JPH0241909Y2 - - Google Patents
Info
- Publication number
- JPH0241909Y2 JPH0241909Y2 JP6078985U JP6078985U JPH0241909Y2 JP H0241909 Y2 JPH0241909 Y2 JP H0241909Y2 JP 6078985 U JP6078985 U JP 6078985U JP 6078985 U JP6078985 U JP 6078985U JP H0241909 Y2 JPH0241909 Y2 JP H0241909Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- plate
- circuit board
- circuit boards
- transport
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 230000032258 transport Effects 0.000 description 16
- 238000007650 screen-printing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6078985U JPH0241909Y2 (US06265458-20010724-C00056.png) | 1985-04-23 | 1985-04-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6078985U JPH0241909Y2 (US06265458-20010724-C00056.png) | 1985-04-23 | 1985-04-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177477U JPS61177477U (US06265458-20010724-C00056.png) | 1986-11-05 |
| JPH0241909Y2 true JPH0241909Y2 (US06265458-20010724-C00056.png) | 1990-11-08 |
Family
ID=30588463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6078985U Expired JPH0241909Y2 (US06265458-20010724-C00056.png) | 1985-04-23 | 1985-04-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0241909Y2 (US06265458-20010724-C00056.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258532A (ja) * | 2006-03-24 | 2007-10-04 | Densei Lambda Kk | 基板及びこの基板を用いた生産方式 |
-
1985
- 1985-04-23 JP JP6078985U patent/JPH0241909Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177477U (US06265458-20010724-C00056.png) | 1986-11-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0241909Y2 (US06265458-20010724-C00056.png) | ||
| JPH02234497A (ja) | チップ状電子部品マウント方法及び装置 | |
| JPS6311755Y2 (US06265458-20010724-C00056.png) | ||
| DE3464466D1 (en) | Desoldering set | |
| JPH0715199Y2 (ja) | 両面実装基板の搬送用治具 | |
| JP2592027Y2 (ja) | 混成集積回路部品 | |
| JPS6326340Y2 (US06265458-20010724-C00056.png) | ||
| CN214901460U (zh) | 一种超薄pcb线路板smt贴片用的磁吸装载治具 | |
| JPH083039Y2 (ja) | 位置決めブロックつき吸着ユニット | |
| JPS6333824Y2 (US06265458-20010724-C00056.png) | ||
| JPH0547520Y2 (US06265458-20010724-C00056.png) | ||
| JP2004262529A (ja) | チップテープのチップ装填装置 | |
| JPS60106751A (ja) | プリント基板位置決め装置 | |
| JPS6142782Y2 (US06265458-20010724-C00056.png) | ||
| JPS62146172A (ja) | 電子部品連 | |
| JPH0547519Y2 (US06265458-20010724-C00056.png) | ||
| JPS629253Y2 (US06265458-20010724-C00056.png) | ||
| JP2940206B2 (ja) | 基板位置決め台 | |
| JPH0719175Y2 (ja) | プリント基板 | |
| JPH019979Y2 (US06265458-20010724-C00056.png) | ||
| JPH01161707A (ja) | チップ部品 | |
| JPS59152697A (ja) | テ−ピング電子部品 | |
| JPH0779194B2 (ja) | フレキシブル基板への電気部品の実装方法 | |
| JPH01119100A (ja) | 基板搬送装置 | |
| JP2566087Y2 (ja) | 電子部品搭載装置 |
