JPH0237814A - Delay element and it manufacture - Google Patents

Abstract

PURPOSE:To attain miniaturization by facing ground patterns in the direction of exposing the ground pattern of a corner part opposite to the one whose base is excised, pasting them, connecting and fixing a ground terminal to the ground pattern of the part exposed in the excised part. CONSTITUTION:A first substrate 21 has a zigzag delay line pattern 26 on a surface 25 of a ceramic substrate main body 23 having a form that the right- lower corner part is excised like a circular arc (24 shows the excised part) from the rectangle of a length L3 and a width W3, and has a ground pattern 28 on the almost whole surface of a rear face 27. A second substrate 22 has the same structure as the first substrate 21, the second substrate is turned at 180 deg. and the rear faces 27 and 27a are pasted oppositely. Ground terminals 35 and 35a are connected and fixed to the parts of the ground patterns 28 and 28a. Thus, the connecting and fixing places of the ground terminals can be ensured, the length of the delay line patterns can be lengthened and the miniaturization can be attained.

Description

[Detailed Description of the Invention] [Summary] The present invention relates to a distributed constant type delay element formed by bonding substrates having a delay line pattern and a method for manufacturing the same. A first substrate including a substrate body with a cut-off portion, a delay line pattern on the front surface, and a ground pattern on the back side; a substrate body with a corner portion on the bottom side cut off; A second board consisting of the delay line pattern on the front surface and the 7-strip pattern on the back surface is connected to the ground pattern at the corner of the other board opposite to the cut out side of the bottom side of the other board from each cutout part. The earth patterns are pasted together in an exposed direction, and the earth terminal is connected and fixed to the portion of the earth pattern exposed in the cutout.

[Industrial application field]

The invention has a delay line pattern! The present invention relates to a distributed constant type delay element formed by bonding 8 roots together and a method for manufacturing the same.

In communication devices using digital signals, a distributed constant type "element f" is used to adjust timing between signals and to adjust delays caused by components and patterns.

If the desired delay time is, for example, 2 ms or more, one substrate having a delay line pattern is not sufficient, and the delay element is constructed by bonding two substrates each having a delay line pattern. Ru.

This delay element is also desired to be miniaturized like other electronic components.

[Conventional technology]

FIGS. 11 to 13 each show a conventional distributed constant type delay element 1. FIG.

This delay element 1 has a delay line pattern 2 on one side as shown in FIG. A first substrate 4 having a ground pattern 3 on one side on the other side, and a delay line pattern 5 on one side as shown in FIG. A second substrate 7 having a full-surface ground pattern 6 on the other surface is bonded together on the ground planes, and has a delay line pattern 2.5.
is connected by strap 8゜9, and input/output terminal 1
0.11 and a pair of ground terminals 12 and 13 extend downward.

The delay time is determined by the total length of delay line patterns 2 and 5.

[Problem to be solved by the invention]

The first substrate 4 has a length of 1-1+width Wl, and the second substrate 7 has a length of 121 and a width of Wl.

The length L2 of the second substrate 7 is equal to L+, but the width W2 is shorter than Wl so as to avoid the connecting portions of the terminals 10 to 13.

Therefore, the area of the second substrate 7 is small and the delay line pattern 5
It is difficult to make the length long.

Therefore, in order to make the total of delay line patterns 2 and 5 a predetermined length, the length of delay line pattern 2 must be increased by the amount that width W2 of second substrate 7 is narrowed and delay line pattern 5 cannot be made longer. In order to achieve this, it was necessary to increase the size of the first substrate 4, which hindered miniaturization of the delay element 1.

An object of the present invention is to provide a delay element that can be miniaturized and a method for manufacturing the same.

[Means to solve the problem]

The present invention provides a first substrate including a substrate main body having a shape in which one corner on the bottom side is cut off, a delay line pattern on the front surface of this substrate, and a ground pattern on the back side, and one corner on the bottom side. A second board consisting of a main board with a cutout shape, a delay line pattern on this surface, and a ground pattern with a flat surface is connected to the bottom cut side of the other board from each cutout part. has a configuration in which the ground patterns are butted together and pasted together in such a direction that the ground pattern at the opposite corner is exposed, and the ground terminal is connected and fixed to the ground pattern at the part exposed in the cutout. It is characterized by being

[Effect]

The corner of the board body is originally a part where a delay line pattern is not formed, so even if one corner of the base side of the board body is cut off, the delay line pattern will have substantially the same length as without the cutout. is formed. Since both of the pair of substrates are this substrate, the total quality of the delay line pattern becomes longer.

As a result, a device with the same delay time becomes smaller than the conventional device.

〔Example〕

1 to 3 each show a distributed constant type delay element 20 according to a first embodiment of the present invention.

The delay element 20 includes a first substrate 21 and a fifth substrate shown in FIG.
It has a structure in which the second substrate 22 shown in the figure is bonded together.

As shown in FIG. 4, the first substrate 21 has a length L3. A ceramic substrate main body 23 having a shape in which one lower right corner of a rectangle with a width W3 is cut out in an arc shape (24 indicates the cutout part).
has a zigzag delay line pattern 26 on the surface 25 of
This configuration has a ground pattern 28 on substantially the entire surface of the back surface 27.

The delay line pattern 26 has pads 29 and 30 at both ends. The pad 29 is arranged behind the upper side 31 of the substrate body 23 at a position that coincides with the center line 32 in the length direction of the substrate body 23. Another pad 30 is arranged at a portion of the bottom side 33 of the substrate body 23 that is deviated by a dimension e1 from the center line 32 toward the cutout portion 24 side.

Reference numeral 34 denotes an input/output terminal, which is electrically connected to the pad 29 and is fixed to protrude from the bottom side 33.

Reference numeral 35 denotes a ground terminal, which is electrically connected to the ground pattern 28 at a portion of the bottom side 33 opposite to the cutout portion 24, and is fixed so as to protrude from the bottom side 33.

The second substrate 22 has the configuration shown in FIG. 5, and has exactly the same configuration as the first substrate 21 shown in FIG. 4. Corresponding parts are denoted by the same reference numerals with the suffix a, and their explanations will be omitted.

The ceramic substrate body 23a has the same size as the ceramic substrate body 23.

The first substrate 21 and the second substrate 22 having the above configuration are the fifth substrate.
The second substrate 22 is aligned with the center line 32 as shown by the arrow 36 in the figure.
Rotate 180 degrees about a, back side 27.27afii
It is a combination of aspirations and aspirations.

The ground terminal 35 is connected to the cutout portion 24a as shown in FIG.
It is exposed to.

Another ground terminal 35a is exposed in the cutout 24, as shown in FIG.

That is, the cutout portion 24.2 of the earth pattern 28.28a
The corner portions on the opposite side of 48 are cut out portions 24a, 24, respectively.
The ground terminals 35 and 35a are respectively connected and fixed to the exposed ground pattern portions.

The input/output terminals 34.34a are located symmetrically with respect to the center line 32.32a.

The pads 29 and 29a are located at corresponding positions on both sides of the bonded substrates 21 and 22, and the strap 3 is placed between them.
6 is used for wiring.

A delay line pattern 2 is provided between the input/output terminals 34 and 348.
6.26a is connected via strap 37,
Delay element 20 has a delay time corresponding to the total length of delay line patterns 26 and 26a.

As shown in FIG. 4, one corner of the substrate 23 is cut away, but this cutout 24 is small, and the area of the surface 25 of the substrate 23 is approximately the same as that without the cutout 24. Furthermore, corners are places where it is difficult to form delay line patterns.

Therefore, the length of the delay line pattern 26 is approximately the same as the length of the vine delay line pattern formed on the substrate without the cutout portion 24, which is good.

The substrate 23a shown in FIG. 5 has the same size and shape as the substrate 23 described above, and the delay line pattern 26a is also longer.

As a result, the delay element 20 has approximately the same delay time as a structure in which substrates without the cutout portions 24.24a are bonded together.

Therefore, a delay line pattern having a length to obtain a predetermined delay time can be formed into a delay element smaller in size than the conventional one, and the delay element 20 becomes smaller than the conventional one.

Furthermore, assuming that the delay element 20 having the above configuration has the same size as the conventional one, the delay time will be longer than that of the conventional one.

In addition, each of the boards 21 and 22 has one input/output terminal 34 and 34.
a, the delay line pattern 26.degree. 26a only needs to be connected at one location, and the delay element 20 is easier to assemble and has higher reliability than the conventional delay element 20, which has 24 locations.

Figure 6 is 1. It is a figure explaining the board|substrate removal of 2nd board|substrate 21.22.

1st. The substrate is rationally removed from the second substrate ceramic original substrate 40 as shown in FIG. In FIG. 6, the same components as those shown in FIGS. 4 and 5 are designated by the same reference numerals.

Among a pair of substrates located in one diagonal direction around the central circular hole 41, one substrate 42 constitutes the first substrate 21, and another substrate 43 constitutes the second substrate 22. Among a pair of substrates located in another diagonal direction, one substrate 44 constitutes the first substrate 21, and another substrate 45 constitutes the second substrate 2.
2.

The circular hole 41 constitutes the cutout 24.24a.

FIG. 7 shows a distributed constant delay element 50 according to a second embodiment of the present invention.
shows.

This delay element 50 has the same structure as the delay element 20 of the first embodiment except that the cutout portion 51.51a is triangular, and in FIG. 7, the portion corresponding to the component not shown in FIG. are given the same reference numerals, and their explanation will be omitted.

The delay element 50 has a structure in which a second substrate 53 shown in FIG. 9 is attached to the back surface of a first substrate 52 shown in FIG. 8 by rotating it by 180 degrees as shown by an arrow 54.

The substrates 52 and 53 are removed as shown in FIG.

The substrate 55 constitutes the first substrate 52 and the substrate 56 constitutes the second substrate 53. The central diamond-shaped hole 57 forms the above-mentioned cutout 51.51a.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to secure a fixed place for connecting the ground terminal, and to increase the length of the delay line pattern. It can be configured to be smaller than the conventional one.

Conversely, if +ll tin is the same, the delay time can be made longer than the conventional one.

Also, 1st. Since the second board is cut from the same board, it is easier to manufacture and the manufacturing cost is lower than when the second board is cut from separate boards.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a delay element according to a first embodiment of the present invention, FIG. 2 is a side view of the delay element of FIG. 1, and FIG. 3 is a perspective view of the delay element of FIG. 1 as seen from the back side. FIG. 4 is a perspective view of the first substrate, FIG. 5 is a perspective view of the second substrate, FIG. 6 is a diagram explaining how to remove the substrate, and FIG. 7 is a delay element according to a second embodiment of the present invention. FIG. 8 is a perspective view of the first substrate, FIG. 9 is a perspective view of the second substrate, FIG. 10 is a diagram explaining how to remove the substrate, and FIG. 11 is a perspective view of a conventional delay element. , FIG. 12 is a perspective view of the delay element shown in FIG. 11 seen from the back side, FIG. 13 is a side view of the delay element shown in FIG. 11, FIG. 14 is a perspective view of the first substrate, and FIG. 15 is a perspective view of the second substrate. FIG. In the figure, 20.50 is a distributed constant delay element, 21.52 is the first substrate, 22.53 is the second substrate, 23 is the ceramic substrate body, 24 is the cutout, 25 is the surface, and 26 is the delay line. Pattern, 27 is the back, 28 is the ground pattern, 29.30 is the pad, 31 is the top, 32 is the center line, 33 is the bottom, 34 is the input/output terminal, 35 is the ground terminal, plate! P 1,000 convergence type shadow 1 child @ 1 Figure n 37 is the strap, 40 is the ceramic original substrate, 41 is the center circular hole, 42 to 45, 55, 56 are the substrate, 5o is the distributed constant type delay element, 57 is the center Showing rhombic holes.

Claims (2)

[Claims] (1) A board body (23) with one corner cut off on the bottom side (33), a delay line pattern (26) on this front surface (25), and a ground pattern (28) on this back surface (27).
); a substrate main body (23a) having one corner cut off on the bottom side (33a);
A second substrate (22) consisting of a delay line pattern (26a) on the front surface (25a) and a ground pattern (28a) on the back surface (27a) is connected to each cutout portion (24, 24a).
The ground patterns (28a, 28) at the corner of the other board opposite to the side where the bottom side has been cut out are exposed, and the ground patterns are butted against each other and bonded together;
In addition, the ground terminal (35, 35a) is connected to the cutout part (24a).
, 24) of the exposed part of the earth pattern (28,
A delay element characterized in that it is connected to and fixed to 28a). (2) A board body (23) with one corner cut off on the bottom side (33), a delay line pattern (26) on this front surface (25), and a ground pattern (28) on this back surface (27).
); a substrate main body (23a) having one corner cut off on the bottom side (33a);
A second substrate (22) consisting of the delay line pattern (26a) on the front surface (25a) and the ground pattern (28a) on the back surface (27a) is cut out from the same substrate, respectively. ) are facing each other, the first substrate (21) and the second substrate (22) are removed from the other substrate from each cutout part (24, 24a). The ground pattern (28a,
28) are exposed, and the ground patterns are butted together and bonded together, and the ground terminals (35, 35a) are connected to the ground patterns (28, 28a) in the portions exposed in the cutout portions (24a, 24). 1. A method for manufacturing a delay element, characterized in that the delay element is fixed in place.