JPH0243279A - 半導体封止用エポキシ樹脂組成物及び半導体装置 - Google Patents

半導体封止用エポキシ樹脂組成物及び半導体装置

Info

Publication number
JPH0243279A
JPH0243279A JP19338288A JP19338288A JPH0243279A JP H0243279 A JPH0243279 A JP H0243279A JP 19338288 A JP19338288 A JP 19338288A JP 19338288 A JP19338288 A JP 19338288A JP H0243279 A JPH0243279 A JP H0243279A
Authority
JP
Japan
Prior art keywords
epoxy resin
composition
alumina
resin composition
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19338288A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583113B2 (enExample
Inventor
Tetsuo Yoshida
哲夫 吉田
Yoshio Fujimura
藤村　嘉夫
Minoru Takei
武井　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP19338288A priority Critical patent/JPH0243279A/ja
Publication of JPH0243279A publication Critical patent/JPH0243279A/ja
Publication of JPH0583113B2 publication Critical patent/JPH0583113B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP19338288A 1988-08-04 1988-08-04 半導体封止用エポキシ樹脂組成物及び半導体装置 Granted JPH0243279A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19338288A JPH0243279A (ja) 1988-08-04 1988-08-04 半導体封止用エポキシ樹脂組成物及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19338288A JPH0243279A (ja) 1988-08-04 1988-08-04 半導体封止用エポキシ樹脂組成物及び半導体装置

Publications (2)

Publication Number Publication Date
JPH0243279A true JPH0243279A (ja) 1990-02-13
JPH0583113B2 JPH0583113B2 (enExample) 1993-11-24

Family

ID=16306998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19338288A Granted JPH0243279A (ja) 1988-08-04 1988-08-04 半導体封止用エポキシ樹脂組成物及び半導体装置

Country Status (1)

Country Link
JP (1) JPH0243279A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225484A (en) * 1990-11-30 1993-07-06 Shin-Etsu Chemical Co., Ltd Epoxy resin compositions and cured products thereof
JPH06200124A (ja) * 1993-01-07 1994-07-19 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225484A (en) * 1990-11-30 1993-07-06 Shin-Etsu Chemical Co., Ltd Epoxy resin compositions and cured products thereof
JPH06200124A (ja) * 1993-01-07 1994-07-19 Matsushita Electric Works Ltd 封止用エポキシ樹脂成形材料

Also Published As

Publication number Publication date
JPH0583113B2 (enExample) 1993-11-24

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