JPH0476048U - - Google Patents
Info
- Publication number
- JPH0476048U JPH0476048U JP11884990U JP11884990U JPH0476048U JP H0476048 U JPH0476048 U JP H0476048U JP 11884990 U JP11884990 U JP 11884990U JP 11884990 U JP11884990 U JP 11884990U JP H0476048 U JPH0476048 U JP H0476048U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- signal
- laminated board
- laminated substrate
- signal wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884990U JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884990U JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0476048U true JPH0476048U (es) | 1992-07-02 |
| JP2508660Y2 JP2508660Y2 (ja) | 1996-08-28 |
Family
ID=31866817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11884990U Expired - Lifetime JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2508660Y2 (es) |
-
1990
- 1990-11-15 JP JP11884990U patent/JP2508660Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2508660Y2 (ja) | 1996-08-28 |
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