JPS5518595A - Catalyst solution for nonelectrolytic metal coating - Google Patents
Catalyst solution for nonelectrolytic metal coatingInfo
- Publication number
- JPS5518595A JPS5518595A JP9251979A JP9251979A JPS5518595A JP S5518595 A JPS5518595 A JP S5518595A JP 9251979 A JP9251979 A JP 9251979A JP 9251979 A JP9251979 A JP 9251979A JP S5518595 A JPS5518595 A JP S5518595A
- Authority
- JP
- Japan
- Prior art keywords
- nonelectrolytic
- metal coating
- catalyst solution
- catalyst
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003054 catalyst Substances 0.000 title 1
- 239000011248 coating agent Substances 0.000 title 1
- 238000000576 coating method Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT68768/78A IT1107840B (en) | 1978-07-25 | 1978-07-25 | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5518595A true JPS5518595A (en) | 1980-02-08 |
Family
ID=11310525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9251979A Pending JPS5518595A (en) | 1978-07-25 | 1979-07-20 | Catalyst solution for nonelectrolytic metal coating |
Country Status (6)
Country | Link |
---|---|
US (1) | US4244739A (en) |
JP (1) | JPS5518595A (en) |
DE (1) | DE2928699A1 (en) |
FR (1) | FR2432055A1 (en) |
GB (1) | GB2025782B (en) |
IT (1) | IT1107840B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04365876A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base selecting electroless plating |
JP2004513229A (en) * | 2000-11-01 | 2004-04-30 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for electroless metal plating |
JP2004190066A (en) * | 2002-12-09 | 2004-07-08 | Yutaka Fujiwara | Catalyst composition for electroless plating |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3376852D1 (en) * | 1982-05-26 | 1988-07-07 | Macdermid Inc | Catalyst solutions for activating non-conductive substrates and electroless plating process |
US4863758A (en) * | 1982-05-26 | 1989-09-05 | Macdermid, Incorporated | Catalyst solutions for activating non-conductive substrates and electroless plating process |
US4741786A (en) * | 1986-06-10 | 1988-05-03 | Stanadyne, Inc. | Cold drawn free-machining steel bar including bismuth |
US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
US5391395A (en) * | 1992-12-30 | 1995-02-21 | Witco Corporation | Method of preparing substrates for memory disk applications |
EP1162289A1 (en) * | 2000-06-08 | 2001-12-12 | Lucent Technologies Inc. | Palladium electroplating bath and process for electroplating |
AU2001294928A1 (en) * | 2000-11-06 | 2002-05-15 | Macdermid, Incorporated | Catalyst solutions useful in activating substrates for subsequent plating |
US20020062760A1 (en) * | 2000-11-06 | 2002-05-30 | Ronald Redline | Catalyst solutions useful in activating substrates for subsequent plating |
US6645557B2 (en) | 2001-10-17 | 2003-11-11 | Atotech Deutschland Gmbh | Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions |
US20050170650A1 (en) * | 2004-01-26 | 2005-08-04 | Hongbin Fang | Electroless palladium nitrate activation prior to cobalt-alloy deposition |
US8585811B2 (en) * | 2010-09-03 | 2013-11-19 | Omg Electronic Chemicals, Llc | Electroless nickel alloy plating bath and process for depositing thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3650913A (en) * | 1969-09-08 | 1972-03-21 | Macdermid Inc | An electroless plating process employing a specially prepared palladium-tin activator solution |
US3682671A (en) * | 1970-02-05 | 1972-08-08 | Kollmorgen Corp | Novel precious metal sensitizing solutions |
US3874882A (en) * | 1972-02-09 | 1975-04-01 | Shipley Co | Catalyst solution for electroless deposition of metal on substrate |
-
1978
- 1978-07-25 IT IT68768/78A patent/IT1107840B/en active
-
1979
- 1979-07-10 FR FR7917824A patent/FR2432055A1/en active Granted
- 1979-07-10 US US06/056,398 patent/US4244739A/en not_active Expired - Lifetime
- 1979-07-11 GB GB7924130A patent/GB2025782B/en not_active Expired
- 1979-07-16 DE DE19792928699 patent/DE2928699A1/en active Granted
- 1979-07-20 JP JP9251979A patent/JPS5518595A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04365876A (en) * | 1991-06-13 | 1992-12-17 | Ishihara Chem Co Ltd | Catalyst liquid for copper base selecting electroless plating |
JP2004513229A (en) * | 2000-11-01 | 2004-04-30 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Method for electroless metal plating |
JP2004190066A (en) * | 2002-12-09 | 2004-07-08 | Yutaka Fujiwara | Catalyst composition for electroless plating |
Also Published As
Publication number | Publication date |
---|---|
GB2025782B (en) | 1983-04-27 |
DE2928699A1 (en) | 1980-02-07 |
US4244739A (en) | 1981-01-13 |
DE2928699C2 (en) | 1988-03-24 |
IT1107840B (en) | 1985-12-02 |
FR2432055B1 (en) | 1981-12-04 |
GB2025782A (en) | 1980-01-30 |
IT7868768A0 (en) | 1978-07-25 |
FR2432055A1 (en) | 1980-02-22 |
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