JPH0242474U - - Google Patents
Info
- Publication number
- JPH0242474U JPH0242474U JP12135788U JP12135788U JPH0242474U JP H0242474 U JPH0242474 U JP H0242474U JP 12135788 U JP12135788 U JP 12135788U JP 12135788 U JP12135788 U JP 12135788U JP H0242474 U JPH0242474 U JP H0242474U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- section
- circuit board
- board
- mounting section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000002699 waste material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図〜第２図は何れも本発明の実施例を示し
、第１図は本発明によるプリント基板をメインヒ
ートシンクに取付けたものの要部断面図、第２図
ａ〜ｆは本発明によるプリント基板の取付け工程
を示す工程図を示し、第３図は従来例によるプリ
ント基板をメインヒートシンクに取付けたものの
要部断面図である。
１……メインヒートシンク、２……プリント基
板、５，６……パワートランジスタ、１１，１２
……分割部、１３……実装部、１４，１５……捨
て基板部、１６……半田槽。
1 to 2 each show an embodiment of the present invention, FIG. 1 is a cross-sectional view of a main part of a printed circuit board according to the present invention attached to a main heat sink, and FIG. 2 a to f are printed circuit boards according to the present invention. FIG. 3 is a cross-sectional view of a main part of a conventional printed circuit board attached to a main heat sink. 1... Main heat sink, 2... Printed circuit board, 5, 6... Power transistor, 11, 12
... Dividing section, 13... Mounting section, 14, 15... Discarded board section, 16... Solder tank.
Claims (1)
、前記プリント基板上を実装部と捨て基板部とに
分割可能とし、前記プリント基板の実装部には、
複数の電子部品を取付け、かつ該複数の電子部品
のうちの少なくとも一つは電子部品の本体を前記
捨て基板部上に載置し、該電子部品の階段上に折
曲げたリード端子を前記実装部に取付け、半田デ
イツプ後、前記プリント基板の捨て基板部を前記
分割部により前記実装部から切り離したことを特
徴とする電子部品の取付け方法。 A dividing section is formed at an arbitrary location on the printed circuit board, so that the printed circuit board can be divided into a mounting section and a waste board section, and the mounting section of the printed circuit board includes:
A plurality of electronic components are attached, and at least one of the plurality of electronic components has a main body mounted on the disposable board portion, and a bent lead terminal is mounted on the step of the electronic component. 1. A method for attaching an electronic component, comprising: attaching the printed circuit board to the mounting section, and, after soldering, separating the sacrificial board section of the printed circuit board from the mounting section using the dividing section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12135788U JPH0242474U (en) | 1988-09-16 | 1988-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12135788U JPH0242474U (en) | 1988-09-16 | 1988-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242474U true JPH0242474U (en) | 1990-03-23 |
Family
ID=31368292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12135788U Pending JPH0242474U (en) | 1988-09-16 | 1988-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242474U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8153903B2 (en) | 2007-12-07 | 2012-04-10 | Hitachi, Ltd. | Circuit board and image display apparatus |
-
1988
- 1988-09-16 JP JP12135788U patent/JPH0242474U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8153903B2 (en) | 2007-12-07 | 2012-04-10 | Hitachi, Ltd. | Circuit board and image display apparatus |