JPS59202048A - 電子部品の接続状態検査方法 - Google Patents

電子部品の接続状態検査方法

Info

Publication number
JPS59202048A
JPS59202048A JP58076108A JP7610883A JPS59202048A JP S59202048 A JPS59202048 A JP S59202048A JP 58076108 A JP58076108 A JP 58076108A JP 7610883 A JP7610883 A JP 7610883A JP S59202048 A JPS59202048 A JP S59202048A
Authority
JP
Japan
Prior art keywords
lead
electronic components
connection state
energy beam
infrared rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58076108A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0249649B2 (https=
Inventor
Akio Kojima
小島　明夫
Mitsugi Shirai
白井　貢
Hideaki Sasaki
秀昭 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58076108A priority Critical patent/JPS59202048A/ja
Publication of JPS59202048A publication Critical patent/JPS59202048A/ja
Publication of JPH0249649B2 publication Critical patent/JPH0249649B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58076108A 1983-05-02 1983-05-02 電子部品の接続状態検査方法 Granted JPS59202048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58076108A JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58076108A JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Publications (2)

Publication Number Publication Date
JPS59202048A true JPS59202048A (ja) 1984-11-15
JPH0249649B2 JPH0249649B2 (https=) 1990-10-30

Family

ID=13595696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58076108A Granted JPS59202048A (ja) 1983-05-02 1983-05-02 電子部品の接続状態検査方法

Country Status (1)

Country Link
JP (1) JPS59202048A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391542A (ja) * 1986-10-07 1988-04-22 Matsushita Electric Ind Co Ltd ハンダ付け検査装置
JPS6391541A (ja) * 1986-10-06 1988-04-22 Fujitsu Ltd プリント板装置の半田付け個所検査方法
JPH0430464U (https=) * 1990-07-09 1992-03-11
JPH0817882A (ja) * 1994-06-27 1996-01-19 Shuji Nakada 回路素子接合部の検査方法
CN120703115A (zh) * 2025-06-16 2025-09-26 四川易创芯电子科技有限公司 一种pcb锡膏印刷结果监测方法、系统、设备及介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5578945U (https=) * 1978-11-24 1980-05-30

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5578945U (https=) * 1978-11-24 1980-05-30

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391541A (ja) * 1986-10-06 1988-04-22 Fujitsu Ltd プリント板装置の半田付け個所検査方法
JPS6391542A (ja) * 1986-10-07 1988-04-22 Matsushita Electric Ind Co Ltd ハンダ付け検査装置
JPH0430464U (https=) * 1990-07-09 1992-03-11
JPH0817882A (ja) * 1994-06-27 1996-01-19 Shuji Nakada 回路素子接合部の検査方法
CN120703115A (zh) * 2025-06-16 2025-09-26 四川易创芯电子科技有限公司 一种pcb锡膏印刷结果监测方法、系统、设备及介质

Also Published As

Publication number Publication date
JPH0249649B2 (https=) 1990-10-30

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