JPS6232551U - - Google Patents
Info
- Publication number
- JPS6232551U JPS6232551U JP1985124205U JP12420585U JPS6232551U JP S6232551 U JPS6232551 U JP S6232551U JP 1985124205 U JP1985124205 U JP 1985124205U JP 12420585 U JP12420585 U JP 12420585U JP S6232551 U JPS6232551 U JP S6232551U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- integrated circuit
- pattern
- circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 5
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985124205U JPS6232551U (es) | 1985-08-13 | 1985-08-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985124205U JPS6232551U (es) | 1985-08-13 | 1985-08-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6232551U true JPS6232551U (es) | 1987-02-26 |
Family
ID=31016004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985124205U Pending JPS6232551U (es) | 1985-08-13 | 1985-08-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6232551U (es) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02261489A (ja) * | 1989-03-31 | 1990-10-24 | Nakanihon Juki Kk | ミシンにおける筒布縁の縫い方法と装置 |
JPH02142569U (es) * | 1989-05-01 | 1990-12-04 | ||
JPH0313973U (es) * | 1989-06-27 | 1991-02-13 |
-
1985
- 1985-08-13 JP JP1985124205U patent/JPS6232551U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02261489A (ja) * | 1989-03-31 | 1990-10-24 | Nakanihon Juki Kk | ミシンにおける筒布縁の縫い方法と装置 |
JPH02142569U (es) * | 1989-05-01 | 1990-12-04 | ||
JPH0313973U (es) * | 1989-06-27 | 1991-02-13 |
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