY table 13 Pulse motor 15 Arm 18 Semiconductor laser light emitting element (light emitting means) 19 Glass plate 20, 21 Light receiving element (light receiving means)

Continued on the front page (72) Inventor Teruyasu Sakurai 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Tadao Yamada 3-9-9 Inadera, Amagasaki-shi, Hyogo Pref. In-company (56) References JP-A-2-62945 (JP, A) JP-A-2-74819 (JP, A) JP-A-63-102294 (JP, A) (58) Fields investigated (Int. . ^7, DB name) H01L 21/66 G01B 11/14 G01B 11/24

Claims (1)

(57) [Claims] 1. A lead inspection apparatus for inspecting leads of a surface-mounted electronic component, comprising: a table moving in two orthogonal directions; a motor mounted on the table; and an arm fixed to an output shaft of the motor. An optical axis provided on the arm and aligned with the center of the output shaft of the motor
A light emitting means for irradiating from below a lead of the electronic component mounted on a plate through which light passes, and the arm
Provided, the light receiving means for receiving light reflected from said lead is provided, wherein the motor is pre-rotated the arm
Receiving the reflected light from a plurality of different directions of the lead;
A lead inspection device characterized in that light is received by an optical means .