JPH0245653U - - Google Patents
Info
- Publication number
- JPH0245653U JPH0245653U JP12508988U JP12508988U JPH0245653U JP H0245653 U JPH0245653 U JP H0245653U JP 12508988 U JP12508988 U JP 12508988U JP 12508988 U JP12508988 U JP 12508988U JP H0245653 U JPH0245653 U JP H0245653U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- semiconductor
- land
- solder bumps
- side terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12508988U JPH0245653U (es) | 1988-09-24 | 1988-09-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12508988U JPH0245653U (es) | 1988-09-24 | 1988-09-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0245653U true JPH0245653U (es) | 1990-03-29 |
Family
ID=31375383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12508988U Pending JPH0245653U (es) | 1988-09-24 | 1988-09-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0245653U (es) |
-
1988
- 1988-09-24 JP JP12508988U patent/JPH0245653U/ja active Pending
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