JPH0237098B2 - - Google Patents

Info

Publication number
JPH0237098B2
JPH0237098B2 JP57004705A JP470582A JPH0237098B2 JP H0237098 B2 JPH0237098 B2 JP H0237098B2 JP 57004705 A JP57004705 A JP 57004705A JP 470582 A JP470582 A JP 470582A JP H0237098 B2 JPH0237098 B2 JP H0237098B2
Authority
JP
Japan
Prior art keywords
bonding
wire
capillary
semiconductor substrate
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57004705A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58122743A (ja
Inventor
Chikara Ootsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP57004705A priority Critical patent/JPS58122743A/ja
Publication of JPS58122743A publication Critical patent/JPS58122743A/ja
Publication of JPH0237098B2 publication Critical patent/JPH0237098B2/ja
Granted legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP57004705A 1982-01-14 1982-01-14 ワイヤ・ボンデイング方法 Granted JPS58122743A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57004705A JPS58122743A (ja) 1982-01-14 1982-01-14 ワイヤ・ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57004705A JPS58122743A (ja) 1982-01-14 1982-01-14 ワイヤ・ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58122743A JPS58122743A (ja) 1983-07-21
JPH0237098B2 true JPH0237098B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-08-22

Family

ID=11591289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57004705A Granted JPS58122743A (ja) 1982-01-14 1982-01-14 ワイヤ・ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58122743A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529975B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-10-18 1977-03-19
JPS5115379A (en) * 1974-07-29 1976-02-06 Nippon Electric Co Handotaitoriidono setsuzokushikensochi
JPS55117843U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1979-02-13 1980-08-20

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JPS58122743A (ja) 1983-07-21

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