JPH0238446Y2 - - Google Patents
Info
- Publication number
- JPH0238446Y2 JPH0238446Y2 JP1981122445U JP12244581U JPH0238446Y2 JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2 JP 1981122445 U JP1981122445 U JP 1981122445U JP 12244581 U JP12244581 U JP 12244581U JP H0238446 Y2 JPH0238446 Y2 JP H0238446Y2
- Authority
- JP
- Japan
- Prior art keywords
- die
- semiconductor element
- pad
- bonding
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910015365 Au—Si Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12244581U JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12244581U JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5827935U JPS5827935U (ja) | 1983-02-23 |
JPH0238446Y2 true JPH0238446Y2 (ko) | 1990-10-17 |
Family
ID=29916366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12244581U Granted JPS5827935U (ja) | 1981-08-18 | 1981-08-18 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5827935U (ko) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58127338A (ja) * | 1982-01-25 | 1983-07-29 | Sharp Corp | 電子部品の構造 |
JPS6122728U (ja) * | 1984-07-16 | 1986-02-10 | 株式会社吉野工業所 | 容器 |
US10413284B2 (en) | 2006-11-07 | 2019-09-17 | Corvia Medical, Inc. | Atrial pressure regulation with control, sensing, monitoring and therapy delivery |
US20110257723A1 (en) | 2006-11-07 | 2011-10-20 | Dc Devices, Inc. | Devices and methods for coronary sinus pressure relief |
US8752258B2 (en) | 2006-11-07 | 2014-06-17 | Dc Devices, Inc. | Mounting tool for loading a prosthesis |
US8882697B2 (en) | 2006-11-07 | 2014-11-11 | Dc Devices, Inc. | Apparatus and methods to create and maintain an intra-atrial pressure relief opening |
US10624621B2 (en) | 2006-11-07 | 2020-04-21 | Corvia Medical, Inc. | Devices and methods for the treatment of heart failure |
US9232997B2 (en) | 2006-11-07 | 2016-01-12 | Corvia Medical, Inc. | Devices and methods for retrievable intra-atrial implants |
CA2785041A1 (en) | 2010-01-29 | 2011-08-04 | Dc Devices, Inc. | Devices and methods for reducing venous pressure |
US20130178784A1 (en) | 2011-12-22 | 2013-07-11 | Dc Devices, Inc. | Methods and devices for intra-atrial shunts having adjustable sizes |
US10675450B2 (en) | 2014-03-12 | 2020-06-09 | Corvia Medical, Inc. | Devices and methods for treating heart failure |
JP6799526B2 (ja) | 2014-07-23 | 2020-12-16 | コルヴィア メディカル インコーポレイテッド | 心不全の治療のための装置及び方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150251A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
-
1981
- 1981-08-18 JP JP12244581U patent/JPS5827935U/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55150251A (en) * | 1979-05-11 | 1980-11-22 | Hitachi Ltd | Semiconductor device |
JPS5797634A (en) * | 1980-12-11 | 1982-06-17 | Canon Inc | Hybrid integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
JPS5827935U (ja) | 1983-02-23 |
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