JPH0238514Y2 - - Google Patents
Info
- Publication number
- JPH0238514Y2 JPH0238514Y2 JP2682184U JP2682184U JPH0238514Y2 JP H0238514 Y2 JPH0238514 Y2 JP H0238514Y2 JP 2682184 U JP2682184 U JP 2682184U JP 2682184 U JP2682184 U JP 2682184U JP H0238514 Y2 JPH0238514 Y2 JP H0238514Y2
- Authority
- JP
- Japan
- Prior art keywords
- shield
- shield member
- distance
- circuit
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 5
- 230000010355 oscillation Effects 0.000 description 16
- 230000005855 radiation Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Receivers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2682184U JPS60139345U (ja) | 1984-02-27 | 1984-02-27 | 高周波シ−ルド装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2682184U JPS60139345U (ja) | 1984-02-27 | 1984-02-27 | 高周波シ−ルド装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60139345U JPS60139345U (ja) | 1985-09-14 |
JPH0238514Y2 true JPH0238514Y2 (US06633600-20031014-M00021.png) | 1990-10-17 |
Family
ID=30523187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2682184U Granted JPS60139345U (ja) | 1984-02-27 | 1984-02-27 | 高周波シ−ルド装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60139345U (US06633600-20031014-M00021.png) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5148189B2 (ja) * | 2007-07-20 | 2013-02-20 | 株式会社東芝 | 高周波電力増幅モジュール |
JP5430451B2 (ja) * | 2010-03-09 | 2014-02-26 | 三菱電機株式会社 | 高周波パッケージ |
-
1984
- 1984-02-27 JP JP2682184U patent/JPS60139345U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60139345U (ja) | 1985-09-14 |
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