JPH0239594B2 - - Google Patents

Info

Publication number
JPH0239594B2
JPH0239594B2 JP58501376A JP50137683A JPH0239594B2 JP H0239594 B2 JPH0239594 B2 JP H0239594B2 JP 58501376 A JP58501376 A JP 58501376A JP 50137683 A JP50137683 A JP 50137683A JP H0239594 B2 JPH0239594 B2 JP H0239594B2
Authority
JP
Japan
Prior art keywords
copper
activator
bath
acid
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58501376A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59500870A (ja
Inventor
Harorudo Eru Roodenaizaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of JPS59500870A publication Critical patent/JPS59500870A/ja
Publication of JPH0239594B2 publication Critical patent/JPH0239594B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP58501376A 1982-05-26 1983-03-02 非伝導性基板活性化触媒溶液および無電解メツキ方法 Granted JPS59500870A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US38194382A 1982-05-26 1982-05-26
US381943 1982-05-26
PCT/US1983/000302 WO1983004268A1 (en) 1982-05-26 1983-03-02 Catalyst solutions for activating non-conductive substrates and electroless plating process

Publications (2)

Publication Number Publication Date
JPS59500870A JPS59500870A (ja) 1984-05-17
JPH0239594B2 true JPH0239594B2 (enrdf_load_stackoverflow) 1990-09-06

Family

ID=23506952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58501376A Granted JPS59500870A (ja) 1982-05-26 1983-03-02 非伝導性基板活性化触媒溶液および無電解メツキ方法

Country Status (5)

Country Link
EP (1) EP0109402B1 (enrdf_load_stackoverflow)
JP (1) JPS59500870A (enrdf_load_stackoverflow)
CA (1) CA1199754A (enrdf_load_stackoverflow)
DE (1) DE3376852D1 (enrdf_load_stackoverflow)
WO (1) WO1983004268A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3637130C1 (de) * 1986-10-31 1987-09-17 Deutsche Automobilgesellsch Verfahren zum chemischen Metallisieren von Textilmaterial
DE69205415T2 (de) * 1992-04-06 1996-05-30 Ibm Verfahren zur Herstellung von katalytisch hochwirksamen Beschichtungen bestehend aus einem Metall der Gruppe der Platinmetalle.
JP4069248B2 (ja) * 2002-12-09 2008-04-02 大阪市 無電解めっき用触媒組成物
CN104593751B (zh) * 2014-12-27 2017-10-17 广东致卓环保科技有限公司 铜表面化学镀镍用超低浓度离子钯活化液及工艺
KR101681116B1 (ko) * 2016-05-26 2016-12-09 (주)오알켐 인쇄 회로 기판의 스루홀을 무전해 동 도금하는 방법 및 그 방법에 사용되는 촉매 용액을 제조하는 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3532518A (en) * 1967-06-28 1970-10-06 Macdermid Inc Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US3562038A (en) * 1968-05-15 1971-02-09 Shipley Co Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited
US3607352A (en) * 1968-11-29 1971-09-21 Enthone Electroless metal plating
US3672938A (en) * 1969-02-20 1972-06-27 Kollmorgen Corp Novel precious metal sensitizing solutions
US3650913A (en) * 1969-09-08 1972-03-21 Macdermid Inc An electroless plating process employing a specially prepared palladium-tin activator solution
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
US3767583A (en) * 1971-08-13 1973-10-23 Enthone Activator solutions their preparation and use in electroless plating of surfaces
US3874897A (en) * 1971-08-13 1975-04-01 Enthone Activator solutions, their preparation and use in electroless plating of surfaces
US3904792A (en) * 1972-02-09 1975-09-09 Shipley Co Catalyst solution for electroless metal deposition on a substrate
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
DE2418654A1 (de) * 1974-04-18 1975-11-06 Langbein Pfanhauser Werke Ag Verfahren zum stromlosen oberflaechenmetallisieren von kunststoffgegenstaenden und fuer die durchfuehrung des verfahrens geeignetes aktivierungsbad
US4008343A (en) * 1975-08-15 1977-02-15 Bell Telephone Laboratories, Incorporated Process for electroless plating using colloid sensitization and acid rinse
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen
US4073981A (en) * 1977-03-11 1978-02-14 Western Electric Company, Inc. Method of selectively depositing metal on a surface
US4182784A (en) * 1977-12-16 1980-01-08 Mcgean Chemical Company, Inc. Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Also Published As

Publication number Publication date
EP0109402A1 (en) 1984-05-30
EP0109402A4 (en) 1984-10-29
EP0109402B1 (en) 1988-06-01
DE3376852D1 (en) 1988-07-07
CA1199754A (en) 1986-01-28
WO1983004268A1 (en) 1983-12-08
JPS59500870A (ja) 1984-05-17

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