JPH0244167B2 - - Google Patents
Info
- Publication number
- JPH0244167B2 JPH0244167B2 JP57086301A JP8630182A JPH0244167B2 JP H0244167 B2 JPH0244167 B2 JP H0244167B2 JP 57086301 A JP57086301 A JP 57086301A JP 8630182 A JP8630182 A JP 8630182A JP H0244167 B2 JPH0244167 B2 JP H0244167B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric vibrating
- electrodes
- electrode
- piezoelectric
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000012212 insulator Substances 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 33
- 238000000605 extraction Methods 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 16
- 238000010897 surface acoustic wave method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 9
- 230000005284 excitation Effects 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8630182A JPS58139511A (ja) | 1982-05-20 | 1982-05-20 | チツプ状圧電振動部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8630182A JPS58139511A (ja) | 1982-05-20 | 1982-05-20 | チツプ状圧電振動部品の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2146182A Division JPS58138115A (ja) | 1982-02-12 | 1982-02-12 | チップ状圧電振動部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58139511A JPS58139511A (ja) | 1983-08-18 |
| JPH0244167B2 true JPH0244167B2 (US07943777-20110517-C00090.png) | 1990-10-03 |
Family
ID=13883008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8630182A Granted JPS58139511A (ja) | 1982-05-20 | 1982-05-20 | チツプ状圧電振動部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58139511A (US07943777-20110517-C00090.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6066116U (ja) * | 1983-10-14 | 1985-05-10 | 沖電気工業株式会社 | セラミツクフイルタ |
| FR2579829B1 (fr) * | 1985-03-29 | 1988-06-24 | Thomson Csf | Procede de fabrication de dispositifs a ondes de surface |
| JP2940159B2 (ja) * | 1990-11-30 | 1999-08-25 | 株式会社村田製作所 | 封止型圧電部品の製造方法 |
| US6266857B1 (en) * | 1998-02-17 | 2001-07-31 | Microsound Systems, Inc. | Method of producing a backing structure for an ultrasound transceiver |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5012992A (US07943777-20110517-C00090.png) * | 1973-06-05 | 1975-02-10 | ||
| JPS572726B2 (US07943777-20110517-C00090.png) * | 1973-06-11 | 1982-01-18 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572726U (US07943777-20110517-C00090.png) * | 1980-06-04 | 1982-01-08 |
-
1982
- 1982-05-20 JP JP8630182A patent/JPS58139511A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5012992A (US07943777-20110517-C00090.png) * | 1973-06-05 | 1975-02-10 | ||
| JPS572726B2 (US07943777-20110517-C00090.png) * | 1973-06-11 | 1982-01-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58139511A (ja) | 1983-08-18 |
