JPH0249013B2 - - Google Patents

Info

Publication number
JPH0249013B2
JPH0249013B2 JP56156494A JP15649481A JPH0249013B2 JP H0249013 B2 JPH0249013 B2 JP H0249013B2 JP 56156494 A JP56156494 A JP 56156494A JP 15649481 A JP15649481 A JP 15649481A JP H0249013 B2 JPH0249013 B2 JP H0249013B2
Authority
JP
Japan
Prior art keywords
gold
gold paste
paste layer
adhesive
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56156494A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5857730A (ja
Inventor
Kozo Matsumura
Minoru Takaochi
Yukio Ogawa
Eizo Ueda
Jinichi Matsunaga
Kazutaka Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissha Printing Co Ltd
Original Assignee
Nissha Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd
Priority to JP56156494A priority Critical patent/JPS5857730A/ja
Publication of JPS5857730A publication Critical patent/JPS5857730A/ja
Publication of JPH0249013B2 publication Critical patent/JPH0249013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Die Bonding (AREA)
JP56156494A 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法 Granted JPS5857730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56156494A JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Publications (2)

Publication Number Publication Date
JPS5857730A JPS5857730A (ja) 1983-04-06
JPH0249013B2 true JPH0249013B2 (enExample) 1990-10-26

Family

ID=15628973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56156494A Granted JPS5857730A (ja) 1981-09-30 1981-09-30 半導体パツケ−ジの製造方法

Country Status (1)

Country Link
JP (1) JPS5857730A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6063939A (ja) * 1983-05-20 1985-04-12 Tomoegawa Paper Co Ltd セラミツク封止基板に半導体固定用被膜を形成する方法
CA1222071A (en) * 1984-01-30 1987-05-19 Joseph A. Aurichio Conductive die attach tape
US4959008A (en) * 1984-04-30 1990-09-25 National Starch And Chemical Investment Holding Corporation Pre-patterned circuit board device-attach adhesive transfer system
WO1996029730A1 (en) 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
TW310481B (enExample) 1995-07-06 1997-07-11 Hitachi Chemical Co Ltd

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846388B2 (ja) * 1978-04-19 1983-10-15 日本電気ホームエレクトロニクス株式会社 半田供給方法

Also Published As

Publication number Publication date
JPS5857730A (ja) 1983-04-06

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