JPWO2023218728A1 - - Google Patents

Info

Publication number
JPWO2023218728A1
JPWO2023218728A1 JP2024520264A JP2024520264A JPWO2023218728A1 JP WO2023218728 A1 JPWO2023218728 A1 JP WO2023218728A1 JP 2024520264 A JP2024520264 A JP 2024520264A JP 2024520264 A JP2024520264 A JP 2024520264A JP WO2023218728 A1 JPWO2023218728 A1 JP WO2023218728A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024520264A
Other languages
Japanese (ja)
Other versions
JPWO2023218728A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023218728A1 publication Critical patent/JPWO2023218728A1/ja
Publication of JPWO2023218728A5 publication Critical patent/JPWO2023218728A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
JP2024520264A 2022-05-10 2023-02-24 Pending JPWO2023218728A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022077399 2022-05-10
PCT/JP2023/006627 WO2023218728A1 (ja) 2022-05-10 2023-02-24 パラジウム触媒液

Publications (2)

Publication Number Publication Date
JPWO2023218728A1 true JPWO2023218728A1 (enrdf_load_stackoverflow) 2023-11-16
JPWO2023218728A5 JPWO2023218728A5 (enrdf_load_stackoverflow) 2024-10-24

Family

ID=88729907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024520264A Pending JPWO2023218728A1 (enrdf_load_stackoverflow) 2022-05-10 2023-02-24

Country Status (4)

Country Link
JP (1) JPWO2023218728A1 (enrdf_load_stackoverflow)
CN (1) CN119173651A (enrdf_load_stackoverflow)
TW (1) TW202344713A (enrdf_load_stackoverflow)
WO (1) WO2023218728A1 (enrdf_load_stackoverflow)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518595A (en) * 1978-07-25 1980-02-08 Alfachimici Spa Catalyst solution for nonelectrolytic metal coating
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
JPH06145994A (ja) * 1992-11-09 1994-05-27 Hitachi Chem Co Ltd 選択的無電解ニッケルめっき用触媒溶液及びこの溶液を用いた無電解ニッケルめっき方法
JPH11124680A (ja) * 1997-10-21 1999-05-11 Ebara Udylite Kk 無電解めっき用触媒液
JP2003105550A (ja) * 2001-09-26 2003-04-09 Kyocera Corp 無電解めっき用触媒液
JP2014088618A (ja) * 2012-10-26 2014-05-15 Rohm & Haas Electronic Materials Llc 無電解めっきのための方法およびそのために使用される溶液

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518595A (en) * 1978-07-25 1980-02-08 Alfachimici Spa Catalyst solution for nonelectrolytic metal coating
JPS59500870A (ja) * 1982-05-26 1984-05-17 マツクダ−ミツド　インコ−ポレ−テツド 非伝導性基板活性化触媒溶液および無電解メツキ方法
JPH06145994A (ja) * 1992-11-09 1994-05-27 Hitachi Chem Co Ltd 選択的無電解ニッケルめっき用触媒溶液及びこの溶液を用いた無電解ニッケルめっき方法
JPH11124680A (ja) * 1997-10-21 1999-05-11 Ebara Udylite Kk 無電解めっき用触媒液
JP2003105550A (ja) * 2001-09-26 2003-04-09 Kyocera Corp 無電解めっき用触媒液
JP2014088618A (ja) * 2012-10-26 2014-05-15 Rohm & Haas Electronic Materials Llc 無電解めっきのための方法およびそのために使用される溶液

Also Published As

Publication number Publication date
TW202344713A (zh) 2023-11-16
CN119173651A (zh) 2024-12-20
WO2023218728A1 (ja) 2023-11-16

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