JPS6391541A - Method for inspecting soldered spot of printed circuit board device - Google Patents
Method for inspecting soldered spot of printed circuit board deviceInfo
- Publication number
- JPS6391541A JPS6391541A JP23755186A JP23755186A JPS6391541A JP S6391541 A JPS6391541 A JP S6391541A JP 23755186 A JP23755186 A JP 23755186A JP 23755186 A JP23755186 A JP 23755186A JP S6391541 A JPS6391541 A JP S6391541A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldered
- printed circuit
- circuit board
- temp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000005476 soldering Methods 0.000 claims abstract description 40
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000001931 thermography Methods 0.000 claims abstract description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
プリント板装置の半田付工程の直後に、赤外線検知器に
接続したサーモグラフィー装置を用い、半田付部の冷却
速度にもとづく温度差を検知するようにすることにより
、多数の半田付部の半田付けの良否を、速やかに、且つ
高精度に検査する。[Detailed Description of the Invention] [Summary] Immediately after the soldering process of a printed board device, a thermography device connected to an infrared detector is used to detect the temperature difference based on the cooling rate of the soldered part. To quickly and accurately inspect the quality of soldering of a large number of soldered parts.
本発明は、プリン斗板基板に高密度に実装部品が半田付
は搭載されるプリント板装置の、半田付は個所の検査方
法の改良に関する。The present invention relates to an improvement in a method for inspecting soldering parts of a printed circuit board device in which components are soldered and mounted on a printed circuit board at a high density.
近年の電子機器には、大形化されたプリント板基板に、
リード付部品、或いはり一ドレス部品を高密度に半田付
は搭載したプリント板装置が広く使用されている。In recent years, electronic devices are equipped with larger printed circuit boards,
Printed board devices equipped with leaded parts or single-dress parts soldered at high density are widely used.
このようなプリント板装置の一例を第２図に示す。第２
図の（ａ）はプリント板装置の側面図、（ｂ）は裏面の
平面図、（Ｃ）は要部断面図である。An example of such a printed board device is shown in FIG. Second
(a) of the figure is a side view of the printed board device, (b) is a plan view of the back side, and (c) is a sectional view of the main part.
第２図において、プリント板基板２に多数の実装部品（
図はリード付部品を示す）３を半田付は搭載して、パタ
ーン６を介して実装部品３間を所定に接続することによ
り、所望の機能を有するプリント板装置１を構成してい
る。In FIG. 2, a large number of mounted components (
The printed board device 1 having a desired function is constructed by mounting components (the figure shows components with leads) 3 by soldering and connecting the mounted components 3 in a predetermined manner via patterns 6.
詳述すると、実装部品３のリード４を、プリント仮基板
２のスルーホールに挿入して、裏面側に突出せしめ、プ
リント板基板２の裏面を溶融半田槽にディップして、リ
ード４の突出部、及びスルーホールの内部に半田を充填
付着して、半田付部５を設け、実装部品３をプリント板
基板２に固定すると同時に、リード４をプリント板基板
２の裏面、中間層、或いは表面に形成したパターン６に
電気的に接続している。To be more specific, the leads 4 of the mounted component 3 are inserted into the through holes of the temporary printed circuit board 2 so that they protrude to the back side, and the back surface of the printed board 2 is dipped in a molten solder bath to remove the protruding parts of the leads 4. , and the inside of the through hole is filled with solder to form a soldering part 5, and the mounted component 3 is fixed to the printed circuit board 2. At the same time, the leads 4 are attached to the back surface, intermediate layer, or front surface of the printed circuit board 2. It is electrically connected to the formed pattern 6.
なお、図示してないが、リードレス部品は、プリント板
基板２の表面、或いは裏面に形成したパターン６の端末
に、バットを設け、このバット上に、リードレス部品の
電極を位置合わせし、半田リフロー手段等により、プリ
ント板基板２に半田付は搭載している。Although not shown, in the leadless component, a butt is provided at the end of the pattern 6 formed on the front or back surface of the printed circuit board 2, and the electrodes of the leadless component are aligned on this bat. Solder is mounted on the printed circuit board 2 by solder reflow means or the like.
上述のように構成されたプリント板装置１の、半田付部
５の半田付着量が少ない場合、或いは半田が全く無い場
合には、電気的接続が不完全となる。よって、プリント
板装置ｌを線動中に、接続不良となる恐れがある。If the amount of solder attached to the soldering portion 5 of the printed board device 1 configured as described above is small, or if there is no solder at all, the electrical connection will be incomplete. Therefore, there is a risk that a connection failure will occur during linear movement of the printed board device l.
また、不必要の個所に、半田が飛散して付着していると
、隣接したリード４間が短絡する恐れがある。Furthermore, if solder is scattered and adhered to unnecessary locations, there is a risk of short-circuiting between adjacent leads 4.
したがって、プリント板装置１は半田付は直後に、半田
付は個所の良否の検査を実施するのが一般である。Therefore, it is common for the printed board device 1 to inspect the quality of soldered parts immediately after soldering.
従来の半田付は個所の検査方法は、実装部品３を半田付
は後、プリント板基板２の裏面、或いは表面の所定の半
田付部５の半田付着量が少なくないか、或いは不必要の
個所に半田が飛散していないかを、目視により検査して
いる。The conventional method of inspecting soldering points is to check whether the amount of solder adhesion at a predetermined soldering area 5 on the back side or front side of the printed circuit board 2 is not small or unnecessary after soldering the mounted component 3. A visual inspection is conducted to ensure that solder is not scattered.
また、他の検査手段としては、半田付部５の１ポイント
毎に、レーザ光を照射して加熱させ、例えば赤外線カメ
ラで撮影して、温度上昇の速度を計測している。半田付
部５の半田付着量が少ないと、温度上昇速度が早いので
、半田付は個所の良否を判定できる。Another inspection method is to irradiate each point of the soldered portion 5 with a laser beam to heat it, and measure the rate of temperature rise by photographing it with an infrared camera, for example. If the amount of solder adhered to the soldered portion 5 is small, the temperature rises quickly, so that it is possible to judge whether the soldering is good or bad.
しかしながら上記従来方法の前者、即ち目視による手段
は、検査時間が長いばかりでなく、判定エラーが多いと
いう問題点がある。However, the former of the above-mentioned conventional methods, that is, the visual inspection method, has problems in that it not only takes a long time to inspect, but also causes many judgment errors.
また後者、即ちレーザ光で加熱する手段は、半田付部５
の１ポイント毎に照射するので、検査時間が長いばかり
でなく、検査設備費が高く、検査コストが高いという問
題点がある。The latter, that is, means for heating with laser light, is used to heat the soldered portion 5.
Since irradiation is performed for each point, there are problems in that not only the inspection time is long, but also the inspection equipment cost is high and the inspection cost is high.
上記従来の問題点を解決するため本発明方法は、第１図
のように、半田付装置１０でプリント板基板２に実装部
品３を半田付けする工程の直後の後工程に、赤外線検知
器２０を設置して、プリント板基板２の裏面、（または
表面）の全面の温度分布検知し、赤外線検知器２０に接
続したサーモグラフィー装置２１により、半田付部の冷
却速度の差による温度差を検知して、半田付けの良否を
判定するようにしたものである。In order to solve the above-mentioned conventional problems, the method of the present invention, as shown in FIG. is installed to detect the temperature distribution over the entire back side (or front side) of the printed circuit board 2, and the thermography device 21 connected to the infrared detector 20 detects the temperature difference due to the difference in the cooling rate of the soldered part. The quality of the soldering is determined by the following steps.
上記本発明方法によれば、半田付は時には半田付部の温
度は、半田の溶融温度にほぼ等しく、それぞれ一定であ
る。そして半田付けが終了すると半田が冷却し、半田付
部の温度は徐々に降下する。According to the method of the present invention, the temperature of the soldering part is substantially equal to the melting temperature of the solder and is constant during soldering. When the soldering is finished, the solder cools down and the temperature of the soldered part gradually drops.
この冷却速度は半田付部の熱容量、即ち半田の付着量に
より異なり、付着量が少ないほど速い。This cooling rate varies depending on the heat capacity of the soldered portion, that is, the amount of solder attached, and the smaller the amount of solder attached, the faster it is.
よって、サーモグラフィー装置２１に色表示されるそれ
ぞれの半田付部の温度を比較することにより、半田付け
の良否を判定することができる。Therefore, by comparing the temperatures of the respective soldered parts displayed in color on the thermography device 21, it is possible to determine whether the soldering is good or bad.
また、不必要の個所に半田が付着している場合において
も、その個所の温度が、プリント板基板の温度と異なる
ので識別することができる。Furthermore, even if solder is attached to an unnecessary location, it can be identified because the temperature of that location is different from the temperature of the printed circuit board.
以下図を参照しながら、本発明方法を具体的に説明する
。なお、全図を通じて同一符号は同一対象物を示す。The method of the present invention will be specifically explained below with reference to the drawings. Note that the same reference numerals indicate the same objects throughout the figures.
第１図は本発明の一実施例の構成図、第３図はプリント
板装置の温度降下を示す特性図である。FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 3 is a characteristic diagram showing the temperature drop of a printed board device.
第１図において、半田付装置１０は、プリント板装置１
を搬送するコンベア１１と、プリント板装置１を半田デ
ィツプする溶融半田槽１２とよりなり、溶融半田槽１２
の後方で、コンベア１１の走行方向の下部には赤外線検
知器２０を設置しである。サーモグラフィー装置２１は
この赤外線検知器２０に電気的に接続されている。In FIG. 1, a soldering device 10 is a printed board device 1.
The molten solder tank 12 consists of a conveyor 11 that conveys the printed board device 1, and a molten solder tank 12 that dips the solder into the printed board device 1.
An infrared detector 20 is installed behind the conveyor 11 at the bottom in the running direction. A thermography device 21 is electrically connected to this infrared detector 20.
この赤外線検知器２０の設置位置は、プリント板装置１
が半田付けされた後、１０秒〜２分経過した位置である
。The installation position of this infrared detector 20 is the printed board device 1.
This is the position where 10 seconds to 2 minutes have passed after soldering.
プリント板装置１を走行するコンベア１１に装着し、溶
融半田槽１２の上方に送り込み、プリント板装置１に降
下・引揚げ運動を付与するか、或いはコンベア１１自体
を逆台形に走行するように設置して、プリント板基板２
の裏面（図では下面）を溶融半田槽１２にディップし、
実装部品３の半田付は作業を実施する。The printed board device 1 is attached to a running conveyor 11 and sent above the molten solder bath 12 to give the printed board device 1 lowering and lifting motions, or the conveyor 11 itself is installed so as to run in an inverted trapezoidal shape. Then, print board board 2
Dip the back side (lower side in the figure) into the molten solder bath 12,
Soldering of the mounted components 3 is carried out.
そして、半田付けされ、コンベア１１で送出されてきた
プリント板基板２の裏面の全面の温度分布を、赤外線検
知器２０で検知し、その温度分布をサーモグラフィー装
置２１に色表示させる。Then, the temperature distribution over the entire back surface of the printed circuit board 2 that has been soldered and sent out by the conveyor 11 is detected by the infrared detector 20, and the temperature distribution is displayed in color by the thermography device 21.
以下、上述の設備により、プリント板装置の半田付は個
所の良否が判定できることを説明する。Hereinafter, it will be explained that the above-mentioned equipment can determine the quality of soldering parts of a printed board device.
第３図の特性図は、横軸に時間を、縦軸にプリント板装
置１の温度を示し、鎖線で示す曲線Ｍ０は、プリント板
基板２の冷却特性を示すものである。曲線Ｍ０の下方に
図示された実線で示す曲線Ｍ１は、半田付着量が適性の
場合の半田付部５の冷却特性を示し、曲線Ｍ、の下方に
図示された点線で示す曲線Ｍ２は、半田付着量が不足の
場合の半田付部５°の冷却特性をそれぞれ示している。In the characteristic diagram of FIG. 3, the horizontal axis shows time, the vertical axis shows the temperature of the printed board device 1, and a curve M0 shown by a chain line shows the cooling characteristic of the printed board substrate 2. A curve M1 shown by a solid line below the curve M0 shows the cooling characteristics of the soldered part 5 when the solder adhesion amount is appropriate, and a curve M2 shown by a dotted line below the curve M0 shows the cooling characteristics of the soldered part 5 when the amount of solder is appropriate. The cooling characteristics of the soldered portion 5° when the amount of soldering is insufficient are shown.
プリント板装置１を溶融半田槽１２にディップした時（
ＴＯ）に、これらの曲線Ｍ ｏ １Ｍ ｔ １Ｍ ２は
、−致した・最高温度を示しており、プリント板基板２
゜半田付は良好の半田付部５．半田付は不良の半田付部
５″のそれぞれの温度が等しい。When the printed board device 1 is dipped into the molten solder bath 12 (
TO), these curves M o 1M t 1M 2 indicate the maximum temperature that coincided with the printed circuit board 2.
゜ Good soldering part 5. During soldering, the temperatures of the defective soldered parts 5'' are the same.
しかし、時間の経過とともに、異なる冷却速度で冷却さ
れ、半田付は後、時間Ｔ、経過すると、プリント板基板
２の温度が最高で、半田付は不良の半田付部５″の温度
が最低で、その間に、半田付は良好の半田付部５がある
。However, as time passes, cooling occurs at different cooling rates, and after soldering, after time T, the temperature of the printed circuit board 2 is the highest, and the temperature of the defective soldered part 5'' is the lowest. , there is a soldering part 5 with good soldering between them.
プリント板基板はＦＲＰ等の合成樹脂であることから、
熱の放射率が低く、蓄熱して温度低下が低い。充分な半
田量の付着は、金属にもとづく熱放射率が大きいが、半
田の熱量が大きいことに依存して、半田量の少ない部分
比較して温度降下は遅い。Since the printed circuit board is made of synthetic resin such as FRP,
The emissivity of heat is low, so heat is stored and the temperature drop is low. Adhering a sufficient amount of solder has a high thermal emissivity based on the metal, but since the amount of heat of the solder is large, the temperature drop is slower than in areas with a small amount of solder.
リード部分は以上のようであるが、チップ部品の場合は
、チップ部品内への熱伝導による半田部からの熱損失を
も生じて、充分な半田付は部分に較べて、半田量の少な
い個所の温度降下は速く大きい。The lead part is as described above, but in the case of chip parts, heat loss from the solder part occurs due to heat conduction into the chip part, and sufficient soldering is required in areas with a small amount of solder compared to the parts. temperature drop is fast and large.
第３図で理解できるように、半田付は不良の半田付部は
、冷却速度が速く温度降下が大きいので、サーモグラフ
ィー装置２１を見ることにより、任意の時間後において
半田付けの良否を判定することができる。As can be understood from FIG. 3, a soldered part with poor soldering has a fast cooling rate and a large temperature drop, so by looking at the thermography device 21, it is possible to judge whether the soldering is good or bad after an arbitrary period of time. Can be done.
例えば、半田付けした後１分３０秒を経過した場合、サ
ーモグラフィー装置２１の表示画面には、プリント板基
板２の温度が白色で表示され、はぼ８２℃である。半田
付は良好の半田付部５の温度は、赤色で表示され、はぼ
７４℃である。また、半田付は不良の半田付部の温度は
、緑色で表示され、はぼ６０℃である。For example, when 1 minute and 30 seconds have passed after soldering, the temperature of the printed circuit board 2 is displayed in white on the display screen of the thermography device 21, and is approximately 82°C. The temperature of the soldered portion 5 with good soldering is displayed in red and is approximately 74°C. Furthermore, the temperature of the soldered portion with poor soldering is displayed in green and is approximately 60°C.
なお、それらの間の温度は中間色の多段色に、０．２℃
程度の差で階調表示される。In addition, the temperature between them is 0.2℃ for intermediate multi-stage colors.
Displayed in gradations with varying degrees of intensity.
赤外線検知器をプリント板装置の上方に設置すると、プ
リント板基板の表面の半田付部の良否を検査することが
できる。If an infrared detector is installed above the printed board device, it is possible to inspect the quality of the soldered portion on the surface of the printed board board.
なお、図示しない画像記録手段に画像信号を記録させて
、別の画像装置に再生表示させ、チェックと補修等を行
うことは、勿論本発明に含むことである。It should be noted that, of course, the present invention includes recording an image signal in an image recording means (not shown), reproducing and displaying it on another image device, and performing checks, repairs, etc.
以上説明したように本発明方法は、プリント板装置の半
田付は個所の良否を、短時間に高精度で検査する事がで
き、半田付装置のラインに組み込むことができて検査工
数が著しく短縮され、且つ特別に加熱装置等を必要とし
ないので設備費が安価である等、実用上で優れた効果が
ある。As explained above, the method of the present invention can inspect the quality of soldered parts of printed board equipment with high accuracy in a short time, and can be incorporated into the soldering equipment line, significantly reducing the number of inspection steps. Moreover, since no special heating device or the like is required, the equipment cost is low, and has excellent practical effects.
第１図は本発明の実施例の構成図、
第２図の（ａｌはプリント板装置の側面図、（ｂ）は裏
面の平面図、
（Ｃ）は要部断面図、
第３図はプリント板装置の温度降下を示す特性図である
。
図において、
１はプリント板装置、 ２はプリント板基板、３は実装
部品、 ５は半田付部、１０は半田付装置、
１２は溶融半田槽、２０は赤外線検知器、
２１はサーモグラフィー装置をそれぞれ示す。Fig. 1 is a configuration diagram of an embodiment of the present invention, Fig. 2 (al is a side view of the printed board device, (b) is a plan view of the back side, (C) is a sectional view of the main part, and Fig. 3 is a printed board device. It is a characteristic diagram showing the temperature drop of a board device. In the figure, 1 is a printed board device, 2 is a printed board board, 3 is a mounted component, 5 is a soldering part, 10 is a soldering device,
12 is a molten solder tank, 20 is an infrared detector, and 21 is a thermography device.
Claims (1)
されるプリント板装置（１）において、 半田付け工程の直後の後工程に、赤外線検知器（２０）
を設置し、該赤外線検知器（２０）に接続したサーモグ
ラフィー装置（２１）を用いて、 半田付部の冷却速度の差による温度差を検知して、半田
付けの良否を判定することを特徴とするプリント板装置
の半田付け個所検査方法。[Claims] In a printed board device (1) in which a mounted component (3) is mounted on a printed board board (2) by soldering, an infrared detector (20) is provided in a subsequent process immediately after the soldering process.
A thermography device (21) connected to the infrared detector (20) is used to detect the temperature difference due to the difference in the cooling rate of the soldered part to judge whether the soldering is good or bad. A method for inspecting solder joints on printed board equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23755186A JPS6391541A (en) | 1986-10-06 | 1986-10-06 | Method for inspecting soldered spot of printed circuit board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23755186A JPS6391541A (en) | 1986-10-06 | 1986-10-06 | Method for inspecting soldered spot of printed circuit board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6391541A true JPS6391541A (en) | 1988-04-22 |
Family
ID=17017007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23755186A Pending JPS6391541A (en) | 1986-10-06 | 1986-10-06 | Method for inspecting soldered spot of printed circuit board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6391541A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201148A (en) * | 1989-01-30 | 1990-08-09 | Nec Corp | Method of inspecting solder joining part |
| JP2007085904A (en) * | 2005-09-22 | 2007-04-05 | Wing Systems:Kk | Soldering defect inspection device |
| CN100390675C (en) * | 2003-01-30 | 2008-05-28 | 佳能株式会社 | Printing system, information processor and method, computer program, memory medium |
| WO2018139571A1 (en) * | 2017-01-30 | 2018-08-02 | 三菱電機株式会社 | Soldering system, control device, control method, and program |
| WO2019208039A1 (en) * | 2018-04-27 | 2019-10-31 | 三菱電機株式会社 | Soldering monitoring device, soldering monitoring method and soldering device |
| CN110967376A (en) * | 2019-12-13 | 2020-04-07 | 上海吉埃姆智能设备有限公司 | Welding quality detection system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59202048A (en) * | 1983-05-02 | 1984-11-15 | Hitachi Ltd | Inspection of connection state for electronic components |
| JPS60154148A (en) * | 1984-01-24 | 1985-08-13 | Shinkawa Ltd | Method for detecting die bond adhesion state |
-
1986
- 1986-10-06 JP JP23755186A patent/JPS6391541A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59202048A (en) * | 1983-05-02 | 1984-11-15 | Hitachi Ltd | Inspection of connection state for electronic components |
| JPS60154148A (en) * | 1984-01-24 | 1985-08-13 | Shinkawa Ltd | Method for detecting die bond adhesion state |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02201148A (en) * | 1989-01-30 | 1990-08-09 | Nec Corp | Method of inspecting solder joining part |
| CN100390675C (en) * | 2003-01-30 | 2008-05-28 | 佳能株式会社 | Printing system, information processor and method, computer program, memory medium |
| JP2007085904A (en) * | 2005-09-22 | 2007-04-05 | Wing Systems:Kk | Soldering defect inspection device |
| WO2018139571A1 (en) * | 2017-01-30 | 2018-08-02 | 三菱電機株式会社 | Soldering system, control device, control method, and program |
| JPWO2018139571A1 (en) * | 2017-01-30 | 2019-06-27 | 三菱電機株式会社 | Soldering system, control device, control method and program |
| WO2019208039A1 (en) * | 2018-04-27 | 2019-10-31 | 三菱電機株式会社 | Soldering monitoring device, soldering monitoring method and soldering device |
| CN112004629A (en) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN112004629B (en) * | 2018-04-27 | 2022-05-03 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN110967376A (en) * | 2019-12-13 | 2020-04-07 | 上海吉埃姆智能设备有限公司 | Welding quality detection system |
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