JPH0239649Y2 - - Google Patents

Info

Publication number
JPH0239649Y2
JPH0239649Y2 JP1985082561U JP8256185U JPH0239649Y2 JP H0239649 Y2 JPH0239649 Y2 JP H0239649Y2 JP 1985082561 U JP1985082561 U JP 1985082561U JP 8256185 U JP8256185 U JP 8256185U JP H0239649 Y2 JPH0239649 Y2 JP H0239649Y2
Authority
JP
Japan
Prior art keywords
heat
air rod
microcomponents
heat source
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985082561U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61200656U (pm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985082561U priority Critical patent/JPH0239649Y2/ja
Publication of JPS61200656U publication Critical patent/JPS61200656U/ja
Application granted granted Critical
Publication of JPH0239649Y2 publication Critical patent/JPH0239649Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP1985082561U 1985-06-03 1985-06-03 Expired JPH0239649Y2 (pm)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082561U JPH0239649Y2 (pm) 1985-06-03 1985-06-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082561U JPH0239649Y2 (pm) 1985-06-03 1985-06-03

Publications (2)

Publication Number Publication Date
JPS61200656U JPS61200656U (pm) 1986-12-16
JPH0239649Y2 true JPH0239649Y2 (pm) 1990-10-24

Family

ID=30630389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082561U Expired JPH0239649Y2 (pm) 1985-06-03 1985-06-03

Country Status (1)

Country Link
JP (1) JPH0239649Y2 (pm)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4947876A (pm) * 1972-07-16 1974-05-09
JPS5554265A (en) * 1978-10-13 1980-04-21 Fujitsu Ltd Reflow soldering method

Also Published As

Publication number Publication date
JPS61200656U (pm) 1986-12-16

Similar Documents

Publication Publication Date Title
KR101187940B1 (ko) 전자 부품의 리페어 장치, 리페어 방법, 및 리페어용 열전달 캡 부재
NO20022132D0 (no) Fremgangsmåte og anordning for å tilveiebringe en loddet forbindelse
JPH06302948A (ja) 特に集積回路のためのはんだ付け／はんだ剥がし装置
JPH0227970Y2 (pm)
JPH0239649Y2 (pm)
JP2000040712A (ja) ボンディング装置
EP0233125B1 (en) Surface mount technology repair station and method for repair of surface mount technology circuit boards
JPH1041360A (ja) 被加熱対象物の選択的脱着方法
JP2682507B2 (ja) 自動半田付け用プリヒータ装置
JPH0230136Y2 (pm)
JPH0313944B2 (pm)
DE10147789A1 (de) Vorrichtung zum Verlöten von Kontakten auf Halbleiterchips
JP2809207B2 (ja) 半導体装置のリペア方法とリペア装置
JP2001223464A (ja) 半田付け方法
JP3109689B2 (ja) リフロー半田装置
KR102695706B1 (ko) 진공챔버를 구비한 가압 방식의 레이저 리플로우 장치
JP2005159241A (ja) はんだ付け方法及び装置と回路基板の製造方法
JPH11121531A (ja) 電子部品の実装方法および実装装置
JP2004290993A (ja) 部品装着装置
JPH0586313B2 (pm)
JPS566459A (en) Removing method of component carried on printed board
JPH0539826Y2 (pm)
JPS6234665A (ja) 電子部品のハンダ付け装置
JPH0227792A (ja) 電子部品の実装方法
JPH07176549A (ja) ダイボンド装置